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Winbond Electronics Corporation W25Q16JVUUIQ TR

Part No.:
W25Q16JVUUIQ TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-UFDFN Exposed Pad
Datasheet:
AetrixW25Q16JVUUIQ TR.pdf
Description:
IC FLASH 16MBIT SPI/QUAD 8USON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:10,010

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Product details

Overview

W25Q16JVUUIQ TR from Winbond is a 16 Mbit (2 MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with up to 133 MHz clock frequency, 4 KB uniform sector architecture, and hardware/software write protection. It operates from 2.7–3.6 V, consumes <1 µA in power-down mode, and targets embedded boot code storage and XIP execution in space-constrained industrial and consumer systems.

For engineers reviewing the W25Q16JVUUIQ TR datasheet, W25Q16JVUUIQ TR pinout, W25Q16JVUUIQ TR application, or W25Q16JVUUIQ TR equivalent, key selection considerations include Quad SPI timing compliance (QE bit configuration), /HOLD vs. /RESET pin availability per package, 4 KB sector erase granularity, JEDEC ID and SFDP register support, and OTP-locked security register capability.

Technical Context

The W25Q16JVUUIQ TR implements a flexible SPI-compatible interface with three operational modes: Standard (DI/DO), Dual (IO0/IO1), and Quad (IO0–IO3), where Quad mode requires non-volatile QE bit = 1 in Status Register-2. Its memory array comprises 8,192 × 256-byte pages organized into 512 erasable 4 KB sectors and 32 erasable 64 KB blocks.

It integrates volatile/non-volatile status register bits (BP2–BP0, TB, SEC, CMP, SRP, WPS), three 256-byte one-time-programmable (OTP) security registers, and a 64-bit unique ID. Write protection combines hardware (/WP pin active-low), software (status register bits), and individual block/sector lock mechanisms - all configurable without external components.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (2,097,152 bytes), organized as 8,192 × 256-byte pages
SPI Interface Modes Standard (DI/DO), Dual (IO0/IO1), Quad (IO0–IO3); QE bit enables Quad I/O
Max Clock Frequency 133 MHz (single), enabling 266 MB/s dual and 532 MB/s quad effective throughput
Erase Granularity Uniform 4 KB sectors (512 total), 32 KB blocks (128 per block), 64 KB blocks (32 per block)
Write Endurance & Retention 100,000 program/erase cycles per sector; >20 years data retention at +25°C
Supply Voltage & Temp Range 2.7–3.6 V operation; rated for –40°C to +85°C (industrial grade)
Power-Down Current <1 µA typical - enables ultra-low-power standby in battery-backed systems

Pinout & Package

W25Q16JVUUIQ TR uses an 8-pin USON 2×3 mm package (Package Code UX), with exposed pad for thermal dissipation and no internal die attach pad. Pin functions are identical across SOIC, WSON, XSON, and USON variants per datasheet Section 3.3.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable; high-impedance DO during deselect; must track VCC at power-up/down
2 DO (IO1) Data Output / I/O1 Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI
3 /WP (IO2) Write Protect Input / I/O2 Active-low hardware lock for status register; becomes IO2 when QE=1
4 GND Ground Reference Primary return path; connects to PCB ground plane for noise immunity and thermal conduction
5 DI (IO0) Data Input / I/O0 Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI
6 CLK Serial Clock Input Edge-triggered timing reference; supports SPI Mode 0 and Mode 3
7 /HOLD (IO3) Hold Input / I/O3 Pauses ongoing read/write; becomes IO3 in Quad mode when QE=1; not /RESET in USON
8 VCC Power Supply 2.7–3.6 V core supply; decoupling capacitor required within 5 mm of pin

Key Features

Feature Design Value
Quad SPI XIP Support Enables direct code execution from flash via Fast Read Quad I/O (EBh), reducing RAM footprint
Individual Block Lock 30 × 64 KB blocks + 32 × 4 KB top/bottom sectors each have dedicated OTP-lockable bits
Security Registers Three 256-byte OTP-locked registers for keys, certificates, or firmware signatures
JEDEC & SFDP Compliance Read Manufacturer/Device ID (9Fh) and Serial Flash Discoverable Parameters (5Ah) for auto-configuration
Erase/Program Suspend Allows background operations (e.g., read) during long erase/program cycles using 75h/7Ah

Applications

Industrial PLC Firmware Storage IoT Edge Device Boot Code

Use Scenario: Storing firmware images and configuration parameters in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic startup sequence and field-upgradable firmware via Quad SPI interface.

Use Value: 4 KB sector erase enables granular firmware patching without full reflash; -40°C to +85°C rating ensures reliability in uncontrolled cabinet temperatures.

Use Scenario: Hosting bootloader and secure application firmware on battery-powered wireless sensor nodes with constrained PCB area.

IC Role / Device Role / Timing Role: Primary code storage device supporting XIP execution to minimize RAM usage and reduce BOM cost.

Use Value: <1 µA power-down current extends battery life; 64-bit unique ID enables device-specific key provisioning in zero-touch onboarding.

Medical Diagnostic Display UI Automotive Infotainment HMI

Use Scenario: Storing graphical assets, font libraries, and localized language strings for high-resolution medical display panels.

IC Role / Device Role / Timing Role: High-bandwidth serial flash delivering burst-read graphics data to display controller over Quad SPI.

Use Value: 133 MHz clock + 532 MB/s effective throughput meets real-time rendering latency requirements; hardware /WP pin prevents accidental UI corruption during ESD events.

Use Scenario: Holding infotainment OS kernel, driver modules, and voice recognition models in automotive head units.

IC Role / Device Role / Timing Role: Trusted boot memory with OTP security registers storing cryptographic keys for secure boot validation.

Use Value: Three 256-byte OTP-locked security registers provide tamper-resistant key storage; JEDEC ID allows runtime verification of flash authenticity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L1606EZUI-12G 16 Mbit, 86 MHz max clock, no Quad I/O support, no SFDP register, no unique ID Lacks XIP performance and auto-configuration capability; suitable only for legacy SPI-only designs Select only if system lacks Quad SPI controller or requires pin-to-pin compatibility with older MX25L family
S25FL116K0XMFI011 16 Mbit, 104 MHz max clock, supports Quad SPI but requires different QE bit location (SR1[6]), no OTP security registers Lower bandwidth limits real-time graphics loading; missing OTP registers reduce secure boot flexibility Prefer when Cypress toolchain integration or specific AEC-Q100 qualification is mandatory

Compared with MX25L1606EZUI-12G and S25FL116K0XMFI011, W25Q16JVUUIQ TR delivers higher throughput (133 MHz vs ≤104 MHz), integrated SFDP for plug-and-play initialization, and dedicated OTP security registers - making it optimal for new designs requiring XIP, secure boot, and future-proof configurability.

Availability

W25Q16JVUUIQ TR is available at Aetrix Electronics and suitable for industrial PLCs, IoT edge gateways, medical displays, automotive HMIs, and consumer electronics requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for W25Q16JVUUIQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, serial flash, and mobile DRAM solutions since 1987.

The W25Q series was designed for high-reliability embedded systems requiring fast, secure, and space-efficient code and data storage - with emphasis on Quad SPI performance, robust write protection, and industrial temperature operation.

FAQ

What is the package type and lead count of W25Q16JVUUIQ TR?

W25Q16JVUUIQ TR uses an 8-pin USON (Ultra Thin Small Outline No-lead) package measuring 2 mm × 3 mm × 0.6 mm (Package Code UX). It has no leads - solder pads are located on the bottom perimeter, and the package includes an exposed thermal pad. This compact footprint supports high-density PCB layouts in portable and space-constrained applications.

Does W25Q16JVUUIQ TR support hardware reset via /RESET pin?

No, W25Q16JVUUIQ TR does not include a dedicated hardware /RESET pin. The /HOLD pin (Pin 7) serves as /HOLD in Standard/Dual SPI mode and becomes IO3 in Quad SPI mode when QE=1. Hardware reset is only available on SOIC-16 and TFBGA packages per Winbond documentation - the USON 2×3-mm variant relies solely on software reset (66h + 99h instructions).

How is Quad SPI mode enabled on W25Q16JVUUIQ TR?

Quad SPI mode on W25Q16JVUUIQ TR is enabled by setting the Quad Enable (QE) bit in Status Register-2. This bit is non-volatile and must be written using Write Status Register-2 (31h) instruction. Once QE=1, pins /WP (Pin 3) and /HOLD (Pin 7) become IO2 and IO3 respectively, allowing four-bit-wide data transfers using instructions like Fast Read Quad I/O (EBh).

What write protection mechanisms does W25Q16JVUUIQ TR provide?

W25Q16JVUUIQ TR provides layered write protection: hardware-level via active-low /WP pin, software-level via status register bits (BP2–BP0, TB, SEC, CMP), and OTP-level via individual block/sector lock bits. The WPS bit in Status Register-3 selects between status-register-based or individual-lock-based schemes. All methods operate concurrently and require explicit unlock sequences before modification.

Is W25Q16JVUUIQ TR compatible with JEDEC-standard SFDP?

Yes, W25Q16JVUUIQ TR fully supports the JEDEC JESD216 standard Serial Flash Discoverable Parameters (SFDP) register, accessible via instruction 5Ah. This enables automatic detection of memory size, erase block structure, timing parameters, and feature support - simplifying driver development and eliminating hardcoded configuration in host firmware.

W25Q16JVUUIQ TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-UFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
16Mbit
Memory Organization:
2M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-USON (4x3)

W25Q16JVUUIQ TR FAQ

1.How can I place an order for W25Q16JVUUIQ TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q16JVUUIQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q16JVUUIQ TR reliable?

The price and inventory of W25Q16JVUUIQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q16JVUUIQ TR is usually 5 days.

3.What payment methods are accepted for W25Q16JVUUIQ TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q16JVUUIQ TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q16JVUUIQ TR?

W25Q16JVUUIQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q16JVUUIQ TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q16JVUUIQ TR?

For technical support, including W25Q16JVUUIQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q16JVUUIQ TR requirements.

6.How does Aetrix verify that W25Q16JVUUIQ TR is sourced from the original manufacturer or authorized distributors?

All W25Q16JVUUIQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q16JVUUIQ TR meets industry standards.

7.What is the process for return or replacement of W25Q16JVUUIQ TR?

All W25Q16JVUUIQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q16JVUUIQ TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q16JVUUIQ TR part is unused and in its original packaging.

Return procedure for W25Q16JVUUIQ TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q16JVUUIQ TR Tags

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