Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W25Q128JWEIQ

Part No.:
W25Q128JWEIQ
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q128JWEIQ.pdf
Description:
IC FLASH 128MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,251

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W25Q128JWEIQ from Winbond is a 1.8V, 128M-bit (16MB) serial NOR flash memory supporting Standard, Dual, and Quad SPI interfaces with up to 133MHz clock frequency, 532MHz equivalent Quad I/O throughput, and 4KB uniform sector architecture - used for code execution (XIP), firmware storage, and parameter retention in space-constrained industrial embedded systems.

For engineers reviewing the W25Q128JWEIQ datasheet, W25Q128JWEIQ pinout, W25Q128JWEIQ application, or W25Q128JWEIQ equivalent, this page delivers verified package mapping (8-pin WSON 8x6-mm), confirmed pin functions including /CS, CLK, IO0–IO3, /WP, /HOLD, VCC and GND, real-world timing specs (tRST = 30µs, tRESET* = 1µs), and validated alternatives for industrial-grade SPI flash replacement.

Technical Context

The W25Q128JWEIQ implements a flexible SPI interface supporting Mode 0 and Mode 3 operation, with configurable I/O roles: DI/DO in Standard SPI, IO0/IO1 in Dual SPI, and IO0–IO3 in Quad SPI (enabled via non-volatile QE bit in Status Register-2). Its internal architecture includes 65,536 × 256-byte pages, 4,096 erasable 4KB sectors, and 256 erasable 64KB blocks.

It integrates hardware write protection via active-low /WP pin, suspend/resume for erase/program operations, 64-bit unique ID, SFDP register for discoverable parameters, and three 256-byte security registers with OTP locks - all operating across –40°C to +105°C with 1mA active and <1µA power-down current.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 128 M-bit (16 MB) - supports full firmware images and boot code for mid-size microcontrollers.
Supply Voltage 1.7–1.95 V - compatible with low-voltage 1.8V system rails and reduces power domain complexity.
SPI Clock Max 133 MHz Quad I/O - enables 66 MB/s continuous read throughput, exceeding parallel flash performance.
Erase Granularity 4 KB sectors (uniform) - allows fine-grained firmware updates without disturbing adjacent configuration data.
Endurance & Retention 100,000 program-erase cycles / 20+ years data retention - suitable for field-upgradable industrial controllers.
Operating Temp –40°C to +105°C - qualified for industrial-plus grade environments including motor drives and PLCs.
Package 8-pad WSON 8x6-mm (E-code) - surface-mount, moisture-sensitive level 3, footprint-compatible with JEDEC MO-241AB.

Pinout & Package

W25Q128JWEIQ is supplied in an 8-pad WSON 8x6-mm package (Package Code E), RoHS-compliant, with exposed pad for thermal dissipation and no internal heatsink requirement under typical industrial ambient conditions.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable: high-Z DO/IO pins and standby current when deasserted; required high-to-low transition before instruction acceptance.
2 DO (IO1) Data Output / Bidirectional I/O Unidirectional output in Standard SPI; bidirectional IO1 in Dual/Quad SPI; driven only when /CS is low.
3 /WP (IO2) Write Protect Input / Bidirectional I/O Hardware lock for status register writes when low; becomes IO2 in Quad SPI mode (QE=1).
4 GND Ground Reference Primary return path for VCC and I/O signals; must be low-impedance and decoupled near package.
5 DI (IO0) Data Input / Bidirectional I/O Unidirectional input in Standard SPI; bidirectional IO0 in Dual/Quad SPI; sampled on rising CLK edge.
6 CLK Serial Clock Input Master-generated timing signal; supports Mode 0 (CLK idle low) and Mode 3 (CLK idle high); max 133 MHz in Quad I/O.
7 /HOLD (IO3) Hold Input / Bidirectional I/O Pauses ongoing SPI transfer when low (active); becomes IO3 in Quad SPI mode (QE=1); not available during Quad operation.
8 VCC Power Supply 1.7–1.95 V supply; requires local 1µF + 0.1µF ceramic decoupling; internal reset triggers if VCC drops below threshold.

Key Features

Feature Design Value
Quad Enable (QE) bit Non-volatile Status Register-2 bit enabling IO2/IO3 functionality - eliminates external mode-setting hardware.
Erase/Program Suspend Allows pausing long erase/program operations to service time-critical reads - essential for real-time firmware updates.
64-bit Unique ID Factory-programmed per-device identifier - enables secure device authentication and firmware binding in IoT gateways.
Security Registers Three 256-byte OTP-locked regions - stores cryptographic keys or calibration data immune to field reprogramming.
SFDP Register JEDEC-standard discoverable parameter table - enables automatic driver initialization without hard-coded timing constants.

Applications

Industrial PLC Firmware Storage Medical Device Boot Image

Use Scenario: Storing and executing boot firmware and control logic in programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP support - directly executes ladder logic and motion control algorithms via Quad SPI bus.

Use Value: 4KB sector granularity enables atomic firmware patching without halting machine operation; 105°C rating ensures reliability inside sealed control cabinets.

Use Scenario: Holding certified boot images and safety-critical diagnostic routines in portable ultrasound and infusion pumps.

IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware repository - leverages OTP security registers to protect FDA-mandated calibration signatures.

Use Value: 20-year data retention guarantees integrity of life-support software across product lifecycle; -40°C start-up supports cold-chain transport validation.

Automotive ADAS Camera Module Smart Grid RTU Configuration

Use Scenario: Storing camera ISP firmware and lens calibration tables in automotive surround-view systems operating under engine bay thermal stress.

IC Role / Device Role / Timing Role: High-speed Quad I/O flash for low-latency image pipeline initialization - delivers 66 MB/s read to feed FPGA-based pre-processing engines.

Use Value: 133MHz Quad SPI clock eliminates bottleneck vs. legacy parallel flash; 100K endurance supports frequent OTA updates over vehicle lifetime.

Use Scenario: Retaining time-synchronized metering logs, encryption keys, and grid event timestamps in remote terminal units installed on utility poles.

IC Role / Device Role / Timing Role: Industrial-grade parameter and event log storage - uses sector-locked regions to prevent accidental overwrite of regulatory compliance data.

Use Value: Hardware /WP pin + BP bits provide dual-layer write protection; wide temperature range ensures uptime during summer blackouts and winter ice storms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L12835FZC-10G 3V supply (2.7–3.6V), same 128M-bit density, 104MHz max Quad SPI, no /RESET pin in 8-pin SOIC Limited to 3V systems; lacks hardware reset and 105°C rating - unsuitable for mixed-voltage industrial designs requiring hot-swap resilience. Select only if existing 3V board layout prohibits voltage rail redesign and thermal margin exceeds 85°C.
S25FL128SAGMFI010 1.8V supply, 128M-bit, 80MHz Quad SPI, integrated ECC, 100K cycles, but only –40°C to +85°C rating Includes on-die error correction for NAND-like reliability; missing extended temperature grade limits deployment in outdoor substations or engine compartments. Prefer when data integrity under radiation or EMI is critical, and ambient stays ≤85°C - avoid for automotive under-hood or industrial furnace control.

Compared with MX25L12835FZC-10G and S25FL128SAGMFI010, the W25Q128JWEIQ uniquely combines 1.8V operation, 105°C rating, 133MHz Quad SPI, and 8-pin WSON packaging - making it the only option meeting simultaneous requirements for low-voltage battery-backed systems, extended thermal range, and high-speed XIP in compact footprints.

Availability

W25Q128JWEIQ is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, automotive ADAS modules, and smart grid RTUs requiring stable component supply across extended temperature and long-lifecycle programs.

Supply support for W25Q128JWEIQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and TrustME® secure memory products.

The W25Q series targets high-reliability embedded applications demanding fast, flexible, and secure code/data storage - designed specifically for industrial, automotive, and medical systems where firmware integrity and thermal robustness are non-negotiable.

FAQ

What is the maximum supported SPI clock frequency for W25Q128JWEIQ in Quad I/O mode?

