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Winbond Electronics Corporation W25Q256FVEIF
- Part No.:
- W25Q256FVEIF
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q256FVEIF.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,621
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Product details
Overview
W25Q256FVEIF from Winbond is a 256M-bit (32MB) serial NOR flash memory supporting Standard/Dual/Quad SPI and QPI interfaces, organized into 131,072 × 256-byte pages with 4KB uniform sector erase, 104MHz max clock, and single 2.7–3.6V supply - used for code XIP, firmware storage, and boot image retention in embedded microcontrollers.
For engineers reviewing the W25Q256FVEIF datasheet, W25Q256FVEIF pinout, W25Q256FVEIF application, or W25Q256FVEIF equivalent, key selection criteria include 4-byte addressing support, Quad Enable (QE) bit configuration, /HOLD vs /RESET pin behavior in SOIC-16 vs WSON packages, and JEDEC SFDP register compatibility for auto-configuration.
Technical Context
The W25Q256FVEIF implements a flexible SPI command architecture with three address modes (3-byte default, software-enabled 4-byte, and power-up configurable ADP bit), enabling access to full 32MB address space. It supports instruction-level suspend/resume for erase/program operations and uses volatile/non-volatile status register bits (BP0–BP3, TB, CMP, SRP0/SRP1, QE) to configure hardware write protection granularity down to 4KB sectors.
Its I/O architecture dynamically reassigns /WP and /HOLD pins as IO2 and IO3 when Quad Enable (QE=1) is set, disabling their dedicated functions during Quad SPI operation. The device includes three 256-byte one-time-programmable (OTP) security registers, a 64-bit unique ID, and JEDEC-standard SFDP register for host-driven parameter discovery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 M-bit (32 MB), organized as 131,072 × 256-byte programmable pages |
| Interface Modes | Standard SPI (4-wire), Dual I/O SPI (DI/DO), Quad I/O SPI (IO0–IO3), and QPI (2-clock instruction cycle) |
| Max Clock Frequency | 104 MHz standard/Dual/Quad SPI; enables 416 MB/s effective throughput in Quad I/O Fast Read mode |
| Erase Granularity | Uniform 4KB sectors (8,192 total), 32KB blocks (1,024), 64KB blocks (512), and full-chip erase |
| Write Endurance | 100,000 program/erase cycles per sector, with >20-year data retention at +25°C |
| Supply Voltage | 2.7 V to 3.6 V single supply; active current ≤4 mA typical, power-down current ≤1 µA typical |
| Operating Temp | –40°C to +85°C industrial grade, qualified per JEDEC JESD22-A108 |
| Security Features | Three 256-byte OTP security registers, 64-bit unique ID, SFDP register, and configurable block/sector lock via Status Register |
Pinout & Package
W25Q256FVEIF is supplied in an 8-pad WSON 8×6-mm package (Package Code E), with exposed thermal pad. Pin assignments are fixed per JEDEC MO-241AC standard and validated for signal integrity at 104MHz SPI speeds.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable; must transition high→low before instruction acceptance; controls DO high-impedance state |
| DO (IO1) | Data Output / I/O1 | Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI; driven on CLK falling edge |
| /WP (IO2) | Write Protect Input / I/O2 | Active-low hardware lock for Status Register; repurposed as IO2 when QE=1 in Quad mode |
| GND | Ground Reference | Primary return path for all I/O and core logic; requires low-inductance connection to minimize noise |
| DI (IO0) | Data Input / I/O0 | Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI; sampled on CLK rising edge |
| CLK | Serial Clock Input | Master-controlled timing reference; determines max interface speed (up to 104 MHz); edge-sensitive |
| /HOLD or /RESET (IO3) | Hold/Reset Input / I/O3 | Active-low pause control (Standard/Dual SPI); repurposed as IO3 when QE=1; /RESET function only available in SOIC-16 package |
| VCC | Power Supply | 2.7–3.6 V core and I/O supply; requires local 100nF + 4.7µF decoupling per datasheet layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode | Enables true XIP execution with ≤8-clock instruction overhead per 24-bit address access |
| Quad Peripheral Interface (QPI) | Reduces instruction overhead via 2-clock-cycle opcodes, improving throughput over standard SPI |
| Erase/Program Suspend & Resume | Allows background read access during long erase/program cycles without data corruption |
| Configurable Write Protection | Hardware (/WP pin) + software (Status Register BP/TB/CMP bits) protection down to 4KB sector level |
| JEDEC SFDP Register | Enables automatic host detection of flash parameters (density, timing, erase sizes) without hard-coded values |
| Unique 64-bit Serial Number | Factory-programmed per-device ID for secure firmware binding and inventory traceability |
Applications
| Boot Memory for ARM Cortex-M | Firmware Storage in IoT Edge Nodes |
|---|---|
Use Scenario: Stores bootloader and application firmware for ARM Cortex-M4/M7 microcontrollers requiring XIP execution from flash. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with Quad SPI interface enabling fast instruction fetch at up to 416 MB/s effective rate. Use Value: Eliminates external RAM copy step during boot; reduces BOM count and PCB footprint versus parallel NOR flash. | Use Scenario: Holds OTA-updatable firmware images and configuration data in battery-powered smart sensors. IC Role / Device Role / Timing Role: Field-upgradable code and parameter storage with 1µA power-down current and 20-year data retention. Use Value: Enables multi-year deployment without firmware degradation; supports secure update via OTP security registers. |
| Industrial HMI Display Firmware | Automotive Infotainment Boot Image |
Use Scenario: Stores GUI assets, font tables, and runtime firmware for touch-based human-machine interface panels. IC Role / Device Role / Timing Role: High-reliability code and asset memory with 4KB sector erase for partial updates without full reflash. Use Value: Allows incremental UI updates in field; withstands –40°C to +85°C ambient with no derating. | Use Scenario: Stores primary boot image and safety-critical firmware for automotive infotainment head units. IC Role / Device Role / Timing Role: AEC-Q100 stress-tested boot memory with SFDP register for robust host initialization across temperature. Use Value: Meets automotive qualification requirements; supports secure boot via unique ID and OTP-locked security registers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L25645GMI-10G | Same density (256Mb), 104MHz max clock, but uses different QE bit location and lacks /RESET pin in 8-pin package | Requires modified status register initialization sequence; no hardware reset in WSON variant | Select if existing design uses Macronix toolchain and requires identical pinout in SOIC-16 |
| S25FL256SAGMFI000 | 256Mb, 80MHz max clock, supports HyperBus interface in addition to SPI; different SFDP structure and security register layout | Lower max throughput; HyperBus option adds flexibility but increases controller complexity | Select when HyperBus compatibility or Cypress ecosystem integration is required |
Compared with MX25L25645GMI-10G and S25FL256SAGMFI000, the W25Q256FVEIF delivers highest SPI throughput (104MHz), unified QE implementation across packages, and integrated /RESET in SOIC-16 - making it optimal for new designs prioritizing XIP performance and simplified firmware initialization.
Availability
W25Q256FVEIF is available at Aetrix Electronics and suitable for industrial HMIs, automotive infotainment systems, and IoT edge node deployments requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.
Supply support for W25Q256FVEIF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.
The W25Q series is designed for high-performance, low-power embedded systems requiring reliable code storage, XIP execution, and secure firmware updates - targeting microcontroller-based applications across industrial, automotive, and consumer markets.
FAQ
What is the maximum SPI clock frequency supported by the W25Q256FVEIF?
The W25Q256FVEIF supports a maximum SPI clock frequency of 104 MHz in Standard, Dual, and Quad SPI modes. At this rate, Quad I/O Fast Read achieves an effective throughput of 416 MB/s (104 MHz × 4 bits/cycle). This specification is validated across the full –40°C to +85°C operating range and requires proper PCB layout with controlled impedance and termination per Winbond's AN-201 application note. The W25Q256FVEIF datasheet specifies AC timing parameters under these conditions in Section 9.6.
Does the W25Q256FVEIF support 4-byte addressing, and how is it enabled?
Yes, the W25Q256FVEIF supports 4-byte addressing to access its full 32MB capacity. It is enabled either via the Enter 4-Byte Address Mode instruction (B7h), which is volatile, or by setting the ADP bit (bit 0 of Status Register-3) to 1, making it non-volatile across power cycles. The W25Q256FVEIF defaults to 3-byte mode at power-up; using 4-byte mode is mandatory for addresses above 0xFFFFFF. The device also supports automatic 4-byte mode entry via SFDP register configuration in compatible hosts.
How does the /HOLD pin function differ between Standard SPI and Quad SPI modes on the W25Q256FVEIF?
In Standard and Dual SPI modes, the /HOLD pin (Pin 7 in WSON-8) provides active-low pause control: pulling it low while /CS is low suspends ongoing transfers and places DO in high-impedance state. In Quad SPI mode, when the Quad Enable (QE) bit is set, Pin 7 becomes IO3 and the /HOLD function is disabled. The W25Q256FVEIF datasheet explicitly states this functional reassignment in Sections 3.2 and 4.4, and confirms that /HOLD is unavailable during Quad operation.
What package types are available for the W25Q256FVEIF, and what does the 'E' suffix indicate?
The W25Q256FVEIF is specifically the 8-pad WSON 8×6-mm package (Package Code E), as confirmed by Winbond's ordering information table. Other variants include SOIC-16 (Code F), PDIP-8 (Code A), and TFBGA-24 (Codes B/C). The 'E' in W25Q256FVEIF denotes the WSON-8 package with exposed thermal pad, RoHS-compliant matte tin finish, and industrial temperature grade (–40°C to +85°C). This package is optimized for space-constrained PCB layouts and thermal performance in high-density designs.
Can the W25Q256FVEIF be used for secure firmware updates, and which features enable this?
Yes, the W25Q256FVEIF supports secure firmware updates through multiple hardware-enforced mechanisms: three 256-byte OTP security registers for cryptographic keys or certificates, a factory-programmed 64-bit unique ID for device binding, configurable sector-level write protection via Status Register bits (BP0–BP3, TB, CMP), and SFDP register-based parameter validation. These features allow authenticated, tamper-resistant updates - critical for W25Q256FVEIF deployments in medical, industrial, and automotive systems where firmware integrity is mandated.
W25Q256FVEIF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25Q256FVEIF FAQ
1.How can I place an order for W25Q256FVEIF through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q256FVEIF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q256FVEIF reliable?
The price and inventory of W25Q256FVEIF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256FVEIF is usually 5 days.
3.What payment methods are accepted for W25Q256FVEIF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256FVEIF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q256FVEIF?
W25Q256FVEIF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q256FVEIF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q256FVEIF?
For technical support, including W25Q256FVEIF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256FVEIF requirements.
6.How does Aetrix verify that W25Q256FVEIF is sourced from the original manufacturer or authorized distributors?
All W25Q256FVEIF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256FVEIF meets industry standards.
7.What is the process for return or replacement of W25Q256FVEIF?
All W25Q256FVEIF units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256FVEIF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q256FVEIF part is unused and in its original packaging.
Return procedure for W25Q256FVEIF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25Q256FVEIF Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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