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Winbond Electronics Corporation W25Q256FVBIF TR

Part No.:
W25Q256FVBIF TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25Q256FVBIF TR.pdf
Description:
IC FLASH 256MBIT SPI 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,742

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Product details

Overview

W25Q256FVBIF TR from Winbond is a 256M-bit (32MB) serial NOR flash memory supporting Standard/Dual/Quad SPI and QPI interfaces, operating at 2.7–3.6V with 104MHz clock, 4KB uniform sector erase, and 256-byte page programming. It enables XIP execution in embedded boot code storage, firmware update storage, and parameter retention applications.

For engineers reviewing the W25Q256FVBIF TR datasheet, W25Q256FVBIF TR pinout, W25Q256FVBIF TR application, or W25Q256FVBIF TR equivalent, key selection criteria include 4-byte addressing support, Quad Enable (QE) bit configuration, /HOLD or /RESET dual-function pin behavior in WSON-8 package, and JEDEC SFDP register compatibility for auto-configuration.

Technical Context

The W25Q256FVBIF TR implements a flexible SPI-compatible command set with three address modes (3-byte, 4-byte, and ADP-configurable power-up default), enabling seamless migration from legacy 16MB devices. Its status register architecture includes volatile/non-volatile BP bits, QE bit (SR2[1]), HOLD/RST function select (SR2[6]), and DRV strength control (SR2[5:4]).

It supports true execute-in-place (XIP) via Continuous Read Mode with ≤8-clock instruction overhead and wrap lengths of 8/16/32/64 bytes. Erase/program suspend/resume functionality allows concurrent background operations while servicing host requests - critical for real-time firmware update scenarios.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 M-bit (32 MB), organized as 131,072 × 256-byte pages
Interface Support Standard/Dual/Quad SPI + QPI; IO0–IO3 active only when QE=1
Max Clock Frequency 104 MHz SPI; enables 416 MB/s quad I/O effective throughput
Erase Granularity Uniform 4 KB sectors (8,192 total), plus 32 KB/64 KB blocks and chip erase
Write Endurance ≥100,000 program/erase cycles per sector
Data Retention ≥20 years at +25°C; validated per JEDEC JESD22-A117
Operating Voltage 2.7 V to 3.6 V single supply; no external voltage regulators required
Temperature Range −40°C to +85°C industrial grade; qualified per AEC-Q100 not claimed

Pinout & Package

W25Q256FVBIF TR uses an 8-pad WSON 8×6 mm (Package Code E) with exposed thermal pad. Pin functions are shared across SPI modes: IO0/IO1 used in Standard/Dual SPI; all four IOs active only in Quad SPI when QE bit is set.

Pin/Terminal Circuit Role Design Meaning
/CS Chip Select Input Active-low enable; high-impedance DO during deselect; required high→low transition after power-up before first command
DO (IO1) Data Output / Bidirectional I/O Unidirectional output in Standard SPI; bidirectional in Dual/Quad SPI; high-Z when /HOLD asserted
/WP (IO2) Write Protect Input / Bidirectional I/O Hardware write lock for status register when QE=0; becomes IO2 in Quad SPI mode (QE=1)
GND Ground Reference Primary return path for VCC and I/O signals; requires low-inductance connection to PCB ground plane
DI (IO0) Data Input / Bidirectional I/O Unidirectional input in Standard SPI; bidirectional in Dual/Quad SPI; sampled on CLK rising edge
CLK Serial Clock Input Master-generated timing reference; defines setup/hold windows for all I/O transitions
/HOLD or /RESET (IO3) Hold/Reset Input / Bidirectional I/O Pauses ongoing operation when low (/HOLD); resets internal state when pulsed (/RESET); becomes IO3 in Quad SPI (QE=1)
VCC Power Supply 2.7–3.6 V core and I/O supply; decoupling capacitor (≥1 µF X7R) required within 5 mm of pin

Key Features

Feature Design Value
Quad Peripheral Interface (QPI) Reduces instruction overhead to 2 clocks per command, enabling deterministic XIP latency vs. standard SPI
Erase/Program Suspend & Resume Allows host to pause background erase/program and service time-critical reads without data loss or timeout failure
64-bit Unique ID Factory-programmed per-device serial number accessible via 4Bh instruction; enables secure device binding and traceability
JEDEC SFDP Register Standardized flash parameter table (5Ah) readable at power-up; eliminates hard-coded timing assumptions in bootloader
Security Registers (3 × 256 B) OTP-lockable memory space for keys, certificates, or calibration data; protected by LB1–LB3 bits in Status Register-3
Configurable Drive Strength DRV0/DRV1 bits (SR2[5:4]) adjust output driver strength to match PCB trace impedance and reduce signal integrity issues

Applications

Boot Code Storage Firmware Update Storage

Use Scenario: Storing primary bootloader and initial firmware image for microcontrollers with limited internal flash.

IC Role / Device Role / Timing Role: Non-volatile code storage accessed via XIP-capable SPI controller during cold start.

Use Value: Enables fast, deterministic boot (<50 ms) using Continuous Read Mode with 8-byte wrap; eliminates need for RAM copy stage.

Use Scenario: Holding field-upgradable firmware images in IoT gateways and industrial PLCs.

IC Role / Device Role / Timing Role: Dual-bank storage partitioning with atomic swap capability using sector-level erase isolation.

Use Value: Supports fail-safe over-the-air updates: new image written to spare sectors while active firmware runs; verified before reset.

Parameter & Configuration Storage Audio/Video Asset Caching

Use Scenario: Retaining user settings, calibration coefficients, and network credentials across power cycles in medical instruments.

IC Role / Device Role / Timing Role: Low-power, byte-addressable nonvolatile storage accessed infrequently but requiring high endurance.

Use Value: 100,000+ erase cycles and 20-year retention ensure reliability over product lifetime; 4KB sectors minimize wear during small writes.

Use Scenario: Caching audio samples or UI assets in smart speakers and digital signage controllers.

IC Role / Device Role / Timing Role: High-throughput sequential read buffer supplementing DRAM bandwidth limitations.

Use Value: 416 MB/s quad I/O throughput delivers >30 MB/s sustained read rate-sufficient for uncompressed stereo PCM streaming.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L25673FMI-10G Same density, 104 MHz max, but lacks QPI mode and SFDP register; uses different security register layout No native XIP optimization; requires custom driver for 4-byte addressing; no standardized parameter discovery Prefer W25Q256FVBIF TR when QPI, SFDP, or suspend/resume are required for bootloader or OTA use cases.
S25FL256SAGMFV001 133 MHz max clock, HyperBus interface option, integrated ECC, but larger 16-pin SOIC package Better error resilience for long-term data logging; HyperBus enables higher bandwidth than SPI but needs dedicated controller Choose W25Q256FVBIF TR for space-constrained designs needing WSON-8 footprint and full SPI/QPI compatibility.

Compared with MX25L25673FMI-10G and S25FL256SAGMFV001, the W25Q256FVBIF TR offers superior XIP efficiency via QPI and standardized configuration via SFDP, while maintaining the smallest 8-pad WSON package among 256M-bit alternatives - critical for portable and cost-sensitive embedded systems.

Availability

W25Q256FVBIF TR is available at Aetrix Electronics and suitable for boot code storage, firmware update storage, and parameter & configuration storage requiring stable component supply, long-term lifecycle assurance, and industrial temperature compliance.

Supply support for W25Q256FVBIF TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and mobile DRAM.

The W25Q series targets embedded systems requiring high-reliability, low-power, and multi-interface serial flash - designed specifically for code execution, firmware storage, and secure parameter retention in resource-constrained environments.

FAQ

What is the package type and footprint of the W25Q256FVBIF TR?

The W25Q256FVBIF TR uses an 8-pad WSON 8×6 mm package (Package Code E) with exposed thermal pad. It has no leads and requires solder paste stencil design per IPC-7351B for reliable reflow. The pinout matches Figure 1a in the datasheet: /CS, DO(IO1), /WP(IO2), GND, DI(IO0), CLK, /HOLD or /RESET(IO3), VCC - with IO2 and IO3 repurposed as bidirectional data lines when Quad Enable (QE) is set.

Does the W25Q256FVBIF TR support 4-byte addressing, and how is it enabled?

Yes, the W25Q256FVBIF TR supports both 3-byte and 4-byte addressing modes. 4-byte mode is entered using the Enter 4-Byte Address Mode instruction (B7h) and exited with E9h. The Power-Up Address Mode (ADP) bit in Status Register-2 determines default behavior at power-on; ADP=1 sets 4-byte mode by default, ADP=0 defaults to 3-byte mode - configurable via Write Status Register-2 (31h).

How does the /HOLD and /RESET pin function differ between Standard SPI and Quad SPI modes on the W25Q256FVBIF TR?

In Standard/Dual SPI (QE=0), Pin 7 functions as /HOLD or /RESET depending on the HOLD/RST bit (SR2[6]); in Quad SPI (QE=1), that same pin becomes IO3 and the /HOLD and /RESET functions are disabled. The /RESET pin is only physically present on SOIC-16 packages (Package Code F); WSON-8 relies on software reset (66h/99h) or hardware reset via IO3 when configured accordingly.

What is the purpose of the Quad Enable (QE) bit in the W25Q256FVBIF TR, and where is it located?

The Quad Enable (QE) bit is bit 1 of Status Register-2 (SR2). When QE=1, the /WP and /HOLD pins become IO2 and IO3 respectively, enabling full Quad SPI operation. QE is non-volatile and persistent across power cycles. It must be set via Write Status Register-2 (31h) before issuing Quad SPI commands; attempting Quad instructions with QE=0 results in undefined behavior or ignored commands.

Can the W25Q256FVBIF TR be used for secure key storage, and what hardware features support this?

Yes, the W25Q256FVBIF TR includes three 256-byte Security Registers (SR1–SR3) with One-Time-Programmable (OTP) lock bits (LB1–LB3 in Status Register-3). Once locked, contents cannot be overwritten or read back - ideal for storing cryptographic keys, device certificates, or calibration secrets. Access requires specific unlock sequences (42h/44h/48h), and OTP locking is irreversible.

W25Q256FVBIF TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (6x8)

W25Q256FVBIF TR FAQ

1.How can I place an order for W25Q256FVBIF TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q256FVBIF TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q256FVBIF TR reliable?

The price and inventory of W25Q256FVBIF TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256FVBIF TR is usually 5 days.

3.What payment methods are accepted for W25Q256FVBIF TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256FVBIF TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q256FVBIF TR?

W25Q256FVBIF TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q256FVBIF TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q256FVBIF TR?

For technical support, including W25Q256FVBIF TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256FVBIF TR requirements.

6.How does Aetrix verify that W25Q256FVBIF TR is sourced from the original manufacturer or authorized distributors?

All W25Q256FVBIF TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256FVBIF TR meets industry standards.

7.What is the process for return or replacement of W25Q256FVBIF TR?

All W25Q256FVBIF TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256FVBIF TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q256FVBIF TR part is unused and in its original packaging.

Return procedure for W25Q256FVBIF TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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