The W25Q128JWEIQ supports up to 133 MHz in Quad I/O mode, delivering an effective throughput of 532 Mbps (133 MHz × 4 bits). This is confirmed in the "AC Electrical Characteristics" section (Table 9.6) of the official datasheet revision G, and applies specifically to Fast Read Quad I/O (EBh) and Fast Read Quad Output (6Bh) instructions under 1.7–1.95 V supply and –40°C to +105°C conditions. The W25Q128JWEIQ achieves this without requiring external level shifters or timing margin derating.

Does W25Q128JWEIQ include hardware reset capability, and which packages support it?

The W25Q128JWEIQ does not include a dedicated /RESET pin in its 8-pad WSON 8x6-mm (E-code) package - hardware reset is only available on SOIC-16 (F-code) and TFBGA (B/C-code) variants per datasheet Section 4.6 and Note 1. However, W25Q128JWEIQ fully supports software reset via the two-instruction sequence Enable Reset (66h) followed by Reset Device (99h), completing in ~30 µs. This ensures deterministic recovery in all supported packages.

How is write protection implemented on W25Q128JWEIQ, and can it protect individual 4KB sectors?

W25Q128JWEIQ implements multi-layer write protection: hardware via active-low /WP pin, software via Status Register block protect bits (BP2–BP0, TB, SEC), and OTP-locked security registers. Yes - individual 4KB sectors can be locked using Individual Block/Sector Lock (36h) and verified via Read Block/Sector Lock (3Dh), as specified in Instruction Set Table 2 and Section 6.5. This enables selective firmware partitioning without affecting adjacent configuration or calibration data stored in neighboring sectors.

What package type and dimensions does W25Q128JWEIQ use, and is it moisture-sensitive?

W25Q128JWEIQ uses the 8-pad WSON 8x6-mm package (JEDEC MO-241AB, Package Code E), measuring 8.0 mm × 6.0 mm × 0.75 mm max height with an exposed thermal pad. It is rated Moisture Sensitivity Level 3 (MSL-3) per J-STD-020, requiring bake conditioning if floor life is exceeded - confirmed in Package Specification Section 10.2 and ordering information Table 11.1 of the datasheet.

Can W25Q128JWEIQ execute code directly from flash (XIP), and what interface modes support it?

Yes - W25Q128JWEIQ supports eXecute-In-Place (XIP) directly from flash memory using Dual SPI (e.g., Fast Read Dual I/O BBh) and Quad SPI (e.g., Fast Read Quad I/O EBh) interfaces. Standard SPI (03h) is also XIP-capable but at lower bandwidth. XIP functionality requires the Quad Enable (QE) bit set for Quad mode and proper memory-mapped controller configuration - explicitly stated in Section 1 General Descriptions and validated in Application Note AN111.

W25Q128JWEIQ Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-, 3ms
Access Time:
-
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25Q128JWEIQ FAQ

1.How can I place an order for W25Q128JWEIQ through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q128JWEIQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q128JWEIQ reliable?

The price and inventory of W25Q128JWEIQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q128JWEIQ is usually 5 days.

3.What payment methods are accepted for W25Q128JWEIQ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q128JWEIQ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q128JWEIQ?

W25Q128JWEIQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q128JWEIQ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q128JWEIQ?

For technical support, including W25Q128JWEIQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q128JWEIQ requirements.

6.How does Aetrix verify that W25Q128JWEIQ is sourced from the original manufacturer or authorized distributors?

All W25Q128JWEIQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q128JWEIQ meets industry standards.

7.What is the process for return or replacement of W25Q128JWEIQ?

All W25Q128JWEIQ units undergo pre-shipment inspection (PSI). If there is an issue with W25Q128JWEIQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q128JWEIQ part is unused and in its original packaging.

Return procedure for W25Q128JWEIQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q128JWEIQ Tags

  • W25Q128JWEIQ
  • W25Q128JWEIQ PDF
  • W25Q128JWEIQ Datasheet
  • W25Q128JWEIQ Specifications
  • W25Q128JWEIQ Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W25Q128JWEIQ
  • Buy W25Q128JWEIQ
  • W25Q128JWEIQ Price
  • W25Q128JWEIQ Distributor
  • W25Q128JWEIQ Supplier
  • W25Q128JWEIQ Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER