Winbond Electronics Corporation W25Q16FWUUIQ TR
- Part No.:
- W25Q16FWUUIQ TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-UFDFN Exposed Pad
- Datasheet:
-
W25Q16FWUUIQ TR.pdf
- Description:
- IC FLASH 16MBIT SPI/QUAD 8USON
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W25Q16FWUUIQ TR from Winbond is a 1.8V, 16M-bit (2MB) serial NOR flash memory supporting Standard/Dual/Quad SPI and QPI interfaces, organized into 8192 × 256-byte pages with 4KB uniform sector erase granularity, used for code execution-in-place (XIP), firmware storage, and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25Q16FWUUIQ TR datasheet, W25Q16FWUUIQ TR pinout, W25Q16FWUUIQ TR application, or W25Q16FWUUIQ TR equivalent, this page delivers verified electrical specs, validated pin functions across SOIC/WSON/USON/WLCSP packages, confirmed QPI mode behavior, JEDEC ID and SFDP register support, and real-world XIP timing constraints - all grounded in Winbond's Revision J datasheet.
Technical Context
The W25Q16FWUUIQ TR implements a quad I/O-capable SPI peripheral with non-volatile Quad Enable (QE) bit in Status Register-2, enabling IO2 (/WP) and IO3 (/HOLD) during Quad SPI and QPI modes. Its architecture supports true execute-in-place operation via Continuous Read Mode with ≤8-clock instruction overhead and wrap lengths of 8/16/32/64 bytes.
It features three 256-byte Security Registers with OTP lock capability, 64-bit unique serial number, and dual write protection layers: hardware pins (/WP, /HOLD) plus software-configurable BP/TB/SEC/CMP bits in volatile and non-volatile status registers - all operating within 1.65–1.95V supply and –40°C to +85°C industrial temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 M-bit (2,097,152 bytes), enabling full firmware image storage for mid-tier microcontrollers. |
| Supply Voltage | 1.65 V to 1.95 V - compatible with 1.8V core logic without level-shifting in modern SoCs and MCUs. |
| Max Clock Frequency | 104 MHz SPI; enables 416 MB/s effective throughput in Quad I/O mode using Fast Read Quad I/O (EBh). |
| Erase Granularity | Uniform 4 KB sectors (512 total), allowing fine-grained firmware update partitioning and data logging. |
| Program/Erase Cycles | ≥100,000 cycles per sector - sufficient for field-upgradable firmware with over-the-air (OTA) update resilience. |
| Data Retention | 20+ years at +25°C - ensures long-term reliability in unattended industrial and automotive control modules. |
| Interface Modes | Standard SPI (4-wire), Dual SPI (4-wire), Quad SPI (6-wire), and QPI (6-wire, 2-clock instruction fetch) - selectable via QE bit and command set. |
Pinout & Package
W25Q16FWUUIQ TR is packaged in an 8-pad USON 2x3-mm (Package Code UX), with exposed pad thermal design and lead-free RoHS-compliant construction. Pin functions are identical across SOIC, VSOP, WSON, USON, and WLCSP variants per Winbond's pin description table.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable: high = device deselected (DO high-Z, standby current); low = active communication window. |
| DO (IO1) | Data Output / Bidirectional I/O1 | Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI/QPI - carries read data or address LSBs. |
| /WP (IO2) | Write Protect Input / Bidirectional I/O2 | Hardware write lock for status register when QE=0; becomes IO2 in Quad SPI/QPI - requires QE=1 to enable quad mode. |
| GND | Ground Reference | Primary return path for VCC and all I/O signals; must be low-impedance for stable 104 MHz timing margins. |
| DI (IO0) | Data Input / Bidirectional I/O0 | Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI/QPI - carries instructions, addresses, and program data. |
| CLK | Serial Clock Input | Edge-triggered master clock (Mode 0/3 supported); rising edge for input, falling edge for output - defines all timing windows. |
| /HOLD or /RESET (IO3) | Hold Input / Reset Input / Bidirectional I/O3 | Pauses ongoing SPI transfer when active low (QE=0); becomes IO3 in Quad SPI/QPI; /RESET function only available when QE=0 and configured via SR. |
| VCC | Power Supply | 1.65–1.95 V nominal; decoupling capacitor required within 5 mm for noise immunity at 104 MHz operation. |
Key Features
| Feature | Design Value |
|---|---|
| Quad Peripheral Interface (QPI) | Reduces instruction fetch overhead to 2 clocks vs. 8 in standard SPI - critical for deterministic XIP latency in real-time boot sequences. |
| Continuous Read with Wrap | Supports 8/16/32/64-byte burst wraps - eliminates address increment overhead during sequential code fetch, improving effective bandwidth by ≥30%. |
| Erase/Program Suspend & Resume | Allows interruption of long erase (up to 100 ms) or program (up to 1.2 ms) operations to service higher-priority interrupts - essential for responsive firmware updates. |
| Security Registers (3 × 256 B) | OTP-lockable storage for cryptographic keys, calibration data, or device-specific credentials - isolated from main array and protected by LB[3:1] bits. |
| JEDEC ID & SFDP Support | Enables automatic driver initialization and configuration discovery in Linux MTD and U-Boot - no hard-coded timing or geometry assumptions required. |
Applications
| IoT Edge Node Firmware Storage | Industrial PLC Boot Memory |
|---|---|
|
Use Scenario: Storing signed firmware images and OTA update payloads in battery-powered wireless sensor nodes with strict power budgets. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP-capable Quad SPI interface, delivering <1 µA power-down current and fast wake-to-execute latency. Use Value: Enables secure, low-power firmware updates without external RAM buffering - reduces BOM cost and PCB footprint versus parallel NOR solutions. |
Use Scenario: Hosting bootloader and real-time control logic in programmable logic controllers requiring deterministic startup and field-reprogrammability. IC Role / Device Role / Timing Role: Boot memory mapped via MCU's QSPI controller; leverages 104 MHz clock and QPI mode for sub-100 ms cold boot time. Use Value: Guarantees reliable execution under voltage droop (1.65 V min) and extended temperature (-40°C to +85°C), meeting IEC 61131-2 industrial requirements. |
| Automotive Infotainment UI Assets | Medical Device Configuration Storage |
|
Use Scenario: Caching GUI assets (fonts, icons, bitmaps) in automotive head units where rapid UI rendering and AEC-Q100 compliance are mandatory. IC Role / Device Role / Timing Role: High-bandwidth asset cache using Fast Read Quad I/O (EBh) at 416 MB/s effective rate - minimizes UI stutter during navigation transitions. Use Value: Delivers consistent 4KB sector erase for incremental asset updates without disrupting active display rendering - avoids frame drops during partial reflash. |
Use Scenario: Storing calibrated sensor coefficients, user preferences, and audit logs in Class II medical devices requiring traceable, tamper-resistant data retention. IC Role / Device Role / Timing Role: Secure parameter store leveraging 64-bit unique ID, security registers with OTP locks, and hardware write protection on BP/TB bits. Use Value: Meets FDA 21 CFR Part 11 electronic record integrity requirements through immutable device identity and configurable memory lockdown. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L1606EM1I-12G | 3V supply (2.7–3.6V), same 16M-bit density and SOIC8 package; lacks QPI mode and SFDP register. | Requires level-shifting for 1.8V systems; no auto-discovery - driver must be hardcoded for timing and geometry. | Select only if legacy 3V design compatibility is required and QPI/XIP performance is not needed. |
| S25FL116K0XMFI011 | 1.8V operation, 16M-bit, supports Octal DTR mode (up to 80 MHz x8), includes built-in ECC and sector protection lockbits. | Higher pin count (16-pin SOIC), larger footprint; ECC adds overhead but improves reliability in radiation-prone environments. | Prefer for safety-critical applications needing error correction, but avoid if board space or pin count is constrained. |
Compared with MX25L1606EM1I-12G and S25FL116K0XMFI011, the W25Q16FWUUIQ TR uniquely balances 1.8V compatibility, QPI-enabled low-latency XIP, compact USON packaging, and JEDEC/SFDP interoperability - making it optimal for new 1.8V embedded designs prioritizing boot speed, footprint, and driver portability.
Availability
W25Q16FWUUIQ TR is available at Aetrix Electronics and suitable for IoT edge node firmware storage, industrial PLC boot memory, and automotive infotainment UI assets requiring stable component supply, long-lifecycle assurance, and RoHS-compliant manufacturing.
Supply support for W25Q16FWUUIQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial NOR/NAND flash, RAM, and mobile DRAM - serving automotive, industrial, and consumer markets since 1987.
The W25Q series was designed specifically for embedded systems demanding high-speed, low-voltage, and space-efficient code storage with robust security and seamless XIP capability - directly addressing limitations of legacy parallel and standard SPI flash.
FAQ
What is the maximum clock frequency supported by W25Q16FWUUIQ TR in Quad SPI mode?
The W25Q16FWUUIQ TR supports up to 104 MHz clock frequency in Quad SPI mode, delivering an effective data rate of 416 MB/s using Fast Read Quad I/O (EBh) instructions. This is confirmed in Section 9.6 of the Winbond datasheet Revision J, with timing validated under 1.65–1.95 V supply and –40°C to +85°C conditions. The W25Q16FWUUIQ TR achieves this while maintaining setup/hold margins for reliable operation in high-noise industrial environments.
Does W25Q16FWUUIQ TR support execute-in-place (XIP) functionality?
Yes, the W25Q16FWUUIQ TR supports true XIP via Continuous Read Mode with ≤8-clock instruction overhead and configurable 8/16/32/64-byte wrap lengths. When paired with a QSPI-capable MCU (e.g., STM32L4, NXP i.MX RT), the W25Q16FWUUIQ TR enables direct code execution without RAM loading - reducing boot time and memory footprint. This is explicitly documented in Section 1 and Figure 3 of the datasheet.
How is Quad SPI mode enabled on W25Q16FWUUIQ TR?
Quad SPI mode on the W25Q16FWUUIQ TR is enabled by setting the non-volatile Quad Enable (QE) bit in Status Register-2 using the Write Status Register-2 (31h) instruction. Once QE=1, the /WP and /HOLD pins become IO2 and IO3 respectively. This configuration persists across power cycles and is required before issuing Quad SPI commands like Fast Read Quad I/O (EBh). The W25Q16FWUUIQ TR datasheet confirms QE is non-volatile and factory-defaults to 0.
What package type does W25Q16FWUUIQ TR use, and is it RoHS-compliant?
W25Q16FWUUIQ TR uses an 8-pad USON 2x3-mm package (Package Code UX) with exposed thermal pad, as specified in Section 10.5 of the Winbond datasheet. It is fully RoHS-compliant and lead-free, with moisture sensitivity level (MSL) 3 per J-STD-020. The W25Q16FWUUIQ TR's USON footprint reduces PCB area by ~60% versus SOIC8 while maintaining thermal performance via the exposed pad.
Does W25Q16FWUUIQ TR include hardware write protection beyond software status bits?
Yes, the W25Q16FWUUIQ TR provides dual-layer write protection: hardware pins (/WP and /HOLD) and software-configurable status register bits (BP2–BP0, TB, SEC, CMP). The /WP pin, when asserted low and QE=0, prevents status register writes regardless of software state - offering fail-safe protection against accidental firmware corruption. This hardware lock is independent of the W25Q16FWUUIQ TR's internal register settings and remains active during power transitions.
W25Q16FWUUIQ TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-UFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 60µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 1.65V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-USON (4x3)
W25Q16FWUUIQ TR FAQ
1.How can I place an order for W25Q16FWUUIQ TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q16FWUUIQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q16FWUUIQ TR reliable?
The price and inventory of W25Q16FWUUIQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q16FWUUIQ TR is usually 5 days.
3.What payment methods are accepted for W25Q16FWUUIQ TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q16FWUUIQ TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q16FWUUIQ TR?
W25Q16FWUUIQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q16FWUUIQ TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q16FWUUIQ TR?
For technical support, including W25Q16FWUUIQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q16FWUUIQ TR requirements.
6.How does Aetrix verify that W25Q16FWUUIQ TR is sourced from the original manufacturer or authorized distributors?
All W25Q16FWUUIQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q16FWUUIQ TR meets industry standards.
7.What is the process for return or replacement of W25Q16FWUUIQ TR?
All W25Q16FWUUIQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q16FWUUIQ TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q16FWUUIQ TR part is unused and in its original packaging.
Return procedure for W25Q16FWUUIQ TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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