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Winbond Electronics Corporation W25Q128FWEIG

Part No.:
W25Q128FWEIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q128FWEIG.pdf
Description:
IC FLASH 128MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,856

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Product details

Overview

W25Q128FWEIG from Winbond is a 1.8V, 128M-bit (16MB) serial NOR flash memory supporting Standard/Dual/Quad SPI and QPI interfaces, organized into 65,536 × 256-byte pages with 4KB uniform sector erase, 104MHz max clock, and 1µA typical power-down current. It enables XIP execution in embedded microcontrollers for firmware storage and boot code.

For engineers reviewing the W25Q128FWEIG datasheet, W25Q128FWEIG pinout, W25Q128FWEIG application, or W25Q128FWEIG equivalent, key selection criteria include Quad Enable (QE) bit configuration, /HOLD vs /RESET pin behavior per package, 4KB sector granularity for parameter logging, and JEDEC SFDP register support for auto-configuration.

Technical Context

The W25Q128FWEIG implements a multi-mode SPI interface: Standard SPI uses DI/DO unidirectionally; Dual/Quad SPI repurpose /WP and /HOLD as IO2/IO3 when QE=1 in Status Register-2; QPI mode enables 2-clock instruction cycles for reduced overhead. All modes share the same CLK and /CS signals.

It features volatile and non-volatile status register bits including BP0–BP2, TB, SEC, CMP, SRP0/SRP1, and QE - enabling hardware write protection down to 4KB sectors, individual block locking, and configurable I/O pin functions. Erase/program suspend/resume allows background operation during real-time tasks.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 M-bit (16 MB), organized as 65,536 × 256-byte pages
Operating Voltage1.65 V to 1.95 V - compatible with 1.8V logic domains without level shifting
Max Clock Frequency104 MHz (SPI), 208 MHz equiv. (Dual I/O), 416 MHz equiv. (Quad I/O) - enables 50 MB/s continuous read
Erase Granularity4 KB sector / 32 KB block / 64 KB block / full chip - supports fine-grained firmware update and data logging
Write Endurance100,000 program/erase cycles per sector - suitable for field-upgradable firmware and runtime parameter storage
Data Retention20 years at +25°C - ensures long-term reliability in industrial and automotive control applications
Power Consumption4 mA active (typ.), <1 µA power-down (typ.) - critical for battery-backed or ultra-low-power IoT nodes

Pinout & Package

W25Q128FWEIG is supplied in an 8-pin WSON 6×5-mm package (Package Code P), with exposed pad for thermal dissipation and space-constrained PCB layouts.

Pin/TerminalCircuit RoleDesign Meaning
1 /CSChip Select InputActive-low enable; high-impedance DO and low-power standby when deasserted
2 DO (IO1)Data Output / I/O1Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI/QPI
3 /WP (IO2)Write Protect Input / I/O2Hardware lock for status register when QE=0; becomes IO2 in Quad mode (QE=1)
4 GNDGround ReferenceSignal and power return path; ties to PCB ground plane
5 DI (IO0)Data Input / I/O0Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI/QPI
6 CLKSerial Clock InputSynchronizes all SPI/QPI data transfers on rising edge
7 /HOLD or /RESET (IO3)Hold/Reset Input / I/O3Pauses ongoing operation when low (HOLD); resets device when pulsed (RESET); becomes IO3 in Quad mode
8 VCCPower Supply1.65–1.95 V supply; requires local 100 nF decoupling capacitor

Key Features

FeatureDesign Value
Quad Peripheral Interface (QPI)Reduces instruction overhead to 2 clocks per command, enabling true execute-in-place (XIP) from flash without RAM copy
Erase/Program Suspend & ResumeAllows interruption of long erase/program cycles to service time-critical interrupts, then resume without data loss
64-bit Unique Serial NumberFactory-programmed per-device ID for secure firmware binding, device authentication, and traceability in production
Three 256-byte Security RegistersOTP-lockable storage for cryptographic keys, calibration data, or license tokens - isolated from main array and protected by LB1–LB3 bits
JEDEC SFDP RegisterStandardized, read-only register providing auto-discoverable timing, voltage, and feature parameters for host bootloader compatibility

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing and executing real-time control firmware in programmable logic controllers with strict uptime requirements.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability via Quad SPI, reducing boot latency and external RAM dependency.

Use Value: 4KB sector erase enables incremental firmware patching without full reflash; 20-year retention ensures lifecycle alignment with industrial equipment.

Use Scenario: Holding boot code and safety-critical sensor fusion algorithms in automotive camera or radar ECUs.

IC Role / Device Role / Timing Role: AEC-Q100 qualified boot memory interfacing directly with ARM Cortex-R5/R7 cores via QPI for deterministic startup timing.

Use Value: 104MHz SPI clock and 50 MB/s read throughput meet ASIL-B boot time budgets; unique ID supports secure boot chain validation.

Medical Device Parameter LoggingIoT Edge Node Configuration Storage

Use Scenario: Recording calibrated sensor offsets, usage counters, and audit logs in portable diagnostic instruments.

IC Role / Device Role / Timing Role: Parameter storage with hardware write protection (via /WP and BP bits) to prevent accidental overwrites during field operation.

