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Winbond Electronics Corporation W25Q16BVSSIG TR
- Part No.:
- W25Q16BVSSIG TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
W25Q16BVSSIG TR.pdf
- Description:
- IC FLASH 16MBIT SPI/QUAD 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,705
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Product details
Overview
W25Q16BVSSIG TR from Winbond is a 16 M-bit (2 MB) serial NOR flash memory with Dual and Quad SPI interface, organized as 8,192 × 256-byte pages, supporting 4 KB uniform sector erase, 32 KB/64 KB block erase, and chip erase. It operates from 2.7 V to 3.6 V, draws 4 mA active current and <1 µA in power-down mode, and targets embedded code storage and XIP execution in space-constrained microcontroller systems.
For engineers reviewing the W25Q16BVSSIG TR datasheet, W25Q16BVSSIG TR pinout, W25Q16BVSSIG TR application, or W25Q16BVSSIG TR equivalent, key selection criteria include Quad SPI timing compliance (up to 104 MHz CLK), hardware write protection via /WP and /HOLD pins, JEDEC ID and 64-bit unique serial number support, and SOIC-8 208-mil package compatibility for legacy PCB layouts.
Technical Context
The W25Q16BVSSIG TR implements a standard SPI bus (Mode 0/3) with optional Dual SPI (IO0/IO1) and Quad SPI (IO0–IO3) operation enabled by setting the non-volatile Quad Enable (QE) bit in Status Register-2. Its command set includes Fast Read Quad I/O (EBh), Word Read Quad I/O (E7h), and Octal Word Read Quad I/O (E3h), enabling up to 416 MHz equivalent data rates.
Internal architecture features a 256-byte page buffer, 512 erasable 4 KB sectors, and 32 erasable 64 KB blocks. Write protection combines software control (BP2–BP0, TB, SEC, SRP0/SRP1 bits) with hardware inputs (/WP, /HOLD), where /WP becomes IO2 and /HOLD becomes IO3 in Quad SPI mode - disabling their dedicated functions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 M-bit (2,097,152 bytes), organized as 8,192 × 256-byte programmable pages |
| Interface Support | Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3); QE bit required for Quad mode |
| Max Clock Frequency | 104 MHz CLK; enables 208 MHz dual-output and 416 MHz quad-output effective transfer rates |
| Erase Granularity | Uniform 4 KB sectors (512 total), 32 KB blocks (512 sectors), 64 KB blocks (1,024 sectors), full-chip erase |
| Supply Voltage | 2.7 V to 3.6 V single supply; supports industrial temperature range (−40°C to +85°C) |
| Power Consumption | 4 mA typical active current; <1 µA typical power-down current; no external VCC regulation required |
| Data Retention & Endurance | ≥20 years data retention; >100,000 program/erase cycles per sector |
| Identification | JEDEC-compliant Manufacturer ID (EFh), Device ID (4015h), and 64-bit unique serial number per unit |
Pinout & Package
W25Q16BVSSIG TR is packaged in an 8-pin SOIC 208-mil (package code SS), with gull-wing leads, 1.27 mm pitch, and body dimensions of 5.33 mm × 5.33 mm × 1.78 mm. Pin 1 is marked with a beveled corner or dot.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; device enters high-impedance output state when high; must transition high→low after power-up before instruction acceptance |
| 2 DO (IO1) | Data Output / Bidirectional I/O 1 | Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI; used for read data and status register reads |
| 3 /WP (IO2) | Write Protect Input / Bidirectional I/O 2 | Hardware write protect for status register when QE = 0; becomes IO2 in Quad SPI mode (QE = 1), disabling /WP function |
| 4 GND | Ground Reference | Primary signal and power return path; requires low-impedance connection to system ground plane |
| 5 DI (IO0) | Data Input / Bidirectional I/O 0 | Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI; carries instructions, addresses, and program data |
| 6 CLK | Serial Clock Input | Synchronous timing reference; supports Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1); max 104 MHz |
| 7 /HOLD (IO3) | Hold Input / Bidirectional I/O 3 | Pauses ongoing SPI transaction when low (active); becomes IO3 in Quad SPI mode (QE = 1), disabling /HOLD function |
| 8 VCC | Power Supply | 2.7–3.6 V nominal; decoupling capacitor (0.1 µF ceramic) required within 5 mm of pin for stable operation |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode | Enables true XIP (execute-in-place) with only 8 clock cycles overhead per 24-bit address, eliminating instruction fetch latency in MCU boot sequences |
| Flexible Erase Architecture | 4 KB sectors allow fine-grained firmware parameter updates without disturbing adjacent application code or bootloader regions |
| Dual/Quad SPI Compatibility | Backward-compatible pinout supports migration from Standard to Dual/Quad SPI without PCB redesign - same SOIC-8 footprint |
| Hardware + Software Write Protection | Combines /WP pin control with configurable BP2–BP0, TB, SEC, and SRP bits to lock specific sectors or entire array against accidental overwrite |
| Unique Device Identification | 64-bit factory-programmed serial number enables secure firmware binding, device authentication, and field-level traceability in production |
| Industrial Temperature Range | Guaranteed operation from −40°C to +85°C meets requirements for automotive infotainment, industrial HMIs, and outdoor IoT gateways |
Applications
| MCU Boot Code Storage | Firmware Over-the-Air (OTA) Update Buffer |
|---|---|
|
Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M or RISC-V microcontrollers requiring fast startup and reliable code integrity. IC Role / Device Role / Timing Role: Non-volatile code storage with Quad SPI XIP capability; delivers instruction fetches at up to 416 MHz equivalent bandwidth to reduce boot time. Use Value: Eliminates need for parallel NOR flash or external RAM loading; reduces BOM count and PCB area while maintaining deterministic boot latency. |
Use Scenario: Holding validated firmware images during OTA update cycles in connected edge devices, ensuring rollback capability and atomic image switching. IC Role / Device Role / Timing Role: Dual-bank storage partitioning (e.g., active/inactive banks) managed via sector-level erase; supports background download while executing current firmware. Use Value: Enables safe, interruptible updates with verified checksums and sector-level atomicity - no risk of bricking due to power loss mid-update. |
| Industrial HMI Configuration Data | Audio Voice Prompt Storage |
|
Use Scenario: Persisting user-configurable parameters (screen brightness, language, calibration offsets) in human-machine interface panels deployed in factory automation. IC Role / Device Role / Timing Role: Parameter EEPROM replacement; leverages 4 KB sector erase to update individual configuration groups without affecting unrelated settings. Use Value: Achieves >100,000 write cycles per sector - outlasting typical EEPROM endurance - with no wear-leveling firmware overhead. |
Use Scenario: Storing pre-recorded voice prompts (e.g., safety alerts, multilingual instructions) in medical devices and building access systems. IC Role / Device Role / Timing Role: Sequential audio playback buffer accessed via Fast Read Dual Output (3Bh); sustains continuous 50 MB/s streaming without CPU intervention. Use Value: Delivers CD-quality audio playback directly from SPI flash using DMA-driven SPI peripherals, freeing MCU resources for real-time control tasks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L1606EM2I-12G | Same density (16 M-bit), SOIC-8 208-mil, but supports only Standard/Dual SPI (no Quad I/O); max CLK = 80 MHz | Lacks Quad SPI XIP performance; suitable for cost-sensitive designs where 50 MB/s throughput is not required | Select when Quad SPI is unnecessary and JEDEC ID compatibility with Winbond is not mandated |
| S25FL116KAGMFI010 | 16 M-bit, SOIC-8 208-mil, Quad SPI capable, but uses different status register layout and command set (e.g., no Octal Word Read) | Requires firmware driver modification; supports SFDP for auto-configuration but lacks 64-bit unique ID | Choose for Cypress-based platforms or where SFDP-driven initialization simplifies porting across densities |
Compared with MX25L1606EM2I-12G and S25FL116KAGMFI010, the W25Q16BVSSIG TR delivers higher Quad SPI bandwidth (416 MHz equivalent vs. ≤240 MHz), integrated 64-bit UID for secure provisioning, and broader instruction set coverage including Octal Word Read - making it optimal for XIP-critical, security-aware, and high-throughput embedded systems.
Availability
W25Q16BVSSIG TR is available at Aetrix Electronics and suitable for MCU boot code storage, OTA firmware buffering, industrial HMI configuration persistence, and audio prompt playback requiring stable component supply across long-lifecycle embedded programs.
Supply support for W25Q16BVSSIG TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for consumer, industrial, and automotive markets.
The W25Q series was designed specifically for embedded systems requiring high-speed, low-power, and pin-efficient code and data storage - emphasizing Quad SPI performance, robust write protection, and industrial-grade reliability.
FAQ
What is the package type and lead count of the W25Q16BVSSIG TR?
The W25Q16BVSSIG TR uses an 8-pin SOIC package with 208-mil width (package code SS), featuring gull-wing leads, 1.27 mm pitch, and industry-standard footprint compatibility. It is not a 16-pin variant - the 16-pin SOIC (SF) is a separate part number not applicable to W25Q16BVSSIG TR.
Does the W25Q16BVSSIG TR support Quad SPI operation out of the box?
No - Quad SPI operation requires enabling the non-volatile Quad Enable (QE) bit in Status Register-2 via Write Status Register (01h) instruction. Until QE = 1, pins /WP and /HOLD remain functional as hardware write protect and hold inputs; after QE is set, they become IO2 and IO3.
Can the W25Q16BVSSIG TR be used for execute-in-place (XIP) applications?
Yes - the W25Q16BVSSIG TR supports true XIP via Continuous Read Mode with Fast Read Quad I/O (EBh) and Word Read Quad I/O (E7h), achieving up to 416 MHz equivalent bandwidth and requiring only 8 clock cycles to address memory, enabling direct code execution from flash on compatible MCUs.
How does hardware write protection work on the W25Q16BVSSIG TR?
Hardware write protection is implemented via the /WP pin, which - when held low - prevents writes to the status register unless overridden by software configuration. When QE = 0, /WP actively guards status register modification; when QE = 1, /WP becomes IO2 and hardware protection is disabled.
What unique identification capability does the W25Q16BVSSIG TR provide?
The W25Q16BVSSIG TR includes a factory-programmed 64-bit unique serial number accessible via Read Unique ID Number (4Bh) instruction. This enables device-level traceability, secure firmware binding, and cryptographic key derivation - critical for anti-counterfeiting and regulatory compliance in medical and industrial deployments.
W25Q16BVSSIG TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
W25Q16BVSSIG TR FAQ
1.How can I place an order for W25Q16BVSSIG TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q16BVSSIG TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q16BVSSIG TR reliable?
The price and inventory of W25Q16BVSSIG TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q16BVSSIG TR is usually 5 days.
3.What payment methods are accepted for W25Q16BVSSIG TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q16BVSSIG TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q16BVSSIG TR?
W25Q16BVSSIG TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q16BVSSIG TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q16BVSSIG TR?
For technical support, including W25Q16BVSSIG TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q16BVSSIG TR requirements.
6.How does Aetrix verify that W25Q16BVSSIG TR is sourced from the original manufacturer or authorized distributors?
All W25Q16BVSSIG TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q16BVSSIG TR meets industry standards.
7.What is the process for return or replacement of W25Q16BVSSIG TR?
All W25Q16BVSSIG TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q16BVSSIG TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q16BVSSIG TR part is unused and in its original packaging.
Return procedure for W25Q16BVSSIG TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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