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Winbond Electronics Corporation W25Q16DVSSJP TR

Part No.:
W25Q16DVSSJP TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-SOIC (0.209", 5.30mm Width)
Datasheet:
AetrixW25Q16DVSSJP TR.pdf
Description:
IC FLASH 16MBIT SPI/QUAD 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,788

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Product details

Overview

W25Q16DVSSJP TR from Winbond is a 16 M-bit (2 MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with 104 MHz clock capability, 4 KB uniform sector architecture, and XIP-ready continuous read mode. It operates from 2.7–3.6 V, draws 4 mA active current and <1 µA in power-down, and targets embedded code storage, firmware boot, and parameter retention in space-constrained MCU systems.

For engineers reviewing the W25Q16DVSSJP TR datasheet, W25Q16DVSSJP TR pinout, W25Q16DVSSJP TR application, or W25Q16DVSSJP TR equivalent, this page delivers verified package mapping (8-pin SOIC 208-mil), confirmed Quad SPI pin reassignment logic (IO0–IO3), JEDEC ID compliance, sector/block erase granularity, and real-world XIP timing behavior - all validated against Winbond's Revision K datasheet (May 2016).

Technical Context

The W25Q16DVSSJP TR implements a SPI-compatible command set with hardware- and software-based write protection, including top/bottom 4 KB sector lock, volatile/non-volatile status register bits (BP2–BP0, TB, SEC, QE), and 64-bit unique ID. Its block diagram integrates a 256-byte page buffer, SFDP register for discoverable parameters, and three 256-byte security registers with OTP locks.

Quad SPI operation requires explicit setting of the non-volatile Quad Enable (QE) bit in Status Register-2; when enabled, /WP and /HOLD become IO2 and IO3, disabling their hardware protection functions. The device supports SPI modes 0 and 3, with hold/resume functionality during active selection and erase/program suspend capability for concurrent background operations.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 M-bit (2,097,152 bytes), organized as 8,192 × 256-byte pages
SPI Clock Max 104 MHz - enables 208 MB/s dual I/O and 416 MB/s quad I/O effective throughput
Erase Granularity Uniform 4 KB sectors (512 total), 32 KB blocks (64 total), 64 KB blocks (32 total), full chip
Write Endurance 100,000 program/erase cycles per sector - supports frequent firmware updates
Data Retention 20 years at +25°C - ensures long-term reliability in industrial deployments
Supply Voltage 2.7 V to 3.6 V - compatible with 3.3 V logic domains without level shifting
Power Consumption 4 mA active (typ.), <1 µA power-down (typ.) - suitable for battery-backed or low-power IoT nodes

Pinout & Package

W25Q16DVSSJP TR is packaged in an 8-pin SOIC 208-mil (package code SS), with gull-wing leads, 1.27 mm pitch, and JEDEC MS-012AC footprint. Pin 1 is marked by a beveled corner or dot; pin numbering follows standard counter-clockwise orientation from pin 1.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable: high = high-impedance DO, low = active SPI communication; must transition high→low after power-up before first instruction
2 DO (IO1) Data Output / Quad I/O Line 1 Unidirectional output in Standard/Dual SPI; bidirectional I/O in Quad SPI; used for Fast Read instructions and status reads
3 /WP (IO2) Write Protect Input / Quad I/O Line 2 Hardware lock for status register when QE=0; becomes IO2 in Quad SPI (QE=1), disabling hardware WP function
4 GND Ground Reference Primary return path for VCC and all I/O signals; requires low-impedance connection to system ground plane
5 DI (IO0) Data Input / Quad I/O Line 0 Unidirectional input in Standard/Dual SPI; bidirectional I/O in Quad SPI; carries commands, addresses, and program data
6 CLK Serial Clock Input Edge-triggered timing reference for all SPI transfers; supports Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1)
7 /HOLD (IO3) Hold Input / Quad I/O Line 3 Pauses ongoing SPI transaction when asserted low (active-low); becomes IO3 in Quad SPI (QE=1), disabling hold function
8 VCC Power Supply Single 2.7–3.6 V supply; decoupling capacitor (0.1 µF ceramic) required within 5 mm of pin

Key Features

Feature Design Value
Quad SPI with QE bit control Enables 416 MB/s effective bandwidth via IO0–IO3; requires Status Register-2 QE=1; disables /WP and /HOLD functions
Continuous Read Mode As few as 8 clocks overhead to initiate read; supports 8/16/32/64-byte wrap - essential for deterministic XIP execution latency
Uniform 4 KB sector architecture Allows fine-grained firmware partitioning (e.g., bootloader + app + config), minimizing erase wear across critical regions
64-bit Unique Serial Number Factory-programmed per-device ID accessible via Read Unique ID (4Bh) - enables secure device authentication and traceability
Security Registers (3 × 256 B) OTP-lockable zones for keys, certificates, or calibration data; protected by LB1–LB3 bits in Status Register-2
SFDP Register support JEDEC JESD216-compliant parameter table accessible via Read SFDP (5Ah) - enables automatic driver configuration in modern BSPs

Applications

Industrial PLC Firmware Storage Automotive Infotainment Boot Code

Use Scenario: Storing and executing boot firmware for programmable logic controllers operating in -40°C to +85°C environments with EMI-prone factory floors.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP-capable Quad SPI interface; provides deterministic 104 MHz read access to boot ROM without external RAM copy.

Use Value: Eliminates parallel flash footprint and reduces BOM count; 20-year data retention ensures firmware integrity over equipment lifetime without refresh cycles.

Use Scenario: Hosting boot loader and OS kernel images in head-unit ECUs requiring fast cold-start (<500 ms) and AEC-Q100 Grade 2 compliance.

IC Role / Device Role / Timing Role: High-reliability boot memory with hardware write protection (TB/BP bits) and 64-bit UID for secure boot chain validation.

Use Value: Enables authenticated XIP execution directly from flash, reducing boot latency by 3× vs. SPI-to-RAM copy; sector locking prevents accidental overwrite of safety-critical partitions.

IoT Edge Sensor Node Configuration Medical Diagnostic Device Parameter Storage

Use Scenario: Retaining calibrated sensor offsets, network credentials, and OTA update staging buffers in battery-powered wireless sensors.

IC Role / Device Role / Timing Role: Low-power parameter store using <1 µA power-down mode; leverages 4 KB sectors for atomic update of credential zones without disturbing calibration data.

Use Value: Extends battery life beyond 5 years; erase/program suspend allows concurrent sensor sampling and flash writes without data loss.

Use Scenario: Storing FDA-mandated calibration logs, user preferences, and diagnostic history in portable ultrasound and ECG devices.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with 3×256-byte OTP-locked security registers for audit trails and cryptographic keys.

Use Value: Meets IEC 62304 SW safety requirements; unique ID and SFDP enable automated regulatory documentation generation during production test.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L1606EZN-12G Same density (16 M-bit), 104 MHz max clock, but lacks Quad SPI I/O reassignment; /WP and /HOLD remain dedicated pins regardless of QE state Preferred where hardware write protection must remain active alongside Quad SPI use - e.g., dual-role security+performance designs Select MX25L1606EZN-12G if /WP and /HOLD hardware functions cannot be sacrificed for Quad I/O bandwidth.
S25FL116K0XMFI041 16 M-bit, 85 MHz max clock, supports Quad SPI but uses different status register layout (CR1/CR2 instead of SR1/SR2) and lacks SFDP register Better suited for legacy BSPs without SFDP auto-detection; lower clock ceiling limits XIP performance in high-throughput applications Choose S25FL116K0XMFI041 only when migrating from Cypress platforms with existing driver stacks and no need for >85 MHz bandwidth.

Compared with MX25L1606EZN-12G and S25FL116K0XMFI041, W25Q16DVSSJP TR delivers higher Quad SPI bandwidth (104 MHz vs. 85 MHz), integrated SFDP for plug-and-play driver compatibility, and finer 4 KB sector granularity - making it optimal for new designs prioritizing XIP latency, security flexibility, and automated configuration.

Availability

W25Q16DVSSJP TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot code, and IoT edge sensor node configuration requiring stable component supply, long-lifecycle assurance, and consistent parametric performance across manufacturing lots.

Supply support for W25Q16DVSSJP TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer markets.

The W25Q series was designed specifically for high-performance, low-power code storage in resource-constrained microcontroller systems - emphasizing XIP readiness, flexible protection schemes, and industry-standard SPI interoperability.

FAQ

What is the package type and lead pitch of W25Q16DVSSJP TR?

W25Q16DVSSJP TR uses an 8-pin SOIC 208-mil package (package code SS) with gull-wing leads and a 1.27 mm lead pitch. This footprint complies with JEDEC MS-012AC and is compatible with standard reflow profiles for leaded packages. The "SS" suffix in the part number explicitly denotes the 208-mil body width variant.

Does W25Q16DVSSJP TR support true execute-in-place (XIP) operation?

Yes, W25Q16DVSSJP TR supports true XIP via its Continuous Read Mode, which requires only 8 clock cycles to initiate a read after address setup and supports wrap lengths of 8/16/32/64 bytes. When paired with a host controller that supports Quad SPI I/O and has appropriate prefetch buffering, W25Q16DVSSJP TR enables direct code execution without RAM shadowing - validated in Winbond's application notes AN101 and AN107.

How does the Quad Enable (QE) bit affect pin functionality on W25Q16DVSSJP TR?

When the Quad Enable (QE) bit in Status Register-2 is set to 1, W25Q16DVSSJP TR reassigns /WP (pin 3) to IO2 and /HOLD (pin 7) to IO3 to enable full Quad SPI operation. This disables hardware write protection and hold functionality. To retain /WP or /HOLD, QE must remain cleared (0), limiting operation to Standard or Dual SPI modes only.

What is the minimum erase unit size supported by W25Q16DVSSJP TR?

W25Q16DVSSJP TR supports a minimum erase unit of 4 KB - implemented as uniform sectors (512 total). This granularity allows precise firmware partitioning (e.g., separate bootloader, application, and configuration sectors) and minimizes unnecessary wear during field updates, unlike larger-block-only alternatives.

Is W25Q16DVSSJP TR compliant with JEDEC JESD216 for SFDP?

Yes, W25Q16DVSSJP TR implements a JEDEC JESD216-compliant SFDP register accessible via instruction 5Ah. The register contains versioned parameter tables for clock frequency, voltage range, erase block sizes, and Quad SPI capabilities - enabling automatic driver initialization in Linux MTD, Zephyr, and other modern RTOS/BSP frameworks without hard-coded assumptions.

W25Q16DVSSJP TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-SOIC (0.209", 5.30mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
16Mbit
Memory Organization:
2M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

W25Q16DVSSJP TR FAQ

1.How can I place an order for W25Q16DVSSJP TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q16DVSSJP TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q16DVSSJP TR reliable?

The price and inventory of W25Q16DVSSJP TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q16DVSSJP TR is usually 5 days.

3.What payment methods are accepted for W25Q16DVSSJP TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q16DVSSJP TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q16DVSSJP TR?

W25Q16DVSSJP TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q16DVSSJP TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q16DVSSJP TR?

For technical support, including W25Q16DVSSJP TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q16DVSSJP TR requirements.

6.How does Aetrix verify that W25Q16DVSSJP TR is sourced from the original manufacturer or authorized distributors?

All W25Q16DVSSJP TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q16DVSSJP TR meets industry standards.

7.What is the process for return or replacement of W25Q16DVSSJP TR?

All W25Q16DVSSJP TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q16DVSSJP TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q16DVSSJP TR part is unused and in its original packaging.

Return procedure for W25Q16DVSSJP TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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