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Winbond Electronics Corporation W25Q256FVCIP

Part No.:
W25Q256FVCIP
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25Q256FVCIP.pdf
Description:
IC FLASH 256MBIT SPI 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,675

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Product details

Overview

W25Q256FVCIP from Winbond is a 256M-bit (32MB) serial NOR flash memory supporting Standard/Dual/Quad SPI and QPI interfaces, operating at up to 80MHz clock rate with 40MB/s continuous read throughput, 4KB uniform sector erase granularity, and single 2.7–3.6V supply - deployed for XIP code execution, firmware storage, and parameter retention in embedded microcontrollers and IoT edge devices.

For engineers reviewing the W25Q256FVCIP datasheet, W25Q256FVCIP pinout, W25Q256FVCIP application, or W25Q256FVCIP equivalent, key selection considerations include 4-byte addressing support, Quad Enable (QE) bit configuration, /HOLD vs /RESET pin behavior in 8-pin WSON, JEDEC ID and SFDP register compliance, and hardware write protection via /WP pin and status register BP bits.

Technical Context

The W25Q256FVCIP implements a flexible SPI-compatible command set with three address modes (3-byte default, 4-byte enabled via B7h/E9h, and power-up configurable ADP bit), supporting both volatile and non-volatile status register writes for block protection, quad enable, and driver strength control. Its architecture includes dedicated 256-byte page buffers, 8,192 erasable 4KB sectors, and 512 erasable 64KB blocks.

It integrates dual-mode I/O functionality: IO0–IO3 serve as DI/DO in standard mode, then reconfigure as bidirectional data lines under Quad SPI when QE=1; /WP and /HOLD become IO2/IO3 respectively, disabling their hardware protection functions. The device supports erase/program suspend/resume, security registers with OTP locks, and a factory-programmed 64-bit unique ID.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density256 M-bit (32 MB), organized as 131,072 × 256-byte pages
Interface ModesStandard SPI (4-wire), Dual SPI (4-wire), Quad SPI (4-wire), QPI (4-wire); all support 3- or 4-byte addressing
Max Clock Frequency80 MHz SPI clock → 160 MHz (Dual I/O) or 320 MHz (Quad I/O) effective throughput
Erase GranularityUniform 4 KB sectors (8,192 total), 32 KB blocks (4,096), 64 KB blocks (512), or full chip
Write Endurance≥100,000 program/erase cycles per sector
Data Retention≥20 years at +25°C; specified over full -40°C to +85°C industrial temperature range
Power SupplySingle 2.7 V to 3.6 V supply; active current ≤4 mA (typ.), power-down current ≤1 µA (typ.)

Pinout & Package

W25Q256FVCIP uses an 8-pad WSON 8×6 mm package (Package Code E), with exposed thermal pad. Pin functions are defined per JEDEC J-STD-020 and Winbond specification; /CS, CLK, DI (IO0), DO (IO1), /WP (IO2), /HOLD or /RESET (IO3), VCC, and GND occupy positions 1–8 respectively in top-view orientation.

Pin/Terminal Circuit Role Design Meaning
/CS (Pin 1)Chip Select InputActive-low enable; high-Z output and standby current when high; required high-to-low transition after power-up before instruction acceptance
DO (IO1) (Pin 2)Data Output / Bidirectional I/OUnidirectional output in Standard SPI; becomes bidirectional IO1 in Dual/Quad SPI when QE=1
/WP (IO2) (Pin 3)Write Protect Input / Bidirectional I/OHardware lock for status register writes when low; repurposed as IO2 in Quad SPI (QE=1), disabling protection
GND (Pin 4)Ground ReferencePrimary signal and power return path; must be low-impedance connection per layout guidelines
DI (IO0) (Pin 5)Data Input / Bidirectional I/OUnidirectional input in Standard SPI; becomes bidirectional IO0 in Dual/Quad SPI when QE=1
CLK (Pin 6)Serial Clock InputEdge-triggered timing source for all SPI/QPI operations; supports Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1)
/HOLD or /RESET (IO3) (Pin 7)Hold or Reset Input / Bidirectional I/OPauses ongoing operation when low (/HOLD); resets internal logic when pulsed (/RESET); becomes IO3 in Quad SPI (QE=1)
VCC (Pin 8)Power Supply2.7–3.6 V nominal; requires local 100 nF ceramic decoupling adjacent to pin

Key Features

Feature Design Value
Continuous Read with WrapSupports 8/16/32/64-byte wrap bursts; only 8 clocks needed to issue 24-bit address, enabling true XIP execution
Quad Peripheral Interface (QPI)Reduces instruction overhead by encoding commands in 2-clock cycles; eliminates need for mode switching between instructions
Erase/Program Suspend & ResumeAllows background operation interruption (e.g., servicing real-time interrupt) without data loss or timeout risk
Security Register SetThree 256-byte OTP-lockable security registers for keys, certificates, or calibration data - independent of main array
JEDEC SFDP & Unique IDStandardized Serial Flash Discoverable Parameters register enables automatic driver configuration; 64-bit factory-unique ID prevents cloning

Applications

Boot Code Storage Firmware Over-the-Air (OTA)

Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M or RISC-V microcontrollers during cold start.

IC Role / Device Role / Timing Role: Non-volatile boot memory mapped via SPI or QPI; provides deterministic read latency for first-instruction fetch.

Use Value: 4KB sector granularity allows atomic firmware updates without erasing entire image; 40MB/s read speed minimizes boot time.

Use Scenario: Receiving and validating encrypted firmware patches in battery-powered wireless sensors or smart meters.

IC Role / Device Role / Timing Role: Secure update staging area; leverages security registers for signature verification keys and SFDP for auto-negotiated interface mode.

Use Value: Erase/program suspend enables immediate interrupt response during patch write; 20-year data retention ensures long-term field reliability.

Industrial HMI Configuration Automotive Telematics Logging

Use Scenario: Persisting UI theme settings, language packs, and calibration offsets across power cycles in panel-mounted HMIs.

IC Role / Device Role / Timing Role: Parameter storage with hardware write protection; /WP pin and BP bits prevent accidental corruption during runtime.

Use Value: Top/bottom array protection isolates user settings from firmware partitions; 100K-cycle endurance supports frequent recalibration.

Use Scenario: Recording CAN bus diagnostics, GPS coordinates, and event timestamps in vehicle telematics gateways.

IC Role / Device Role / Timing Role: High-reliability logging buffer with wear leveling handled by host MCU; uses 4-byte addressing for >16MB address space.

Use Value: 64KB block erase enables efficient log rotation; -40°C to +85°C rating meets AEC-Q100 Grade 3 ambient requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L25645GMI-10GSame density (256Mb), 3.3V, SOIC-16 and WSON-8 packages; supports DTR mode but no QPI; max clock 104MHz (standard SPI only)Lacks QPI and 4-byte addressing; requires software-managed mode switching for dual/quad readsPreferred where QPI complexity is unnecessary and higher standard SPI speed suffices
S25FL256SAGMFI000256Mb, 3.0V core, supports Xccela Bus (Octal DDR) and legacy SPI; includes built-in ECC and configurable reset polarityHigher pin count (24-ball BGA), requires Octal-capable controller; ECC adds latency but improves reliabilityChosen for safety-critical systems requiring error correction and deterministic reset behavior

Compared with W25Q256FVCIP, MX25L25645GMI-10G offers faster standard SPI but lacks QPI efficiency and 4-byte addressing flexibility, while S25FL256SAGMFI000 adds ECC and Octal support at the cost of controller compatibility and package size - making W25Q256FVCIP optimal for balanced performance, footprint, and feature set in resource-constrained embedded designs.

Availability

W25Q256FVCIP is available at Aetrix Electronics and suitable for boot code storage, OTA firmware updates, industrial HMI configuration, and automotive telematics logging requiring stable component supply, long-lifecycle assurance, and consistent parametric performance across production batches.

Supply support for W25Q256FVCIP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.

The W25Q series targets embedded systems needing high-speed, low-power, secure non-volatile storage - designed specifically for code shadowing, XIP execution, and robust firmware update architectures in space- and pin-constrained applications.

FAQ

What is the package type and pin count of the W25Q256FVCIP?

The W25Q256FVCIP uses an 8-pad WSON (8×6 mm) package with exposed thermal pad (Package Code E). It has eight terminals: /CS, DO (IO1), /WP (IO2), GND, DI (IO0), CLK, /HOLD or /RESET (IO3), and VCC. This compact footprint supports high-density PCB layouts while maintaining full SPI/QPI functionality and hardware protection features.

Does the W25Q256FVCIP support 4-byte addressing, and how is it enabled?

Yes, the W25Q256FVCIP supports both 3-byte and 4-byte addressing modes. 4-byte mode is enabled by issuing the Enter 4-Byte Address Mode instruction (B7h); it can be disabled using Exit 4-Byte Address Mode (E9h). The Power-Up Address Mode (ADP) bit in Status Register-3 determines default behavior after reset - allowing persistent configuration without host intervention.

How does the Quad Enable (QE) bit affect pin functionality on the W25Q256FVCIP?

The QE bit (bit 1 of Status Register-2) controls whether /WP and /HOLD pins function as hardware protection inputs or as IO2/IO3 for Quad SPI. When QE=0, /WP and /HOLD retain their protection roles; when QE=1, they become bidirectional data lines, disabling hardware write protection. This trade-off must be managed in firmware initialization sequences.

What is the endurance and data retention specification for the W25Q256FVCIP?

The W25Q256FVCIP guarantees ≥100,000 program/erase cycles per 4KB sector and ≥20 years of data retention at +25°C. These values are validated across the full industrial temperature range (-40°C to +85°C), with retention degrading predictably at elevated temperatures per JEDEC JESD22-A117 standards.

Can the W25Q256FVCIP be used for execute-in-place (XIP) applications?

Yes, the W25Q256FVCIP supports true XIP via Continuous Read Mode with wrap burst and minimal instruction overhead (as few as 8 clocks for address setup). Combined with QPI's 2-clock instruction encoding and 40MB/s sustained read throughput, it enables deterministic instruction fetch directly from flash - widely adopted in Cortex-M4/M7 and RISC-V SoCs without external RAM buffering.

W25Q256FVCIP Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tube
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (6x8)

W25Q256FVCIP FAQ

1.How can I place an order for W25Q256FVCIP through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q256FVCIP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q256FVCIP reliable?

The price and inventory of W25Q256FVCIP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256FVCIP is usually 5 days.

3.What payment methods are accepted for W25Q256FVCIP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256FVCIP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q256FVCIP?

W25Q256FVCIP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q256FVCIP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q256FVCIP?

For technical support, including W25Q256FVCIP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256FVCIP requirements.

6.How does Aetrix verify that W25Q256FVCIP is sourced from the original manufacturer or authorized distributors?

All W25Q256FVCIP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256FVCIP meets industry standards.

7.What is the process for return or replacement of W25Q256FVCIP?

All W25Q256FVCIP units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256FVCIP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q256FVCIP part is unused and in its original packaging.

Return procedure for W25Q256FVCIP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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