Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W25Q16JWSSIM TR

Part No.:
W25Q16JWSSIM TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-SOIC (0.209", 5.30mm Width)
Datasheet:
AetrixW25Q16JWSSIM TR.pdf
Description:
IC FLASH 16MBIT SPI/QUAD 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,944

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W25Q16JWSSIM TR from Winbond is a 1.8V, 16M-bit (2MB) serial flash memory IC supporting Standard, Dual, and Quad SPI interfaces with up to 133MHz Quad I/O clock rate, 4KB uniform sector architecture, and hardware/software write protection - used for code execution (XIP), firmware storage, and parameter retention in space-constrained industrial microcontroller systems.

For engineers reviewing the W25Q16JWSSIM TR datasheet, W25Q16JWSSIM TR pinout, W25Q16JWSSIM TR application, or W25Q16JWSSIM TR equivalent, key selection criteria include 1.65–1.95V supply compatibility, -40°C to +85°C industrial grade operation, Quad Enable (QE) bit configuration, /WP and /HOLD pin functionality in Dual/Quad modes, and 4KB sector erase granularity for embedded firmware updates.

Technical Context

The W25Q16JWSSIM TR implements a flexible SPI interface with three operational modes: Standard (DI/DO), Dual (IO0/IO1), and Quad (IO0–IO3), where IO2 and IO3 are remapped from /WP and /HOLD only when the non-volatile Quad Enable (QE) bit in Status Register-2 is set. It supports JEDEC-standard manufacturer/device ID, SFDP register, and 64-bit unique serial number for system identification and configuration discovery.

Its memory array comprises 8192 × 256-byte pages organized into 512 erasable 4KB sectors and 32 erasable 64KB blocks, enabling fine-grained firmware partitioning. Erase/program suspend/resume capability allows background operations without halting host communication, while volatile/non-volatile status register bits (BP2–BP0, TB, SEC, CMP, SRP, WPS) provide layered, configurable write protection schemes.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 M-bit (2,097,152 bytes) - supports full firmware images for mid-tier MCUs without external memory expansion.
Supply Voltage 1.65 V to 1.95 V - compatible with 1.8V logic domains and low-power industrial SoCs.
Quad SPI Clock Rate Up to 133 MHz - enables 532 MB/s effective throughput (133 MHz × 4 lines) for fast XIP or boot code loading.
Operating Temperature -40°C to +85°C - qualified for industrial-grade applications including PLCs, gateways, and motor controllers.
Erase Granularity 4 KB sectors (512 total), 32 KB & 64 KB blocks - allows atomic firmware patching and parameter zone isolation.
Endurance & Retention 100,000 program/erase cycles; >20 years data retention - suitable for field-upgradable systems with frequent OTA updates.
Security Features Three 256-byte security registers, 64-bit unique ID, OTP-lockable sectors - supports secure boot key storage and device identity binding.

Pinout & Package

W25Q16JWSSIM TR is supplied in an 8-pin SOIC 208-mil package (Package Code SS), with lead-free, RoHS-compliant construction and moisture sensitivity level (MSL) 3 per J-STD-020.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable signal; must track VCC during power-up/down to prevent spurious commands.
2 DO (IO1) Data Output / I/O1 Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad modes for high-speed read transfers.
3 /WP (IO2) Write Protect Input / I/O2 Hardware write lock for status register; repurposed as IO2 in Quad mode when QE=1.
4 GND Ground Reference Primary return path for VCC and I/O signals; requires low-impedance PCB connection for noise immunity.
5 DI (IO0) Data Input / I/O0 Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad modes for instruction/address/data transfer.
6 CLK Serial Clock Input Master-generated timing reference; supports SPI modes 0 and 3; max 133 MHz in Quad I/O configuration.
7 /HOLD (IO3) Hold Input / I/O3 Pauses ongoing SPI transaction; repurposed as IO3 in Quad mode when QE=1; not available on all packages.
8 VCC Power Supply 1.65–1.95 V core supply; decoupling capacitor (0.1 µF) required within 5 mm of pin for stable operation.

Key Features

Feature Design Value
Dual/Quad SPI XIP Support Enables direct code execution from flash via Fast Read Dual/Quad I/O instructions, reducing RAM footprint and boot latency.
Erase/Program Suspend Allows host to pause long erase/program operations and service time-critical interrupts, then resume without data loss.
Configurable Write Protection Combines volatile/non-volatile status bits (BP2–BP0, TB, SEC), hardware /WP pin, and individual block locks for multi-layer firmware integrity.
JEDEC SFDP & Unique ID Provides standardized, host-readable parameter tables and immutable device identity for automated BOM validation and secure provisioning.
Low-Power Operation 0.1 µA typical standby current and fast wake-up (<5 µs) support battery-backed or energy-harvesting edge nodes.

Applications

Firmware Storage in Industrial MCU Secure Boot Code Execution

Use Scenario: Storing bootloader and application firmware for ARM Cortex-M4-based programmable logic controllers operating in factory-floor environments.

IC Role / Device Role / Timing Role: Non-volatile code storage with Quad SPI XIP capability and hardware write protection to prevent corruption during brown-out events.

Use Value: Eliminates need for external parallel NOR flash; 4KB sector erase enables safe over-the-air firmware updates without risking entire image loss.

Use Scenario: Hosting signed boot code and public key certificates in medical IoT gateways requiring FIPS-aligned secure boot chains.

IC Role / Device Role / Timing Role: Trusted root-of-trust storage with OTP-locked security registers and 64-bit unique ID for cryptographic attestation.

Use Value: Prevents unauthorized firmware replacement via hardware-enforced write locks and tamper-evident sector-level protection.

Parameter & Calibration Data Logging Edge AI Model Configuration Storage

Use Scenario: Recording sensor calibration coefficients and runtime configuration parameters in automotive-grade telematics control units.

IC Role / Device Role / Timing Role: High-reliability parameter storage with 100K endurance cycles and 20-year data retention at 85°C.

Use Value: Supports field recalibration without solder rework; individual sector locking isolates critical calibration data from user-modifiable settings.

Use Scenario: Holding neural network weight offsets and inference engine configuration metadata in smart camera modules with limited PCB area.

IC Role / Device Role / Timing Role: Compact, high-bandwidth configuration store interfaced via Quad SPI to reduce host CPU load during model initialization.

Use Value: 133 MHz Quad I/O delivers >50 MB/s config load speed, cutting cold-start latency by >60% versus standard SPI alternatives.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L1633FZC-12G 1.8V, 16Mb, supports DTR Quad SPI up to 80MHz; lacks SFDP register and unique ID; no /HOLD-to-IO3 remapping. Suitable for cost-sensitive consumer designs where advanced discovery and identity features are unnecessary. Select when legacy SPI controller compatibility is prioritized over JEDEC SFDP auto-configuration and device fingerprinting.
AT25SF161-SSHD-B 1.8V, 16Mb, supports Quad SPI up to 104MHz; includes hardware reset pin; no individual block lock bits or OTP security registers. Better suited for systems requiring dedicated hardware reset coordination across multiple peripherals. Choose when deterministic hardware reset integration outweighs granular sector locking and cryptographic key storage needs.

Compared with MX25L1633FZC-12G and AT25SF161-SSHD-B, the W25Q16JWSSIM TR provides superior configurability via SFDP, stronger security with OTP-locked sectors and 64-bit UID, and finer 4KB erase control - making it optimal for industrial firmware update resilience and secure provisioning workflows.

Availability

W25Q16JWSSIM TR is available at Aetrix Electronics and suitable for industrial automation controllers, medical edge devices, and automotive telematics modules requiring stable component supply, extended temperature operation, and long-term firmware update support.

Supply support for W25Q16JWSSIM TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based global semiconductor company specializing in specialty DRAM, serial flash, and mobile DRAM solutions for industrial, communications, and consumer markets.

The W25Q series was designed specifically for high-performance, low-voltage embedded systems requiring robust code storage, secure boot capabilities, and seamless SPI interface scalability from Standard to Quad I/O.

FAQ

What is the operating voltage range for the W25Q16JWSSIM TR?

The W25Q16JWSSIM TR operates from 1.65 V to 1.95 V. This narrow 1.8V nominal range ensures compatibility with modern ultra-low-power microcontrollers and reduces system-level voltage translation complexity. Operation outside this window may cause undefined behavior or permanent damage. The W25Q16JWSSIM TR includes internal voltage monitoring that places the device in reset if VCC drops below the threshold (VWI), preventing spurious writes during brown-out conditions.

Does the W25Q16JWSSIM TR support Quad SPI mode, and how is it enabled?

Yes, the W25Q16JWSSIM TR supports Quad SPI mode using instructions like Fast Read Quad I/O (EBh). Activation requires setting the Quad Enable (QE) bit in Status Register-2 via Write Status Register-2 (31h) instruction. When QE = 1, the /WP and /HOLD pins become IO2 and IO3 respectively. The W25Q16JWSSIM TR does not support volatile QE - the bit is non-volatile and retains state across power cycles unless explicitly cleared.

What package type is used for the W25Q16JWSSIM TR?

The W25Q16JWSSIM TR uses an 8-pin SOIC 208-mil package (Package Code SS), with gull-wing leads, Pb-free finish, and RoHS compliance. Its 5.3 mm × 5.3 mm body size and 0.65 mm lead pitch allow reliable hand-soldering and automated assembly. This package variant includes /HOLD functionality but does not include a dedicated hardware /RESET pin - that feature is reserved for SOIC-16 and TFBGA packages per Winbond documentation.

How many program/erase cycles does the W25Q16JWSSIM TR guarantee?

The W25Q16JWSSIM TR guarantees a minimum of 100,000 program/erase cycles per sector, validated across the full operating temperature range (-40°C to +85°C). This endurance rating applies to all 4KB sectors and is supported by on-die wear leveling management. Each cycle includes full page programming (up to 256 bytes) and sector erasure. Endurance is unaffected by use of Dual or Quad SPI modes, as the underlying NAND-like memory array operation remains unchanged.

Can the W25Q16JWSSIM TR be used for secure boot applications?

Yes, the W25Q16JWSSIM TR supports secure boot through multiple hardware-enforced mechanisms: three 256-byte OTP-lockable security registers for storing cryptographic keys, a factory-programmed 64-bit unique ID for device attestation, and configurable write protection (via BP bits, TB, SEC, and individual block locks) to prevent unauthorized firmware modification. These features are integral to the W25Q16JWSSIM TR design and require no external components to implement a trusted boot chain.

W25Q16JWSSIM TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-SOIC (0.209", 5.30mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
16Mbit
Memory Organization:
2M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
1.65V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

W25Q16JWSSIM TR FAQ

1.How can I place an order for W25Q16JWSSIM TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q16JWSSIM TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q16JWSSIM TR reliable?

The price and inventory of W25Q16JWSSIM TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q16JWSSIM TR is usually 5 days.

3.What payment methods are accepted for W25Q16JWSSIM TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q16JWSSIM TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q16JWSSIM TR?

W25Q16JWSSIM TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q16JWSSIM TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q16JWSSIM TR?

For technical support, including W25Q16JWSSIM TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q16JWSSIM TR requirements.

6.How does Aetrix verify that W25Q16JWSSIM TR is sourced from the original manufacturer or authorized distributors?

All W25Q16JWSSIM TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q16JWSSIM TR meets industry standards.

7.What is the process for return or replacement of W25Q16JWSSIM TR?

All W25Q16JWSSIM TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q16JWSSIM TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q16JWSSIM TR part is unused and in its original packaging.

Return procedure for W25Q16JWSSIM TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q16JWSSIM TR Tags

  • W25Q16JWSSIM TR
  • W25Q16JWSSIM TR PDF
  • W25Q16JWSSIM TR Datasheet
  • W25Q16JWSSIM TR Specifications
  • W25Q16JWSSIM TR Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W25Q16JWSSIM TR
  • Buy W25Q16JWSSIM TR
  • W25Q16JWSSIM TR Price
  • W25Q16JWSSIM TR Distributor
  • W25Q16JWSSIM TR Supplier
  • W25Q16JWSSIM TR Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER