Winbond Electronics Corporation W25Q256FVEIG
- Part No.:
- W25Q256FVEIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q256FVEIG.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:

- Shipping:

Inventory:3,230
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Product details
Overview
W25Q256FVEIG from Winbond is a 256M-bit (32MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, organized into 131,072 × 256-byte pages with 4KB uniform sector erase granularity, operating from 2.7V to 3.6V, and delivering up to 104MHz SPI clock rate for embedded code storage and XIP execution in space-constrained industrial controllers.
For engineers reviewing the W25Q256FVEIG datasheet, W25Q256FVEIG pinout, W25Q256FVEIG application, or W25Q256FVEIG equivalent, this device supports 4-byte addressing, JEDEC SFDP register, 64-bit unique ID, hardware write protection via /WP and /HOLD pins, and configurable Quad Enable (QE) bit for flexible interface mode selection in boot memory and firmware update systems.
Technical Context
The W25Q256FVEIG implements a dual-mode command architecture: Standard SPI uses dedicated DI/DO pins, while Quad SPI repurposes /WP and /HOLD as IO2/IO3 when QE=1 in Status Register-2. It supports both 3-byte and 4-byte address modes, with automatic 4-byte entry via B7h instruction and persistent power-up configuration via ADP bit.
Its block diagram integrates page buffer logic, column/row decode, high-voltage generators for erase/program, and three 256-byte security registers with OTP lock bits (LB3–LB1). Erase suspend/resume (75h/7Ah), continuous read with wrap (77h), and burst read (0Ch) enable deterministic real-time firmware access without full chip blocking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 M-bit (32 MB), enabling full MCU firmware + parameter storage in single device |
| Interface Modes | Standard SPI, Dual I/O, Quad I/O, and QPI - selectable per application bandwidth needs |
| Max Clock Rate | 104 MHz SPI; enables 416 MB/s effective throughput in Quad I/O Fast Read mode |
| Erase Granularity | Uniform 4 KB sectors (8,192 total), allowing fine-grained firmware partitioning and OTA updates |
| Data Retention | 20+ years at +85°C, validated for long-life industrial deployments without refresh |
| Write Endurance | 100,000 program/erase cycles per sector, supporting frequent logging or configuration writes |
| Operating Voltage | 2.7 V to 3.6 V - compatible with 3.3 V logic rails and brown-out tolerant designs |
| Temperature Range | −40°C to +85°C - qualified for extended industrial ambient operation |
Pinout & Package
W25Q256FVEIG is packaged in an 8-pad WSON 8×6 mm (Package Code E), with exposed pad for thermal dissipation and footprint compatibility across Winbond's W25Q family.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; must transition high→low after power-up before first instruction accepted |
| 2 DO (IO1) | Data Output / Bidirectional I/O | Unidirectional output in Standard SPI; bidirectional in Dual/Quad modes; high-Z when /CS high |
| 3 /WP (IO2) | Write Protect Input / Bidirectional I/O | Hardware lock for status register when QE=0; becomes IO2 in Quad mode (QE=1) |
| 4 GND | Ground Reference | Primary return path for all I/O and core logic; connects to exposed pad on WSON package |
| 5 DI (IO0) | Data Input / Bidirectional I/O | Unidirectional input in Standard SPI; bidirectional in Dual/Quad modes; used for all instructions |
| 6 CLK | Serial Clock Input | Rising-edge sampled for input; falling-edge sampled for output; max 104 MHz frequency |
| 7 /HOLD or /RESET (IO3) | Hold/Reset Input / Bidirectional I/O | Pauses ongoing transfer when low (/HOLD); resets device when pulsed (/RESET on SOIC-16 only) |
| 8 VCC | Power Supply | 2.7–3.6 V supply; decoupling capacitor required within 5 mm of pin per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Quad Peripheral Interface (QPI) | Reduces instruction overhead to 2 clocks per command, enabling true execute-in-place (XIP) from flash |
| 4-Byte Address Mode Support | Persistent ADP bit ensures reliable access beyond 16 MB boundary without runtime mode switching |
| JEDEC SFDP Register | Enables automatic driver configuration in Linux/RTOS bootloaders without hard-coded timing parameters |
| 64-Bit Unique Serial Number | Provides hardware-rooted device identity for secure firmware binding and anti-cloning enforcement |
| Three 256-Byte Security Registers | OTP-lockable storage for keys, certificates, or calibration data-immune to bulk erase commands |
| Erase/Program Suspend & Resume | Allows foreground interrupt handling during background erase (e.g., sensor sampling during sector wipe) |
Applications
| Industrial PLC Firmware Storage | Automotive Telematics Boot Memory |
|---|---|
Use Scenario: Storing firmware images and configuration tables in programmable logic controllers deployed in factory automation environments with −40°C to +85°C ambient range. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch via Quad SPI to reduce external RAM dependency. Use Value: 4KB sector erase enables incremental firmware patching without full reflash; 100K-cycle endurance supports field-upgrade logging. |
Use Scenario: Hosting bootloader and secure boot manifest in LTE-connected vehicle telematics units requiring cryptographic verification before main application launch. IC Role / Device Role / Timing Role: Trusted execution root storing signed firmware headers and public keys in OTP-locked security registers. Use Value: 64-bit unique ID binds firmware image to hardware; SFDP register auto-configures timing for varying SoC SPI controllers. |
| Medical Imaging Device Parameter Storage | Smart Energy Meter Firmware + Calibration Data |
Use Scenario: Retaining user-calibrated imaging parameters and DICOM metadata across power cycles in portable ultrasound equipment. IC Role / Device Role / Timing Role: High-reliability parameter archive with hardware write protection against accidental overwrite during diagnostics. Use Value: /WP pin + BP bits protect critical calibration sectors; 20-year data retention ensures lifetime validity without battery backup. |
Use Scenario: Storing metrology firmware, tariff tables, and meter-specific calibration coefficients in ANSI C12.22-compliant smart meters. IC Role / Device Role / Timing Role: Dual-function memory: boot code in upper 16 MB, calibrated constants in lower protected sectors. Use Value: Top/bottom block protection isolates firmware from field-updatable calibration data; 4.5 mA active current extends battery life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L25645GMI-10G | Same density (256Mb), but supports only Standard/Dual SPI; no QPI or 4-byte addressing; 80 MHz max clock | Lacks XIP optimization and >16 MB support; suitable for legacy SPI-only host controllers | Select when QPI or 4-byte addressing is unnecessary and cost sensitivity outweighs future scalability |
| S25FL256SAGMFIR00 | 256Mb with Quad SPI and 4-byte mode; includes built-in ECC and sector lockdown; 133 MHz max clock | Higher reliability features increase BOM cost; ECC required for safety-critical firmware integrity | Prefer for ISO 26262 ASIL-B systems where uncorrectable bit errors must be prevented |
Compared with MX25L25645GMI-10G, W25Q256FVEIG delivers higher throughput and scalable addressing; versus S25FL256SAGMFIR00, it trades integrated ECC for lower latency and broader ecosystem tooling support in standard SPI bootloaders.
Availability
W25Q256FVEIG is available at Aetrix Electronics and suitable for industrial control systems, automotive telematics modules, and medical diagnostic devices requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for W25Q256FVEIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR/NAND flash and SRAM, with over 30 years of foundry-independent design expertise.
The W25Q series was designed specifically for embedded code storage and execute-in-place (XIP) applications, balancing high-speed Quad I/O performance with robust data retention and hardware security features for industrial and automotive use cases.
FAQ
What is the package type and lead count for W25Q256FVEIG?
W25Q256FVEIG uses an 8-pad WSON (8×6 mm) package with exposed thermal pad (Package Code E). It has eight terminals: /CS, DO (IO1), /WP (IO2), GND, DI (IO0), CLK, /HOLD or /RESET (IO3), and VCC. This compact footprint supports high-density PCB layouts and thermal performance matching larger SOIC variants.
Does W25Q256FVEIG support 4-byte addressing, and how is it enabled?
Yes, W25Q256FVEIG supports 4-byte addressing via the Enter 4-Byte Address Mode instruction (B7h) and Exit instruction (E9h). The ADP bit in Status Register-1 determines power-up default mode: if ADP=1, device boots in 4-byte mode; if ADP=0, it defaults to 3-byte mode. This setting is non-volatile and persists across power cycles.
How does the Quad Enable (QE) bit affect pin functionality on W25Q256FVEIG?
The QE bit (bit 1 of Status Register-2) controls whether /WP and /HOLD pins function as hardware protection inputs or as IO2/IO3 in Quad SPI mode. When QE=0, /WP and /HOLD retain their standard protection roles; when QE=1, they become bidirectional data lines, disabling hardware write/halt functions unless explicitly reconfigured.
What is the purpose of the three 256-byte Security Registers in W25Q256FVEIG?
The three 256-byte Security Registers in W25Q256FVEIG provide OTP-lockable storage for cryptographic keys, device certificates, or calibration data. Once locked via LB1–LB3 bits, their contents survive all erase operations-including chip erase-and cannot be modified, ensuring hardware-enforced data immutability for secure boot and anti-counterfeiting.
Can W25Q256FVEIG be used for Execute-in-Place (XIP) applications, and what features enable this?
Yes, W25Q256FVEIG supports true XIP via its Continuous Read Mode and Quad Peripheral Interface (QPI). With as few as 8 clocks to initiate a read and 416 MB/s effective throughput in Quad I/O Fast Read mode, it delivers deterministic latency and bandwidth sufficient to replace parallel NOR flash in ARM Cortex-M and RISC-V boot sequences without external RAM buffering.
W25Q256FVEIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25Q256FVEIG FAQ
1.How can I place an order for W25Q256FVEIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q256FVEIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q256FVEIG reliable?
The price and inventory of W25Q256FVEIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256FVEIG is usually 5 days.
3.What payment methods are accepted for W25Q256FVEIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256FVEIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q256FVEIG?
W25Q256FVEIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q256FVEIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q256FVEIG?
For technical support, including W25Q256FVEIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256FVEIG requirements.
6.How does Aetrix verify that W25Q256FVEIG is sourced from the original manufacturer or authorized distributors?
All W25Q256FVEIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256FVEIG meets industry standards.
7.What is the process for return or replacement of W25Q256FVEIG?
All W25Q256FVEIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256FVEIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q256FVEIG part is unused and in its original packaging.
Return procedure for W25Q256FVEIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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