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Winbond Electronics Corporation W25Q128BVFJP

Part No.:
W25Q128BVFJP
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25Q128BVFJP.pdf
Description:
IC FLASH 128MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,023

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Product details

Overview

W25Q128BVFJP from Winbond is a 128M-bit (16MB) serial NOR flash memory with Dual/Quad SPI interface, organized into 65,536 pages of 256 bytes each and supporting 4KB sector, 32KB block, 64KB block, and chip erase. It operates on a single 2.7–3.6V supply, draws 4mA active current and <1µA in power-down mode, and delivers up to 35MB/s continuous read throughput via Fast Read Quad I/O (EBh). It is used for code shadowing, XIP execution, and firmware storage in embedded microcontrollers.

For engineers reviewing the W25Q128BVFJP datasheet, W25Q128BVFJP pinout, W25Q128BVFJP application, or W25Q128BVFJP equivalent, key selection considerations include Quad SPI timing compliance (70MHz clock, 280MHz equivalent), hardware write protection via /WP and /HOLD pins, JEDEC ID and SFDP register support, and compatibility with standard, dual, and quad SPI instruction sets including suspend/resume functionality.

Technical Context

The W25Q128BVFJP implements a flexible SPI command architecture supporting Standard (Mode 0/3), Dual Output/I/O, and Quad Output/I/O protocols - with IO0–IO3 enabled only when the non-volatile Quad Enable (QE) bit in Status Register-2 is set. Its internal block diagram integrates a 256-byte page buffer, sector/block erase logic, security registers (3×256-byte OTP-locked), and SFDP register for discoverable parameters.

It features programmable write protection using both software (BP2–BP0, TB, SEC, CMP, SRP0/SRP1) and hardware (/WP pin active-low) methods, plus /HOLD pin for bus arbitration during active selection. Erase/program suspend and resume (75h/7Ah) enable interrupt handling without data corruption, and a 64-bit unique serial number supports device traceability.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 128 M-bit (16 MB), organized as 65,536 × 256-byte pages
Interface Protocol Standard/Dual/Quad SPI with CLK, /CS, IO0–IO3; QE bit required for Quad I/O
Max Clock Frequency 104 MHz (Dual Output), 70 MHz (Quad I/O); enables 208/280 MHz equivalent throughput
Erase Granularity Uniform 4 KB sectors (4,096 total), 32 KB blocks (2,048), 64 KB blocks (256), full chip
Write Endurance 100,000 program/erase cycles per sector, 20-year data retention
Supply & Power 2.7–3.6 V single supply; 4 mA active read current, <1 µA power-down current
Operating Temp –40°C to +85°C industrial temperature range

Pinout & Package

W25Q128BVFJP uses the 8-pad WSON 8×6-mm package (Package Code E), surface-mount, lead-free, moisture-sensitive level 3. Pin functions are defined for Standard/Dual SPI and reconfigured for Quad SPI when QE=1.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable; high-impedance DO and standby power when high
2 DO (IO1) Data Output / Bidirectional I/O Unidirectional output in Standard SPI; bidirectional IO1 in Dual/Quad SPI
3 /WP (IO2) Write Protect Input / Bidirectional I/O Hardware write lock for status register; becomes IO2 in Quad SPI when QE=1
4 GND Ground Reference Signal and power return path; decoupling capacitor required near VCC
5 DI (IO0) Data Input / Bidirectional I/O Unidirectional input in Standard SPI; bidirectional IO0 in Dual/Quad SPI
6 CLK Serial Clock Input Edge-triggered timing source; supports Mode 0 and Mode 3 SPI clock polarity/phasing
7 /HOLD (IO3) Hold Input / Bidirectional I/O Pauses ongoing operation while /CS low; becomes IO3 in Quad SPI when QE=1
8 VCC Power Supply 2.7–3.6 V supply; requires local 0.1 µF ceramic decoupling capacitor

Key Features

Feature Design Value
Quad SPI XIP Support Enables true execute-in-place from flash via Fast Read Quad I/O (EBh) with ≤8-clock address overhead
Erase/Program Suspend 75h/7Ah instructions allow interruption of long erase/program cycles for time-critical tasks
Hardware Write Protection /WP pin provides physical lock for status register bits (BP, SRP, TB), independent of software state
Security Registers Three 256-byte OTP-locked security registers for keys, certificates, or calibration data
SFDP Compliance JEDEC JESD216-compliant SFDP register (5Ah) enables automatic configuration by host boot ROM
Unique Serial Number 64-bit factory-programmed ID per device for secure provisioning and anti-counterfeiting

Applications

Industrial HMI Firmware Storage Automotive ADAS Boot Image

Use Scenario: Storing GUI assets, firmware updates, and configuration profiles in panel-mounted HMIs with limited PCB space.

IC Role / Device Role / Timing Role: Non-volatile code and data storage with Quad SPI XIP capability to reduce external RAM footprint.

Use Value: 35 MB/s read throughput and 4KB sector granularity enable fast UI rendering and selective OTA update patching without full image reload.

Use Scenario: Holding boot firmware and sensor calibration tables for radar/EPS ECUs requiring AEC-Q100 alignment.

IC Role / Device Role / Timing Role: Primary boot memory mapped via MCU's QSPI controller for deterministic cold-start execution.

Use Value: –40°C to +85°C rating, 100K-cycle endurance, and hardware /WP protection ensure reliable boot integrity across vehicle lifetime.

IoT Edge Gateway Configuration Medical Infusion Pump Log Storage

Use Scenario: Persisting network credentials, TLS certificates, and device-specific settings in battery-powered gateways.

IC Role / Device Role / Timing Role: Secure parameter storage leveraging OTP security registers and 64-bit unique ID for device identity binding.

Use Value: SFDP register auto-negotiation simplifies porting across host SoCs; low 1µA power-down current extends battery life between wake cycles.

Use Scenario: Recording dosage history, error logs, and calibration events in Class II medical devices with regulatory traceability requirements.

IC Role / Device Role / Timing Role: Tamper-resistant data logger using hardware write protection and sector-level erase isolation.

Use Value: Independent 4KB sector erase allows log rotation without disturbing firmware partitions; JEDEC ID and SFDP ensure audit-ready configuration verification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L12833F Same density, 3V supply, but max Quad SPI clock 80 MHz; no built-in SFDP register Lacks auto-configurable SFDP; requires manual register initialization in bootloader Choose when legacy toolchain support or lower cost outweighs SFDP convenience
S25FL128S 128Mb, 1.8V/3V dual supply; supports octal DTR mode (up to 400 MHz); larger 16-pin SOIC option Higher performance and voltage flexibility, but larger footprint and higher active current (8mA) Prefer for high-throughput boot scenarios where board area and power budget allow

Compared with MX25L12833F and S25FL128S, the W25Q128BVFJP offers optimal balance of Quad SPI speed (70 MHz), integrated SFDP, ultra-low power-down current (<1 µA), and compact WSON packaging - making it especially suitable for space-constrained, battery-aware, and auto-configuring embedded designs.

Availability

W25Q128BVFJP is available at Aetrix Electronics and suitable for industrial HMI, automotive ADAS, IoT gateway, medical device, and consumer electronics applications requiring stable component supply, long-term lifecycle support, and consistent parametric performance.

Supply support for W25Q128BVFJP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.

The W25Q series was designed specifically for embedded systems needing high-speed, low-power, and secure code/data storage with seamless SPI protocol interoperability - targeting microcontroller-based applications from wearables to automotive control units.

FAQ

What is the package type and footprint of the W25Q128BVFJP?

The W25Q128BVFJP uses an 8-pad WSON (Wafer-Level Small Outline No-Lead) package measuring 8 mm × 6 mm with exposed pad. It is RoHS-compliant, halogen-free, and rated at Moisture Sensitivity Level 3. The pinout matches Winbond's standard WSON layout for the W25Q128BV family, enabling drop-in replacement within same-package variants.

Does the W25Q128BVFJP support execute-in-place (XIP) operation?

Yes, the W25Q128BVFJP supports true XIP via Fast Read Quad I/O (instruction EBh) and Continuous Read Mode, achieving ≤8-clock instruction overhead for address setup. This enables direct code execution from flash by compatible microcontrollers (e.g., STM32, NXP i.MX RT, Renesas RA), reducing external RAM dependency and boot latency.

How is Quad SPI mode enabled on the W25Q128BVFJP?

Quad SPI mode is enabled by setting the Quad Enable (QE) bit in Status Register-2 using the Write Status Register (01h) instruction. Once QE = 1, the /WP and /HOLD pins become IO2 and IO3 respectively. The change is non-volatile and persists across power cycles unless explicitly cleared.

What write protection mechanisms does the W25Q128BVFJP provide?

The W25Q128BVFJP provides layered write protection: hardware via the active-low /WP pin (locks status register), software via BP2–BP0, TB, SEC, and CMP bits, and non-volatile SRP0/SRP1 bits that lock protection configuration. All methods can be combined to protect individual 4KB sectors or the entire array.

Is the W25Q128BVFJP compatible with JEDEC-standard identification and configuration?

Yes, the W25Q128BVFJP fully complies with JEDEC standards: it responds to Read JEDEC ID (9Fh), supports Manufacturer/Device ID reads (90h/92h/94h), and implements the SFDP register (5Ah) per JESD216B. This enables automatic detection and configuration by modern boot ROMs and flash programming tools.

W25Q128BVFJP Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25Q128BVFJP FAQ

1.How can I place an order for W25Q128BVFJP through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q128BVFJP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q128BVFJP reliable?

The price and inventory of W25Q128BVFJP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q128BVFJP is usually 5 days.

3.What payment methods are accepted for W25Q128BVFJP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q128BVFJP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q128BVFJP?

W25Q128BVFJP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q128BVFJP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q128BVFJP?

For technical support, including W25Q128BVFJP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q128BVFJP requirements.

6.How does Aetrix verify that W25Q128BVFJP is sourced from the original manufacturer or authorized distributors?

All W25Q128BVFJP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q128BVFJP meets industry standards.

7.What is the process for return or replacement of W25Q128BVFJP?

All W25Q128BVFJP units undergo pre-shipment inspection (PSI). If there is an issue with W25Q128BVFJP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q128BVFJP part is unused and in its original packaging.

Return procedure for W25Q128BVFJP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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