Use Value: 100,000 erase cycles and 4KB sectors allow daily logging for >27 years; <1 µA power-down extends battery life in handheld units.

Use Scenario: Storing network credentials, OTA update metadata, and device-specific configuration in LPWA sensors.

IC Role / Device Role / Timing Role: Secure configuration vault using OTP-locked security registers for Wi-Fi PSK and TLS root certificates.

Use Value: SFDP register enables automatic driver initialization across heterogeneous MCU platforms; WSON 6×5-mm footprint fits compact PCBs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX25L12833FZC-10G3V supply (2.7–3.6V), no QPI mode, 80MHz max clock, same 128M-bit density and SOIC/WSON packagesLacks QPI and XIP optimization; lower speed limits real-time code execution bandwidthSelect when system operates at 3.3V and does not require QPI or >40 MB/s read throughput
S25FL128SAGMFV0011.8V supply, 133MHz clock, HyperBus interface (not SPI-compatible), 128M-bit density, different pinout and command setRequires HyperFlash controller; incompatible with standard SPI peripherals without bridge ICSelect only for new designs targeting Cypress/Infineon HyperBus ecosystem and higher bandwidth needs

Compared with MX25L12833FZC-10G, W25Q128FWEIG delivers 30% higher read bandwidth and QPI-based XIP support; versus S25FL128SAGMFV001, it maintains full SPI software compatibility while trading HyperBus speed for broader MCU driver support and pinout flexibility.

Availability

W25Q128FWEIG is available at Aetrix Electronics and suitable for industrial control systems, automotive ECU boot memory, medical diagnostics, and IoT edge node design requiring stable component supply and long-term lifecycle assurance.

Supply support for W25Q128FWEIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded and industrial markets.

The W25Q series targets high-reliability, low-voltage embedded applications requiring fast read performance, flexible erase architecture, and robust security features - optimized for code storage, XIP execution, and secure parameter retention.

FAQ

What is the package type and footprint of W25Q128FWEIG?

W25Q128FWEIG uses an 8-pin WSON 6×5-mm package (Package Code P) with exposed thermal pad. It has identical pinout to the SOIC-208-mil variant but occupies ~40% less board area, making it ideal for space-constrained designs like wearables and sensor modules. The pin assignments match Figure 1b in the datasheet, with /CS, DO, /WP, GND, DI, CLK, /HOLD or /RESET, and VCC.

Does W25Q128FWEIG support execute-in-place (XIP) operation?

Yes, W25Q128FWEIG supports true XIP via its Continuous Read Mode and Quad Peripheral Interface (QPI). With QPI enabled (using instruction 38h), it achieves up to 416 MHz effective throughput and as few as 8 clocks to address memory, allowing ARM Cortex-M or R-series MCUs to execute code directly from flash without copying to RAM - reducing boot time and SRAM usage.

How does the /HOLD pin function differ between Standard SPI and Quad SPI modes on W25Q128FWEIG?

In Standard SPI mode (QE=0), pin 7 functions as /HOLD to pause ongoing operations. In Quad SPI mode (QE=1), that same pin becomes IO3 for bidirectional data transfer, and /HOLD functionality is disabled. The /HOLD feature is only available when QE=0 and is not supported in QPI mode - this behavior is fixed per the status register configuration and cannot be overridden.

What security features are implemented in W25Q128FWEIG beyond basic write protection?

W25Q128FWEIG includes three 256-byte OTP-lockable Security Registers, a 64-bit factory-unique ID, JEDEC SFDP register for standardized parameter discovery, and volatile/non-volatile status bits (LB1–LB3, SRP0/SRP1) for layered protection. These enable secure key storage, device authentication, and tamper-resistant firmware updates - distinct from simple /WP pin locking.

Can W25Q128FWEIG be used in automotive applications requiring AEC-Q100 qualification?

W25Q128FWEIG itself is not AEC-Q100 qualified; however, Winbond offers the automotive-grade W25Q128JW variant (same density, 1.8V, QPI support) rated for -40°C to +105°C and qualified to AEC-Q100 Grade 3. For automotive ADAS or body control modules requiring qualification, W25Q128JW is the compliant alternative - W25Q128FWEIG is intended for industrial and commercial temperature ranges (-40°C to +85°C).

W25Q128FWEIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
60µs, 5ms
Access Time:
-
Voltage - Supply:
1.65V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25Q128FWEIG FAQ

1.How can I place an order for W25Q128FWEIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q128FWEIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q128FWEIG reliable?

The price and inventory of W25Q128FWEIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q128FWEIG is usually 5 days.

3.What payment methods are accepted for W25Q128FWEIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q128FWEIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q128FWEIG?

W25Q128FWEIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q128FWEIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q128FWEIG?

For technical support, including W25Q128FWEIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q128FWEIG requirements.

6.How does Aetrix verify that W25Q128FWEIG is sourced from the original manufacturer or authorized distributors?

All W25Q128FWEIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q128FWEIG meets industry standards.

7.What is the process for return or replacement of W25Q128FWEIG?

All W25Q128FWEIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q128FWEIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q128FWEIG part is unused and in its original packaging.

Return procedure for W25Q128FWEIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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