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Winbond Electronics Corporation W25Q16BVSSIG

Part No.:
W25Q16BVSSIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-SOIC (0.209", 5.30mm Width)
Datasheet:
AetrixW25Q16BVSSIG.pdf
Description:
IC FLASH 16MBIT SPI/QUAD 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,131

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Product details

Overview

W25Q16BVSSIG from Winbond is a 16 M-bit (2 MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with 4 KB uniform sectors, 104 MHz max clock frequency, and single 2.7–3.6 V supply - used for code storage, XIP execution, and firmware parameter retention in microcontroller-based embedded systems.

For engineers reviewing the W25Q16BVSSIG datasheet, W25Q16BVSSIG pinout, W25Q16BVSSIG application, or W25Q16BVSSIG equivalent, key selection considerations include Quad SPI enable (QE bit), /WP and /HOLD dual-role behavior in Quad mode, 4 KB sector granularity for fine-grained updates, and SOIC-8 208-mil package compatibility with legacy PCB footprints.

Technical Context

The W25Q16BVSSIG implements a SPI command-set architecture with three operational modes: Standard SPI (DI/DO unidirectional), Dual SPI (IO0/IO1 bidirectional), and Quad SPI (IO0–IO3 bidirectional requiring QE=1). Its internal block diagram includes a 256-byte page buffer, status register control logic, high-voltage generators for erase/program, and flexible write protection via SRP/BP bits and hardware /WP pin.

Quad SPI operation reassigns /WP and /HOLD to IO2 and IO3 respectively, disabling their hardware protection functions during active Quad mode; the device supports JEDEC-standard manufacturer/device ID (9Fh), 64-bit unique serial number (4Bh), and continuous read mode with ≤8-clock instruction overhead for true execute-in-place (XIP) capability.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density16 M-bit (2,097,152 bytes), organized as 8,192 × 256-byte pages
Interface SupportStandard/Dual/Quad SPI with configurable I/O roles; requires QE bit set for Quad I/O
Max Clock Frequency104 MHz (Standard/Dual); enables 208 MHz equivalent (Dual Output) and 416 MHz equivalent (Quad Output)
Erase GranularityUniform 4 KB sectors (512 total), plus 32 KB and 64 KB blocks (32 total)
Write Endurance≥100,000 program/erase cycles per sector
Data Retention≥20 years at +25°C
Supply Voltage2.7 V to 3.6 V; active current ≤4 mA, power-down current ≤1 µA (typ.)
Operating Temp–40°C to +85°C

Pinout & Package

W25Q16BVSSIG is packaged in an 8-pin SOIC 208-mil (package code SS), with gull-wing leads, 1.27 mm pitch, and standard JEDEC MS-012AC footprint. Pin 1 is marked with a beveled corner or dot.

Pin/TerminalCircuit RoleDesign Meaning
1 /CSChip Select InputActive-low enable; must transition high→low after power-up before first instruction
2 DO (IO1)Data Output / I/O1Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI
3 /WP (IO2)Hardware Write Protect / I/O2Active-low write protect for status register; becomes IO2 when QE=1 (Quad mode)
4 GNDGround ReferencePrimary return path for VCC and I/O signals; decoupling capacitor required near pin
5 DI (IO0)Data Input / I/O0Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI
6 CLKSerial Clock InputEdge-triggered timing source; supports SPI Modes 0 and 3
7 /HOLD (IO3)Hold Input / I/O3Pauses ongoing SPI transaction when low; becomes IO3 when QE=1 (Quad mode)
8 VCCPower Supply2.7–3.6 V main supply; requires local 0.1 µF ceramic decoupling

Key Features

FeatureDesign Value
Quad SPI Enable (QE bit)Non-volatile Status Register-2 bit enabling IO2/IO3; required for full 4-line data transfer
Continuous Read Mode≤8-clock instruction overhead per 24-bit address; enables deterministic XIP latency
Flexible Erase ArchitectureIndependent 4 KB sector erase allows firmware patching without disturbing adjacent configuration data
Hardware + Software Write Protection/WP pin + SRP/BP bits provide layered defense against accidental writes during power transients or firmware bugs
64-bit Unique Serial NumberJEDEC-compliant read-only identifier (4Bh instruction); enables device-level traceability and secure boot binding
JEDEC Manufacturer IDReturns EFh (Winbond) on 9Fh instruction; ensures interoperability with generic SPI flash drivers

Applications

Industrial PLC Firmware StorageIoT Edge Device OTA Updates

Use Scenario: Storing ladder logic firmware and runtime configuration in programmable logic controllers with field-upgrade requirements.

IC Role / Device Role / Timing Role: Non-volatile code and parameter storage with sector-protected boot loader region and atomic 4 KB update blocks.

Use Value: Enables safe over-the-air firmware patches using isolated 4 KB sectors, preventing corruption of critical boot code during partial writes.

Use Scenario: Hosting application firmware and sensor calibration data in battery-powered wireless sensors deployed in remote locations.

IC Role / Device Role / Timing Role: Low-power persistent storage with <1 µA power-down current and fast Quad SPI read for rapid wake-and-execute cycles.

Use Value: Reduces average system power by enabling deep-sleep between sensor reads while maintaining instant firmware access via XIP-capable Quad SPI.

Medical Diagnostic Instrument Boot CodeAutomotive Infotainment System UI Assets

Use Scenario: Storing certified boot firmware and safety-critical diagnostic routines in Class II medical devices requiring data integrity validation.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with hardware /WP pin and SRP-locked status register to prevent unauthorized modification.

