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Winbond Electronics Corporation W25Q128BVFJG

Part No.:
W25Q128BVFJG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25Q128BVFJG.pdf
Description:
IC FLASH 128MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,901

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Product details

Overview

W25Q128BVFJG from Winbond is a 128M-bit (16MB) serial NOR flash memory with Dual/Quad SPI interface, organized into 65,536 pages of 256 bytes each and supporting 4KB sector, 32KB block, 64KB block, and chip erase. It operates from 2.7V to 3.6V, draws 4mA active current and <1µA in power-down mode, and delivers up to 35MB/s continuous read throughput via Fast Read Quad I/O (EBh). It is used for code storage, XIP execution, and firmware updates in embedded microcontrollers and IoT edge devices.

For engineers reviewing the W25Q128BVFJG datasheet, W25Q128BVFJG pinout, W25Q128BVFJG application, or W25Q128BVFJG equivalent, key selection criteria include Quad SPI timing compliance (70MHz clock, 280MHz equivalent), hardware write protection via /WP and /HOLD pins, JEDEC ID and SFDP register support, 4KB sector granularity, and compatibility with standard, dual, and quad SPI instruction sets including EBh, 6Bh, and BBh.

Technical Context

The W25Q128BVFJG implements a SPI command-and-control logic architecture with dedicated page buffer, status register management (SR1/SR2), and high-voltage generators for erase/program operations. It supports SPI modes 0 and 3, with configurable Quad Enable (QE) bit in Status Register-2 required to activate IO2 (/WP) and IO3 (/HOLD) for Quad I/O instructions.

Its flexible erase hierarchy includes uniform 4KB sectors (4,096 total), 32KB blocks (2,048), and 64KB blocks (256), enabling precise data partitioning. Erase/program suspend/resume capability allows background operation interruption without data loss - critical for real-time firmware update scenarios where host CPU must service interrupts mid-operation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 128 M-bit (16 MB), enabling full MCU boot image + OTA firmware storage in single device
Page Size 256 bytes per programmable page - matches typical cache line and DMA burst sizes for efficient writes
Erasing Granularity 4 KB sectors (4,096 units), allowing fine-grained parameter/data partitioning without over-erasing code regions
Quad SPI Clock Rate 70 MHz max - enables 280 MHz equivalent bandwidth using 4-bit I/O, sufficient for real-time XIP of medium-complexity firmware
Power Supply Range 2.7 V to 3.6 V - compatible with 3.3 V LDO rails and tolerant of brown-out conditions down to 2.7 V
Active Current 4 mA typical at 104 MHz - supports low-power MCU subsystems without thermal derating
Data Retention 20+ years - validated for industrial temperature range (-40°C to +85°C), suitable for unattended field deployments
Endurance 100,000 program/erase cycles - exceeds requirements for firmware update logs and configuration storage

Pinout & Package

W25Q128BVFJG is packaged in an 8-pad WSON 8×6 mm (Package Code E), with exposed pad for thermal dissipation and space-constrained PCB layouts.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable signal; must transition high→low after power-up before first instruction; controls DO high-impedance state
2 DO (IO1) Data Output / Bidirectional I/O1 Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI; used for read data and status feedback
3 /WP (IO2) Write Protect Input / Bidirectional I/O2 Hardware lock for Status Register when QE=0; becomes IO2 in Quad SPI (QE=1); active-low protection
4 GND Ground Reference Primary return path for all I/O and core logic; requires low-impedance connection to minimize noise coupling
5 DI (IO0) Data Input / Bidirectional I/O0 Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI; carries instructions, addresses, and write data
6 CLK Serial Clock Input Synchronous timing reference for all SPI transfers; supports Mode 0 and Mode 3; max 104 MHz in Dual SPI
7 /HOLD (IO3) Hold Input / Bidirectional I/O3 Pauses ongoing SPI transaction when active-low; disabled in Quad SPI (becomes IO3); preserves internal state during bus sharing
8 VCC Power Supply Single 2.7–3.6 V supply; decoupling capacitor (≥1 µF) required near pin for stable erase/program voltage generation

Key Features

Feature Design Value
Quad SPI with QE bit control Status Register-2 Quad Enable (QE) bit must be set to repurpose /WP and /HOLD as IO2/IO3 - ensures intentional mode transition and avoids accidental misconfiguration
Continuous Read Mode As few as 8 clocks overhead to address memory; enables true XIP execution with minimal instruction fetch latency, outperforming parallel flash in footprint-constrained designs
Erase/Program Suspend & Resume Allows host to pause erase or program operations (e.g., during interrupt handling) and resume from exact point - eliminates need for full re-attempt or external buffering
64-bit Unique Serial Number Factory-programmed per-device identifier accessible via 4Bh instruction - enables secure device binding, anti-cloning, and firmware version tracking in production
SFDP Register Support JEDEC JESD216-compliant Serial Flash Discoverable Parameters register provides runtime-configurable timing, density, and feature flags - simplifies bootloader portability across flash vendors
Security Registers (3 × 256B) OTP-lockable regions for storing cryptographic keys or calibration data; protected by LB1–LB3 bits - prevents overwrite while permitting read access post-lock

Applications

Firmware Storage for MCU Boot Secure OTA Firmware Updates

Use Scenario: Storing boot code, bootloader, and application firmware for ARM Cortex-M or RISC-V microcontrollers during cold start and reset sequences.

IC Role / Device Role / Timing Role: Primary non-volatile code storage device interfaced directly to MCU's Quad SPI peripheral; provides deterministic read latency for XIP execution.

Use Value: 4KB sector granularity enables independent erasure of application firmware without affecting bootloader or configuration sectors - reducing update time and risk of bricking.

Use Scenario: Hosting delta firmware patches and full images downloaded over BLE/Wi-Fi/Ethernet for field-deployed IoT gateways and industrial controllers.

IC Role / Device Role / Timing Role: Dual-role storage: holds active firmware in one region and incoming update in another; leverages suspend/resume for atomic swap during critical sections.

Use Value: 100,000 erase/program cycles and 20-year retention ensure reliable multi-year update cycles without wear leveling firmware overhead.

Audio/Configuration Data Logging Industrial HMI Display Memory

Use Scenario: Recording sensor calibration data, device serial logs, or short audio prompts in medical wearables and smart home hubs.

IC Role / Device Role / Timing Role: Parameter storage peripheral accessed via standard SPI; uses /WP pin for hardware lock during power transitions to prevent corruption.

Use Value: Hardware write protection (via /WP + BP bits) and power-down current <1 µA allow safe logging during battery-backed sleep states.

Use Scenario: Storing GUI assets (fonts, icons, splash screens) and localized language strings for touch-enabled HMIs in factory automation panels.

IC Role / Device Role / Timing Role: High-bandwidth Quad SPI memory mapped to display controller's external memory interface; delivers >30 MB/s burst reads for smooth UI rendering.

Use Value: 35 MB/s continuous transfer rate via Fast Read Quad I/O (EBh) eliminates frame stutter during asset loading - critical for responsive operator interfaces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L12833FZC-10G 128 M-bit, 104 MHz max clock, same 8-pin WSON package, but lacks SFDP register and has no OTP security registers Supports basic XIP and firmware storage but not secure key storage or auto-negotiated timing initialization Choose when cost sensitivity outweighs need for JEDEC SFDP or cryptographic key isolation
S25FL128SAGMFI000 128 M-bit, 80 MHz Quad SPI, 24-ball BGA only (no WSON), includes on-die ECC and 4-byte addressing mode enabled by default Requires PCB redesign for BGA; ECC improves reliability in high-radiation environments but adds latency overhead Choose for automotive-grade reliability where ECC and AEC-Q100 qualification are mandatory

Compared with MX25L12833FZC-10G and S25FL128SAGMFI000, the W25Q128BVFJG uniquely balances Quad SPI performance, 4KB sector flexibility, SFDP runtime configurability, and integrated security registers - making it optimal for cost-sensitive yet feature-rich embedded systems requiring field-upgradable firmware and tamper-resistant data storage.

Availability

W25Q128BVFJG is available at Aetrix Electronics and suitable for firmware storage, secure OTA updates, and industrial HMI display memory requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.

Supply support for W25Q128BVFJG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including serial flash, PSRAM, and mobile DRAM, serving industrial, communications, and consumer markets since 1987.

The W25Q series targets embedded systems requiring high-speed, low-pin-count non-volatile storage with robust firmware integrity - designed specifically for code shadowing, XIP execution, and secure parameter retention in resource-constrained MCUs.

FAQ

What is the package type and pin count of the W25Q128BVFJG?

The W25Q128BVFJG uses an 8-pad WSON 8×6 mm package (Package Code E) with pins: /CS, DO (IO1), /WP (IO2), GND, DI (IO0), CLK, /HOLD (IO3), and VCC. This compact footprint supports high-density PCB layouts and eliminates lead-free soldering concerns associated with SOIC or BGA variants.

Does the W25Q128BVFJG support execute-in-place (XIP) operation?

Yes, the W25Q128BVFJG supports true XIP via Continuous Read Mode with as few as 8 clocks of instruction overhead per 24-bit address. When used with Fast Read Quad I/O (EBh) at 70 MHz, it delivers up to 35 MB/s sustained throughput - sufficient for direct execution of ARM Thumb-2 or RISC-V code without RAM copying.

How is Quad SPI mode enabled on the W25Q128BVFJG?

Quad SPI mode is enabled by setting the Quad Enable (QE) bit in Status Register-2 using the Write Status Register (01h) instruction. Once QE = 1, the /WP and /HOLD pins become IO2 and IO3 respectively; standard SPI and Dual SPI functions are disabled until QE is cleared.

What write protection mechanisms does the W25Q128BVFJG provide?

The W25Q128BVFJG offers layered write protection: hardware-level via active-low /WP pin, software-level via Block Protect (BP2–BP0), Top/Bottom (TB), and Security Register Lock (LB1–LB3) bits, and volatile/non-volatile status register locking via SRP0/SRP1. These can be combined to protect individual 4KB sectors or the entire array.

Is the W25Q128BVFJG compatible with JEDEC-standard identification protocols?

Yes, the W25Q128BVFJG supports JEDEC-standard Manufacturer and Device ID (90h/92h/94h), JEDEC ID (9Fh), and SFDP Register (5Ah) read commands. Its 64-bit Unique ID (4Bh) and SFDP table enable automated bootloader configuration and vendor-agnostic flash initialization.

W25Q128BVFJG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25Q128BVFJG FAQ

1.How can I place an order for W25Q128BVFJG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q128BVFJG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q128BVFJG reliable?

The price and inventory of W25Q128BVFJG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q128BVFJG is usually 5 days.

3.What payment methods are accepted for W25Q128BVFJG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q128BVFJG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q128BVFJG?

W25Q128BVFJG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q128BVFJG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q128BVFJG?

For technical support, including W25Q128BVFJG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q128BVFJG requirements.

6.How does Aetrix verify that W25Q128BVFJG is sourced from the original manufacturer or authorized distributors?

All W25Q128BVFJG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q128BVFJG meets industry standards.

7.What is the process for return or replacement of W25Q128BVFJG?

All W25Q128BVFJG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q128BVFJG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q128BVFJG part is unused and in its original packaging.

Return procedure for W25Q128BVFJG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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