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Winbond Electronics Corporation W25Q256FVBJQ

Part No.:
W25Q256FVBJQ
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25Q256FVBJQ.pdf
Description:
IC FLASH 256MBIT SPI 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,746

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Product details

Overview

W25Q256FVBJQ from Winbond is a 256M-bit (32MB) serial NOR flash memory supporting Standard/Dual/Quad SPI and QPI interfaces, organized into 131,072 × 256-byte pages with 4KB uniform sector erase, 104MHz max clock, and single 2.7–3.6V supply. It enables XIP execution in embedded boot code storage and firmware update applications.

For engineers reviewing the W25Q256FVBJQ datasheet, W25Q256FVBJQ pinout, W25Q256FVBJQ application, or W25Q256FVBJQ equivalent, key selection factors include 4-byte addressing support, Quad Enable (QE) bit configuration, /HOLD or /RESET dual-function pin behavior in WSON-8 package, and JEDEC SFDP register compatibility for auto-configuration.

Technical Context

The W25Q256FVBJQ implements a flexible SPI-compatible command set with hardware-accelerated erase/program suspend-resume, volatile/non-volatile status register control (BP0–BP3, TB, CMP, SRP0/SRP1), and configurable IO0–IO3 pin mapping dependent on QE bit state. Its architecture supports true execute-in-place (XIP) via Continuous Read Mode with ≤8-clock instruction overhead.

It integrates three 256-byte one-time-programmable (OTP) security registers, 64-bit unique ID, and JEDEC-standard SFDP register for parameter discovery. The device operates across –40°C to +85°C with 4mA active current and <1µA power-down current, meeting industrial-grade reliability requirements.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density256 M-bit (32 MB), organized as 131,072 × 256-byte programmable pages
Interface ModesStandard SPI (4-wire), Dual I/O SPI (5-wire), Quad I/O SPI (6-wire), QPI (6-wire, 2-cycle instruction)
Max Clock Frequency104 MHz standard/Dual/Quad SPI; enables 416 MB/s effective throughput in Quad I/O Fast Read mode
Erase GranularityUniform 4 KB sectors (8,192 total), 32 KB blocks (1,024), 64 KB blocks (512), and full-chip erase
Write Endurance≥100,000 program/erase cycles per sector, ≥20-year data retention at +85°C
Supply Voltage2.7 V to 3.6 V single supply; no external voltage regulators required for most MCU host systems
Operating Temperature–40°C to +85°C industrial grade; validated across full range for boot ROM and firmware storage

Pinout & Package

W25Q256FVBJQ is packaged in an 8-pad WSON 8×6 mm (Package Code E), RoHS-compliant, moisture-sensitive level 3 device with exposed thermal pad. Pin functions are shared across SPI modes and depend on Quad Enable (QE) bit setting in Status Register-2.

Pin/Terminal Circuit Role Design Meaning
1 /CSChip Select InputActive-low enable; high-impedance DO/IO pins when deasserted; must transition high→low after power-up before first instruction
2 DO (IO1)Data Output / Bidirectional I/OUnidirectional output in Standard SPI; bidirectional in Dual/Quad SPI; used for read data and status feedback
3 /WP (IO2)Write Protect Input / Bidirectional I/OHardware write lock for status register when QE=0; becomes IO2 in Quad SPI mode (QE=1)
4 GNDGround ReferencePrimary signal and power return path; requires low-impedance PCB connection to minimize noise coupling
5 DI (IO0)Data Input / Bidirectional I/OUnidirectional input in Standard SPI; bidirectional in Dual/Quad SPI; carries instructions, addresses, and write data
6 CLKSerial Clock InputEdge-triggered timing reference for all SPI operations; supports up to 104 MHz with controlled slew rate
7 /HOLD or /RESET (IO3)Hold or Reset Input / Bidirectional I/OPauses ongoing operation when asserted low (QE=0); functions as /RESET only in SOIC-16; becomes IO3 in Quad SPI (QE=1)
8 VCCPower Supply2.7–3.6 V main supply; decoupling capacitor (≥1 µF ceramic) required within 5 mm of pin

Key Features

Feature Design Value
Quad Peripheral Interface (QPI)Reduces instruction overhead to 2 clocks per command, enabling deterministic XIP latency and eliminating mode-switching delays
Erase/Program Suspend & ResumeAllows background interrupt servicing during long erase cycles without data corruption or timeout risk
JEDEC SFDP RegisterEnables automatic host controller configuration of timing parameters, address modes, and feature sets without hardcoded driver tables
64-bit Unique Serial NumberProvides cryptographically secure device identity for firmware binding, anti-cloning, and field inventory tracking
Three 256-byte Security RegistersSupports OTP-locked keys, certificates, or calibration data; independent from main array with dedicated erase/program commands

Applications

Boot Code Storage Firmware Over-the-Air (OTA) Update

Use Scenario: Storing primary bootloader and initial firmware image executed directly by ARM Cortex-M or RISC-V MCU upon reset.

IC Role / Device Role / Timing Role: Non-volatile boot ROM replacement with XIP-capable Quad SPI interface and 4-byte addressing for >16MB address space.

Use Value: Eliminates external parallel flash or RAM copy step; reduces BOM count and boot time by >30% versus legacy SPI flash.

Use Scenario: Hosting dual-bank firmware images for atomic OTA updates in smart meters and industrial gateways.

IC Role / Device Role / Timing Role: Dual-image storage medium with sector-level erase granularity and suspend/resume for safe background reprogramming.

Use Value: Enables zero-downtime field updates with verified rollback capability using hardware write protection and status register locking.

Secure Configuration Storage Audio/Video Asset Caching

Use Scenario: Storing encrypted device keys, TLS certificates, and calibrated sensor offsets in medical IoT edge nodes.

IC Role / Device Role / Timing Role: Tamper-resistant configuration vault leveraging OTP security registers and individual sector lock/unlock commands.

Use Value: Prevents unauthorized key extraction or parameter tampering while allowing field updates to non-critical configuration sectors.

Use Scenario: Caching compressed audio samples or UI assets in automotive infotainment head units with limited DRAM.

IC Role / Device Role / Timing Role: High-throughput streaming buffer using Continuous Read Mode with 8/16/32/64-byte wrap and 50 MB/s sustained read rate.

Use Value: Delivers smooth playback without DRAM buffering; reduces system latency by bypassing CPU-mediated data transfers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L25645GMI-10GSame density and 3.3V supply; supports DTR Quad SPI but lacks QPI mode and SFDP registerNo auto-configuration capability; requires fixed driver timing tables and manual 4-byte mode entryPrefer W25Q256FVBJQ when QPI or SFDP-driven flexibility is needed; MX25L25645GMI-10G suits cost-sensitive designs with static timing
S25FL256SAGMFI000Includes built-in ECC and error recovery; supports 133 MHz clock but uses different status register layout and security modelBetter suited for safety-critical automotive boot where bit errors must be corrected in real timeChoose W25Q256FVBJQ for general-purpose industrial firmware storage; select S25FL256SAGMFI000 only if AEC-Q100 qualification and ECC are mandatory

Compared with MX25L25645GMI-10G and S25FL256SAGMFI000, the W25Q256FVBJQ offers superior configurability via SFDP and QPI, broader industrial temperature validation, and simpler security register management-making it optimal for scalable embedded firmware platforms requiring field-upgradable, vendor-agnostic flash drivers.

Availability

W25Q256FVBJQ is available at Aetrix Electronics and suitable for boot code storage, firmware OTA updates, secure configuration storage, and audio/video asset caching requiring stable component supply across industrial, networking, and consumer electronics programs.

Supply support for W25Q256FVBJQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including serial NOR/NAND flash, PSRAM, and mobile DRAM, serving industrial, automotive, and communications markets since 1987.

The W25Q256FVBJQ belongs to Winbond's W25Q "SpiFlash" family, designed specifically for high-reliability embedded systems requiring fast XIP execution, robust security features, and seamless migration from parallel flash architectures.

FAQ

What is the package type and pin count of the W25Q256FVBJQ?

The W25Q256FVBJQ uses an 8-pad WSON 8×6 mm package (Package Code E) with exposed thermal pad. It has eight terminals: /CS, DO (IO1), /WP (IO2), GND, DI (IO0), CLK, /HOLD or /RESET (IO3), and VCC. Pin functions shift between Standard/Dual/Quad SPI modes based on the Quad Enable (QE) bit setting in Status Register-2.

Does the W25Q256FVBJQ support 4-byte addressing, and how is it enabled?

Yes, the W25Q256FVBJQ supports both 3-byte and 4-byte addressing modes. 4-byte mode is entered using the Enter 4-Byte Address Mode instruction (B7h) and exited with Exit 4-Byte Address Mode (E9h). The Power-Up Address Mode (ADP) bit in Status Register-1 determines default startup mode; ADP=1 selects 4-byte mode at power-on.

How does the /HOLD and /RESET functionality work on the W25Q256FVBJQ?

In the W25Q256FVBJQ's WSON-8 package, Pin 7 serves as /HOLD when QE=0 and cannot function as /RESET. The /RESET pin is only available on the 16-pin SOIC variant (Package Code F). When QE=1, Pin 7 becomes IO3 for Quad SPI, disabling both /HOLD and /RESET functions. No internal register controls this dual-role behavior-it is package- and QE-dependent.

What security features does the W25Q256FVBJQ provide beyond basic write protection?

The W25Q256FVBJQ provides layered security: hardware /WP pin protection, top/bottom/complement block locking (BP0–BP3, TB, CMP), volatile/non-volatile status register locking (SRP0/SRP1), three 256-byte OTP security registers, 64-bit unique ID, and JEDEC SFDP register for authenticated parameter discovery-all accessible via dedicated SPI instructions like 42h (Program Security Registers) and 48h (Read Security Registers).

Can the W25Q256FVBJQ be used for Execute-in-Place (XIP) applications, and what enables this capability?

Yes, the W25Q256FVBJQ supports true XIP via its Continuous Read Mode with ≤8-clock instruction overhead and Quad Peripheral Interface (QPI). QPI eliminates mode-switching delays, while Fast Read Quad I/O (6Bh/6Ch) delivers up to 50 MB/s sustained throughput-enabling direct code execution from flash without copying to RAM, reducing boot time and memory footprint in Cortex-M and RISC-V systems.

W25Q256FVBJQ Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (6x8)

W25Q256FVBJQ FAQ

1.How can I place an order for W25Q256FVBJQ through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q256FVBJQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q256FVBJQ reliable?

The price and inventory of W25Q256FVBJQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256FVBJQ is usually 5 days.

3.What payment methods are accepted for W25Q256FVBJQ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256FVBJQ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q256FVBJQ?

W25Q256FVBJQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q256FVBJQ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q256FVBJQ?

For technical support, including W25Q256FVBJQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256FVBJQ requirements.

6.How does Aetrix verify that W25Q256FVBJQ is sourced from the original manufacturer or authorized distributors?

All W25Q256FVBJQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256FVBJQ meets industry standards.

7.What is the process for return or replacement of W25Q256FVBJQ?

All W25Q256FVBJQ units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256FVBJQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q256FVBJQ part is unused and in its original packaging.

Return procedure for W25Q256FVBJQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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