Use Value: Meets IEC 62304 software lifecycle requirements via hardware-enforced write lock and 20-year data retention for audit trail preservation.

Use Scenario: Caching graphical assets (icons, fonts, animations) and voice prompt audio in automotive head units with strict thermal and EMI constraints.

IC Role / Device Role / Timing Role: High-bandwidth asset delivery via 416 MHz equivalent Quad SPI to minimize UI rendering latency.

Use Value: Achieves >50 MB/s sustained read throughput, eliminating frame drops during high-resolution GUI transitions without parallel memory complexity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX25L1606EM2I-12GSame density (16 M-bit), SOIC-8 208-mil, but supports only Standard/Dual SPI (no Quad I/O); lacks QE bit and IO2/IO3 mappingNot suitable for XIP-critical designs requiring >200 MHz effective bandwidth; limited to legacy SPI controllers without Quad supportSelect only if Quad SPI is unused and cost sensitivity outweighs future upgrade path flexibility
S25FL132K0XMFI01016 M-bit, SOIC-8 208-mil, supports Quad SPI with QPI mode; includes SFDP register for auto-configuration, but requires different status register layoutRequires driver adaptation for SFDP parsing and QPI entry sequence; better suited for scalable multi-density platformsPrefer when migrating to Cypress/Infineon ecosystem or needing standardized flash discovery via SFDP

Compared with MX25L1606EM2I-12G and S25FL132K0XMFI010, the W25Q16BVSSIG delivers higher Quad SPI bandwidth (416 MHz equivalent vs. 80 MHz max for MX25L1606E), native JEDEC ID compliance without vendor-specific initialization, and direct pin-to-pin compatibility with existing Winbond W25Q family layouts - making it optimal for cost-sensitive, performance-driven embedded designs requiring proven XIP stability.

Availability

W25Q16BVSSIG is available at Aetrix Electronics and suitable for industrial PLC firmware storage, IoT edge device OTA updates, and medical diagnostic instrument boot code requiring stable component supply across long-lifecycle programs.

Supply support for W25Q16BVSSIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer markets.

The W25Q series was designed specifically for high-reliability code storage and execute-in-place (XIP) applications in resource-constrained microcontroller systems, emphasizing sector-level flexibility, low-power operation, and multi-SPI protocol compatibility.

FAQ

What is the package type and lead count of the W25Q16BVSSIG?

The W25Q16BVSSIG uses an 8-pin SOIC package with 208-mil body width (package code SS), featuring gull-wing leads and JEDEC MS-012AC footprint compatibility. This package is distinct from the 150-mil (SN), PDIP (DA), WSON (ZP), and 16-pin SOIC (SF) variants offered for the same W25Q16BV die. The 'SS' suffix in W25Q16BVSSIG explicitly denotes the 208-mil SOIC variant.

Does the W25Q16BVSSIG support Quad SPI operation, and what is required to enable it?

Yes, the W25Q16BVSSIG supports Quad SPI operation using instructions such as Fast Read Quad Output (6Bh) and Fast Read Quad I/O (EBh), but requires the non-volatile Quad Enable (QE) bit in Status Register-2 to be set to '1'. Once enabled, pins /WP and /HOLD become IO2 and IO3 respectively, disabling their hardware write-protect and hold functions during active Quad mode.

How many program/erase cycles and data retention years does the W25Q16BVSSIG guarantee?

The W25Q16BVSSIG guarantees ≥100,000 program/erase cycles per 4 KB sector and ≥20 years of data retention at +25°C ambient temperature. These values are specified under standard operating conditions (2.7–3.6 V, –40°C to +85°C) and apply uniformly across all sectors of the W25Q16BVSSIG array.

Can the W25Q16BVSSIG be used for execute-in-place (XIP) applications, and what feature enables this?

Yes, the W25Q16BVSSIG supports true execute-in-place (XIP) operation via its Continuous Read Mode, which reduces instruction overhead to as few as 8 clock cycles for addressing - enabling deterministic fetch latency. Combined with Quad SPI's 416 MHz equivalent bandwidth, this allows microcontrollers to run code directly from flash without copying to RAM, reducing BOM cost and boot time.

What is the function of the /WP and /HOLD pins on the W25Q16BVSSIG in Standard versus Quad SPI modes?

In Standard and Dual SPI modes, /WP provides hardware write protection for the status register, and /HOLD pauses ongoing transactions. In Quad SPI mode (QE=1), both pins are reassigned as IO2 and IO3 for data I/O, disabling their dedicated protection and hold functions. This functional shift is documented in the W25Q16BVSSIG datasheet Section 8.3 and Figure 1a.

W25Q16BVSSIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-SOIC (0.209", 5.30mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
16Mbit
Memory Organization:
2M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

W25Q16BVSSIG FAQ

1.How can I place an order for W25Q16BVSSIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q16BVSSIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q16BVSSIG reliable?

The price and inventory of W25Q16BVSSIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q16BVSSIG is usually 5 days.

3.What payment methods are accepted for W25Q16BVSSIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q16BVSSIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q16BVSSIG?

W25Q16BVSSIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q16BVSSIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q16BVSSIG?

For technical support, including W25Q16BVSSIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q16BVSSIG requirements.

6.How does Aetrix verify that W25Q16BVSSIG is sourced from the original manufacturer or authorized distributors?

All W25Q16BVSSIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q16BVSSIG meets industry standards.

7.What is the process for return or replacement of W25Q16BVSSIG?

All W25Q16BVSSIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q16BVSSIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q16BVSSIG part is unused and in its original packaging.

Return procedure for W25Q16BVSSIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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