Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W25Q256FVCIF TR

Part No.:
W25Q256FVCIF TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25Q256FVCIF TR.pdf
Description:
IC FLASH 256MBIT SPI 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,832

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W25Q256FVCIF TR from Winbond is a 256M-bit (32MB) serial NOR flash memory supporting Standard/Dual/Quad SPI and QPI interfaces, organized into 131,072 × 256-byte pages with 4KB uniform sector erase, 104MHz max clock, and single 2.7–3.6V supply - used for XIP code execution, firmware storage, and parameter retention in embedded microcontrollers.

For engineers reviewing the W25Q256FVCIF TR datasheet, W25Q256FVCIF TR pinout, W25Q256FVCIF TR application, or W25Q256FVCIF TR equivalent, key selection factors include 4-byte addressing support, Quad Enable (QE) bit configuration, /HOLD vs /RESET pin behavior per package, and JEDEC SFDP register compatibility for auto-configuration.

Technical Context

The W25Q256FVCIF TR implements a flexible SPI-compatible command set with hardware write protection via /WP and /HOLD pins, plus software-controlled block locking (BP0–BP3), top/bottom protection (TB), and security register OTP locks. Its status registers support volatile/non-volatile configuration of QE, DRV0/DRV1, HOLD/RST mode, and ADS/ADP address mode persistence.

It supports three operational modes: Standard SPI (DI/DO), Dual I/O (IO0/IO1), and Quad I/O (IO0–IO3), where IO2 and IO3 are remapped from /WP and /HOLD only when QE=1. The device enables true execute-in-place (XIP) via Continuous Read Mode with ≤8-clock instruction overhead and wrap lengths of 8/16/32/64 bytes.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 M-bit (32 MB), organized as 131,072 × 256-byte pages
Interface ModesStandard/Dual/Quad SPI + QPI; IO0–IO3 active only when QE=1
Max Clock Frequency104 MHz (Standard/Dual/Quad); 416 MHz equivalent data rate in Quad I/O Fast Read
Erase GranularityUniform 4 KB sectors (8,192 total), 32 KB blocks (1,024), 64 KB blocks (512), full chip
Write Endurance100,000 program/erase cycles per sector
Data Retention20 years at +25°C; specified over full operating temperature range
Supply Voltage2.7 V to 3.6 V; supports low-power active (4 mA typ.) and deep power-down (<1 µA)
Operating Temp–40°C to +85°C industrial grade; validated across full voltage and timing margins

Pinout & Package

W25Q256FVCIF TR is supplied in an 8-pad WSON 8×6 mm package (JEDEC MO-252, package code E), with exposed thermal pad. Pin functions are defined per SPI mode and QE bit state.

Pin/TerminalCircuit RoleDesign Meaning
/CSChip Select inputActive-low enable; high-impedance DO/IOx outputs when deasserted; required high-to-low transition after power-up before first instruction
DO (IO1)Data output / bidirectional I/OUnidirectional output in Standard SPI; bidirectional in Dual/Quad SPI; functionally identical to IO1 per JEDEC JESD216 SFDP mapping
/WP (IO2)Hardware write protect / bidirectional I/OActive-low hardware lock for status register; becomes IO2 only when QE=1; not available in Quad mode if QE=0
GNDGround referencePrimary signal and power return; must be low-impedance connection to system ground plane
DI (IO0)Data input / bidirectional I/OUnidirectional input in Standard SPI; bidirectional in Dual/Quad SPI; serves as primary address/data input path
CLKSerial clock inputEdge-triggered timing reference for all SPI operations; max 104 MHz; requires clean, monotonic transitions
/HOLD or /RESET (IO3)Hold control or reset input / bidirectional I/OActive-low pause signal in Standard/Dual mode; becomes IO3 in Quad mode when QE=1; /RESET function only available on SOIC-16 variant
VCCPower supply2.7–3.6 V core supply; decoupling capacitor (≥1 µF ceramic) required within 5 mm of pin

Key Features

FeatureDesign Value
Quad Peripheral Interface (QPI)Reduces instruction overhead to 2 clocks per command, enabling deterministic XIP latency and eliminating mode-switching delays between read/write ops
Continuous Read with WrapSupports 8/16/32/64-byte burst wraps without reissuing address; eliminates inter-burst setup time and improves effective throughput by ≥15% vs standard read
Volatile & Non-Volatile Status ControlQE, TB, BPx, SRP bits can be set either temporarily (volatile) or permanently (non-volatile), allowing field-upgradable protection schemes without reflashing firmware
Security Register SetThree 256-byte OTP-lockable security registers provide tamper-resistant storage for keys, calibration data, or secure boot manifests - inaccessible via standard read commands
JEDEC SFDP ComplianceRead SFDP register (5Ah) returns standardized parameter tables, enabling automatic driver configuration for address mode, erase timing, and quad enable sequence
Individual Sector Lock36h/39h instructions allow per-sector lock/unlock independent of BP bits, supporting dynamic firmware partitioning and field update safety zones

Applications

Boot Code StorageFirmware Over-the-Air (OTA)

Use Scenario: Storing bootloader and initial firmware image executed directly from flash on ARM Cortex-M or RISC-V SoCs.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability; provides deterministic instruction fetch timing under 104 MHz QPI clock.

Use Value: Eliminates external RAM copy step during boot, reducing BOM cost and startup latency by up to 30 ms versus parallel flash.

Use Scenario: Securely storing delta updates and verified firmware images in IoT edge nodes with constrained memory.

IC Role / Device Role / Timing Role: Dual-bank update storage with individual sector locking; supports atomic swap using 36h/39h lock commands.

Use Value: Enables safe rollback and A/B partitioning without requiring external controller logic or additional flash devices.

Industrial HMI ConfigurationAutomotive ADAS Logging

Use Scenario: Retaining display layouts, language packs, and user preferences across power cycles in factory HMIs.

IC Role / Device Role / Timing Role: Parameter storage with 4KB sector granularity; uses BP0–BP3 bits for hardware write protection of critical config regions.

Use Value: Prevents accidental corruption during field service via /WP pin tie-down, meeting IEC 62443 functional safety requirements.

Use Scenario: Buffering sensor fusion logs and diagnostic snapshots in automotive camera modules operating at –40°C to +85°C.

IC Role / Device Role / Timing Role: High-reliability data logger with 100K-cycle endurance and 20-year retention; leverages suspend/resume (75h/7Ah) during CAN bus arbitration gaps.

Use Value: Sustains 12+ hours of continuous 100 kB/s logging without wear leveling controller, reducing system complexity vs. managed NAND.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX25L25645GM2I-12GSame density, 3V supply, but supports only Standard/Dual SPI (no QPI); 80 MHz max clock; no SFDP registerLacks QPI and SFDP - requires fixed driver configuration; unsuitable for XIP systems needing dynamic mode negotiationSelect only if QPI/XIP is unused and legacy SPI-only interface suffices; verify /HOLD pin behavior matches W25Q256FVCIF TR's dual-function IO3 mapping
S25FL256SAGMFI000256Mb density, 3V, supports Quad SPI and QPI, but uses different QE bit location (SR2 bit 1 vs SR2 bit 6) and lacks /RESET pin in 8-pin packageRequires modified initialization sequence for QE setting; no hardware reset in WSON package - limits recovery from bus hang scenariosPrefer when Cypress-compatible toolchains are in use; confirm bootloader supports alternate QE bit position and absence of /RESET in failure recovery paths

Compared with MX25L25645GM2I-12G and S25FL256SAGMFI000, the W25Q256FVCIF TR delivers higher bandwidth via 104 MHz QPI, standardized SFDP auto-configuration, and integrated /HOLD–/RESET dual-mode pin flexibility - making it optimal for resource-constrained XIP designs requiring field-upgradable protection and deterministic timing.

Availability

W25Q256FVCIF TR is available at Aetrix Electronics and suitable for industrial HMI, automotive telematics, and IoT edge node applications requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for W25Q256FVCIF TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial NOR/NAND flash, RAM, and mobile DRAM, with ISO 9001 and IATF 16949 certification.

The W25Q series targets high-performance embedded systems requiring reliable, low-power, pin-efficient code and data storage - designed specifically for XIP, OTA updates, and secure firmware deployment in space-constrained environments.

FAQ

What is the package type and footprint of the W25Q256FVCIF TR?

The W25Q256FVCIF TR uses an 8-pad WSON 8×6 mm package (JEDEC MO-252, package code E) with exposed thermal pad. It has no leaded pins and requires solder paste stencil design per IPC-7351B for reliable reflow. This footprint differs from SOIC-16 and TFBGA variants, so PCB layout must match the exact WSON mechanical dimensions in Section 10.1 of the datasheet.

Does the W25Q256FVCIF TR support 4-byte addressing, and how is it enabled?

Yes, the W25Q256FVCIF TR supports both 3-byte and 4-byte addressing modes. 4-byte mode is entered using the Enter 4-Byte Address Mode instruction (B7h) and exited with E9h. The Power-Up Address Mode (ADP) bit in Status Register-2 determines default mode after reset; ADP=1 sets 4-byte mode at power-up, avoiding runtime mode switching in boot-critical paths.

How does the /HOLD pin function differ between Standard SPI and Quad SPI modes on the W25Q256FVCIF TR?

In Standard/Dual SPI mode, /HOLD (pin 7) acts as an active-low pause signal that freezes ongoing reads/writes while maintaining internal state. In Quad SPI mode (QE=1), pin 7 becomes IO3 and /HOLD functionality is disabled - the pin serves only as a bidirectional data line. This behavior is hardwired and cannot be overridden by status register settings.

Can the W25Q256FVCIF TR be used for secure key storage, and what hardware features enable this?

Yes, the W25Q256FVCIF TR includes three 256-byte Security Registers with One-Time-Programmable (OTP) lock bits (LB1–LB3). Once locked, these registers are read-only and inaccessible via standard read instructions - only accessible through dedicated 42h/48h/44h commands. This provides tamper-resistant storage for cryptographic keys, device IDs, or calibration secrets without external encryption controllers.

What is the role of the Quad Enable (QE) bit, and where is it located in the W25Q256FVCIF TR status registers?

The Quad Enable (QE) bit is located at bit 1 of Status Register-2 (SR2) and must be set to '1' to activate Quad SPI mode, remapping /WP and /HOLD pins to IO2 and IO3. QE can be written in volatile or non-volatile form. When QE=0, /WP and /HOLD retain their hardware protection functions; when QE=1, those pins become data I/O lines and hardware protection is disabled unless software-based BP bits are used.

W25Q256FVCIF TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (6x8)

W25Q256FVCIF TR FAQ

1.How can I place an order for W25Q256FVCIF TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q256FVCIF TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q256FVCIF TR reliable?

The price and inventory of W25Q256FVCIF TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256FVCIF TR is usually 5 days.

3.What payment methods are accepted for W25Q256FVCIF TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256FVCIF TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q256FVCIF TR?

W25Q256FVCIF TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q256FVCIF TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q256FVCIF TR?

For technical support, including W25Q256FVCIF TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256FVCIF TR requirements.

6.How does Aetrix verify that W25Q256FVCIF TR is sourced from the original manufacturer or authorized distributors?

All W25Q256FVCIF TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256FVCIF TR meets industry standards.

7.What is the process for return or replacement of W25Q256FVCIF TR?

All W25Q256FVCIF TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256FVCIF TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q256FVCIF TR part is unused and in its original packaging.

Return procedure for W25Q256FVCIF TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q256FVCIF TR Tags

  • W25Q256FVCIF TR
  • W25Q256FVCIF TR PDF
  • W25Q256FVCIF TR Datasheet
  • W25Q256FVCIF TR Specifications
  • W25Q256FVCIF TR Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W25Q256FVCIF TR
  • Buy W25Q256FVCIF TR
  • W25Q256FVCIF TR Price
  • W25Q256FVCIF TR Distributor
  • W25Q256FVCIF TR Supplier
  • W25Q256FVCIF TR Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER