Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W25Q256FVCIG

Part No.:
W25Q256FVCIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25Q256FVCIG.pdf
Description:
IC FLASH 256MBIT SPI 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,023

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W25Q256FVCIG from Winbond is a 256M-bit (32MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, organized into 131,072 × 256-byte pages with 4KB uniform sector erase granularity. It operates from 2.7V to 3.6V, delivers up to 104MHz SPI clock rate (416MHz equivalent Quad I/O), and targets code storage, XIP execution, and firmware update in space-constrained embedded systems.

For engineers reviewing the W25Q256FVCIG datasheet, W25Q256FVCIG pinout, W25Q256FVCIG application, or W25Q256FVCIG equivalent, key selection factors include 4-byte addressing support, QE-bit–controlled Quad I/O mode, hardware write protection via /WP and /HOLD pins, and JEDEC-compliant SFDP register for auto-configuration.

Technical Context

The W25Q256FVCIG implements a flexible SPI-compatible command set with dual and quad I/O modes enabled by the non-volatile Quad Enable (QE) bit in Status Register-2. Its architecture supports both 3-byte and 4-byte address modes, with dedicated instructions to enter/exit 4-byte mode (B7h/E9h) and switch between SPI and QPI protocols (38h/FFh).

It integrates three 256-byte one-time-programmable (OTP) security registers, a 64-bit unique ID, and hierarchical write protection: volatile/non-volatile block protect bits (BP3–BP0), top/bottom array control (TB), complement protection (CMP), and status register lock (SRP0/SRP1), all configurable via standard SPI commands.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 M-bit (32 MB), organized as 131,072 × 256-byte pages
Interface ModesStandard SPI, Dual I/O SPI, Quad I/O SPI, and QPI - selectable via QE bit and instruction set
Max Clock Rate104 MHz SPI; enables 416 MB/s effective throughput in Quad I/O Fast Read mode
Erase GranularityUniform 4 KB sectors (8,192 total), plus 32 KB and 64 KB blocks - supports fine-grained firmware partitioning
Write Endurance≥100,000 program/erase cycles per sector - validated for long-life boot code storage
Data Retention≥20 years at +25°C - specified for industrial temperature range operation
Supply Voltage2.7 V to 3.6 V single supply - compatible with 3.3 V logic domains without level shifting
Power Consumption4 mA active typical; <1 µA power-down - suitable for battery-backed or low-power wake-on-event designs

Pinout & Package

W25Q256FVCIG is supplied in an 8-pad WSON 8×6 mm package (JEDEC MO-252, package code E), with exposed thermal pad. Pin functions are defined for Standard/Dual SPI operation; in Quad SPI mode, /WP and /HOLD become IO2 and IO3 respectively upon QE bit activation.

Pin/TerminalCircuit RoleDesign Meaning
/CSChip Select InputActive-low enable: high = device deselected (high-Z outputs, standby current); low = active communication window
DO (IO1)Data Output / Bidirectional I/OUnidirectional output in Standard SPI; bidirectional data lane 1 in Dual/Quad modes - used for read responses and status polling
/WP (IO2)Write Protect Input / Bidirectional I/OHardware lock for Status Register writes when QE=0; becomes IO2 in Quad mode - enables hardware-firmware coordinated protection
GNDGround ReferencePrimary return path for VCC and all I/O signals - requires low-inductance connection to minimize noise during fast reads
DI (IO0)Data Input / Bidirectional I/OUnidirectional input in Standard SPI; bidirectional data lane 0 in Dual/Quad modes - carries commands, addresses, and program data
CLKSerial Clock InputEdge-triggered timing reference for all SPI/QPI transfers - must meet tCH/tCL min/max specs for 104 MHz operation
/HOLD or /RESET (IO3)Hold or Reset Input / Bidirectional I/OPauses ongoing transfer when low (QE=0); becomes IO3 in Quad mode - allows multi-device bus arbitration without CS toggling
VCCPower Supply2.7–3.6 V core and I/O supply - requires local 1 µF + 0.1 µF decoupling adjacent to pin

Key Features

FeatureDesign Value
Continuous Read Mode with WrapEnables true XIP execution with ≤8-clock instruction overhead per 24-bit address - eliminates external buffer latency
Erase/Program Suspend & ResumeAllows background interrupt servicing during long erase cycles (e.g., 64KB block erase ~200 ms) without data corruption
JEDEC SFDP RegisterProvides standardized, read-only parameter table (5Ah) for automatic driver configuration - removes hard-coded timing assumptions
64-bit Unique Serial NumberFactory-programmed per-die ID accessible via 4Bh instruction - enables secure device binding and firmware licensing
Three 256-byte Security RegistersOTP-lockable storage for keys, certificates, or calibration data - protected by LB1–LB3 bits in Status Register-3
4-Byte Address Mode SupportRequired for full 32 MB addressing; activated via B7h instruction - avoids address wrap issues in large-code applications

Applications

Boot Code StorageFirmware Over-the-Air Update

Use Scenario: Storing primary bootloader and initial firmware image in microcontroller-based edge nodes with no external parallel flash.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable Quad I/O interface - executes directly from flash without RAM copy.

Use Value: Reduces BOM cost and PCB area vs. parallel NOR; enables deterministic startup timing via 104 MHz continuous read.

Use Scenario: Receiving encrypted firmware patches over cellular or Wi-Fi, validating signatures, then writing to designated sectors.

IC Role / Device Role / Timing Role: Secure, field-upgradable code repository - uses security registers for key storage and sector lock bits for atomic update boundaries.

Use Value: Prevents partial writes during power loss via 4KB sector erase isolation; supports >100k update cycles across product lifetime.

Industrial HMI Display MemoryAutomotive Telematics Log Buffer

Use Scenario: Holding GUI assets (fonts, icons, bitmaps) and localized language strings for touch-screen HMIs in factory automation panels.

IC Role / Device Role / Timing Role: High-bandwidth asset storage - leverages Quad I/O Fast Read (6Bh) for rapid screen refreshes.

Use Value: Achieves >50 MB/s sustained read throughput - eliminates frame stutter during multi-layer UI rendering.

Use Scenario: Capturing CAN bus diagnostic logs, GPS coordinates, and sensor timestamps during vehicle road tests.

IC Role / Device Role / Timing Role: Circular-buffer event recorder - uses Erase/Program Suspend to service CAN interrupts mid-sector erase.

Use Value: Guarantees zero-data-loss logging even during concurrent 64KB block erases - meets ISO 26262 ASIL-B data integrity requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX25L25673FMI-10GSame density and SOIC/WSON packages; supports DTR (Double Transfer Rate) mode for 208 MHz dual-I/O; lacks QPI and SFDP registerPreferred where controller supports DTR but not QPI; no auto-configuration - requires manual timing setupSelect if higher dual-I/O bandwidth is critical and QPI/SFDP are unused
S25FL256SAGMFI000256 Mb Cypress (Infineon) device; includes built-in ECC and configurable 128-byte page write buffer; supports 133 MHz clockBetter suited for safety-critical storage requiring on-the-fly bit error correction; larger write buffer improves sequential programming efficiencyChoose when ECC validation or faster page programming is required over Quad I/O flexibility

Compared with MX25L25673FMI-10G and S25FL256SAGMFI000, the W25Q256FVCIG offers broader protocol support (QPI + SFDP), finer 4KB sector granularity for firmware partitioning, and integrated security registers - making it optimal for XIP-capable, field-upgradable embedded systems requiring standardized configuration and tamper-resistant key storage.

Availability

W25Q256FVCIG is available at Aetrix Electronics and suitable for boot code storage, firmware OTA updates, industrial HMI display memory, and automotive telematics log buffering requiring stable component supply and long-term lifecycle assurance.

Supply support for W25Q256FVCIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR/NAND flash, PSRAM, and mobile DRAM.

The W25Q series was designed specifically for high-performance, code-execution-capable serial flash applications in resource-constrained embedded systems - emphasizing XIP readiness, security, and protocol flexibility over raw density.

FAQ

What is the package type and lead count of the W25Q256FVCIG?

The W25Q256FVCIG uses an 8-pad WSON (8×6 mm) package with exposed thermal pad (JEDEC MO-252, package code E). It has eight terminals: /CS, DO (IO1), /WP (IO2), GND, DI (IO0), CLK, /HOLD or /RESET (IO3), and VCC. This compact footprint supports high-density PCB layouts while maintaining thermal performance for sustained Quad I/O operation.

Does the W25Q256FVCIG support 4-byte addressing, and how is it enabled?

Yes, the W25Q256FVCIG fully supports 4-byte addressing to access its full 32 MB capacity. It is enabled using the Enter 4-Byte Address Mode instruction (B7h), which sets the ADP bit in Status Register-1. The mode persists after power cycle if ADP is non-volatile (default configuration). Exit is performed with E9h. This is mandatory for addressing beyond the 16 MB boundary.

How does the Quad Enable (QE) bit affect pin functionality on the W25Q256FVCIG?

The QE bit (bit 1 of Status Register-2) controls whether /WP and /HOLD pins function as hardware protection inputs or as IO2/IO3 for Quad SPI. When QE=0, /WP and /HOLD retain their standard protection roles; when QE=1, they become bidirectional data lines. This reconfiguration is non-volatile and requires Write Status Register-2 (31h) to modify.

What security features are implemented in the W25Q256FVCIG?

The W25Q256FVCIG includes hardware write protection (/WP pin), programmable block/sector locks (BP0–BP3, TB, CMP), status register protection (SRP0/SRP1), three 256-byte OTP security registers with LB1–LB3 locks, and a factory-programmed 64-bit unique ID. These features collectively enable secure boot, firmware authentication, and tamper-resistant key storage without external crypto controllers.

Can the W25Q256FVCIG be used for Execute-in-Place (XIP) applications?

Yes, the W25Q256FVCIG supports true XIP via Continuous Read Mode with Quad I/O Fast Read (6Bh/6Ch) and QPI instructions. Its ≤8-clock instruction overhead, 104 MHz clock capability, and uniform 4KB sectors allow deterministic, low-latency code fetch directly from flash - eliminating RAM copy requirements and reducing system boot time in Cortex-M and RISC-V microcontrollers.

W25Q256FVCIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tube
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (6x8)

W25Q256FVCIG FAQ

1.How can I place an order for W25Q256FVCIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q256FVCIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q256FVCIG reliable?

The price and inventory of W25Q256FVCIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256FVCIG is usually 5 days.

3.What payment methods are accepted for W25Q256FVCIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256FVCIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q256FVCIG?

W25Q256FVCIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q256FVCIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q256FVCIG?

For technical support, including W25Q256FVCIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256FVCIG requirements.

6.How does Aetrix verify that W25Q256FVCIG is sourced from the original manufacturer or authorized distributors?

All W25Q256FVCIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256FVCIG meets industry standards.

7.What is the process for return or replacement of W25Q256FVCIG?

All W25Q256FVCIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256FVCIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q256FVCIG part is unused and in its original packaging.

Return procedure for W25Q256FVCIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q256FVCIG Tags

  • W25Q256FVCIG
  • W25Q256FVCIG PDF
  • W25Q256FVCIG Datasheet
  • W25Q256FVCIG Specifications
  • W25Q256FVCIG Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W25Q256FVCIG
  • Buy W25Q256FVCIG
  • W25Q256FVCIG Price
  • W25Q256FVCIG Distributor
  • W25Q256FVCIG Supplier
  • W25Q256FVCIG Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER