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Winbond Electronics Corporation W25Q256FVFIP
- Part No.:
- W25Q256FVFIP
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
W25Q256FVFIP.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
W25Q256FVFIP from Winbond is a 256M-bit (32MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, organized into 131,072 × 256-byte pages with 4KB uniform sector erase, 104MHz max clock, and single 2.7–3.6V supply. It enables XIP code execution in embedded boot loaders and stores firmware, configuration, and logs in space-constrained industrial controllers.
For engineers reviewing the W25Q256FVFIP datasheet, W25Q256FVFIP pinout, W25Q256FVFIP application, or W25Q256FVFIP equivalent, key selection factors include 4-byte addressing support, Quad Enable (QE) bit configuration, /HOLD vs /RESET pin behavior in SOIC-16 vs WSON packages, and JEDEC SFDP register compatibility for auto-configuration.
Technical Context
The W25Q256FVFIP implements a flexible SPI command architecture with three address modes (3-byte, 4-byte, and ADP-configurable power-up mode), enabling seamless migration from legacy 16MB designs to 32MB capacity without software rewrite when using 4-byte addressing. Its status register includes volatile/non-volatile BP3–BP0, TB, CMP, SRP0/SRP1, QE, and HOLD/RST bits that jointly control hardware write protection and I/O function mapping.
It supports true execute-in-place (XIP) via Continuous Read Mode with ≤8-clock instruction overhead and wrap lengths of 8/16/32/64 bytes; Fast Read Quad I/O achieves 416MHz effective throughput (104MHz × 4), outperforming parallel flash in bandwidth-per-pin efficiency while maintaining low active current (4mA typ.) and deep power-down (<1µA).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 M-bit (32 MB), organized as 131,072 × 256-byte programmable pages |
| Interface Modes | Standard SPI (4-wire), Dual SPI (4-wire), Quad SPI (4-wire), QPI (4-wire); QE bit required for Quad I/O |
| Max Clock Frequency | 104 MHz - enables 50 MB/s continuous read transfer rate with Fast Read Quad I/O |
| Erase Granularity | Uniform 4 KB sectors (8,192 total), 32 KB blocks (1,024), 64 KB blocks (512), and full chip erase |
| Write Endurance | 100,000 program/erase cycles per sector - supports frequent firmware update logging |
| Data Retention | 20 years at +25°C - validated for long-life industrial deployments without refresh |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3 V logic rails and brown-out tolerant power domains |
| Operating Temp | −40°C to +85°C - qualified for extended temperature industrial and automotive under-hood applications |
Pinout & Package
W25Q256FVFIP is packaged in an 8-pad WSON 8×6 mm (Package Code E) with exposed pad thermal enhancement. Pin functions are defined per SPI mode: /CS, CLK, DI (IO0), DO (IO1), /WP (IO2), /HOLD or /RESET (IO3), VCC, GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable; high-impedance DO during deselect; must transition high→low after power-up before first instruction |
| DI (IO0) | Serial Data Input / Bidirectional I/O | Input for Standard/Dual SPI; IO0 in Quad SPI; requires QE=1 to activate bidirectional mode |
| DO (IO1) | Serial Data Output / Bidirectional I/O | Output for Standard/Dual SPI; IO1 in Quad SPI; high-Z during /HOLD assertion |
| /WP (IO2) | Write Protect Input / Bidirectional I/O | Hardware lock for status register when QE=0; becomes IO2 in Quad SPI (QE=1) |
| /HOLD or /RESET (IO3) | Hold/Reset Input / Bidirectional I/O | Pauses ongoing SPI transaction when low (QE=0); becomes IO3 in Quad SPI (QE=1); /RESET function only available on SOIC-16 package |
| CLK | Serial Clock Input | Rising-edge sampling for input, falling-edge sampling for output; timing-critical for 104MHz operation |
| VCC | Power Supply | 2.7–3.6 V supply; decoupling capacitor required within 10 mm of pin per layout guidelines |
| GND | Ground Reference | Signal and power ground; tied to exposed pad for thermal and EMI performance in WSON |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode | Enables true XIP with ≤8-clock instruction overhead and configurable 8/16/32/64-byte wrap - eliminates external buffer latency in boot ROMs |
| Quad Peripheral Interface (QPI) | Reduces command overhead by encoding multi-byte instructions in 2-clock cycles - cuts SPI transaction count by ~50% vs standard SPI |
| JEDEC SFDP Register | Provides standardized, read-only parameter table (5Ah) for automatic driver initialization - eliminates hard-coded timing constants in HAL layers |
| 64-bit Unique ID | Factory-programmed serial number (4Bh) enables secure device binding, anti-cloning, and field firmware version tracking |
| Security Registers | Three 256-byte OTP-lockable registers (42h/44h/48h) store cryptographic keys or calibration data immune to bulk erase |
| Erase/Program Suspend | 75h/7Ah commands allow background sector erase to pause/resume - enables real-time interrupt servicing during flash maintenance |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Image |
|---|---|
Use Scenario: Storing firmware images and runtime configuration parameters in programmable logic controllers with strict IEC 61131-3 compliance requirements. IC Role / Device Role / Timing Role: Primary non-volatile code storage executing directly from flash (XIP) during cold start; handles over-the-air (OTA) firmware updates with atomic sector swap. Use Value: 4KB uniform sectors enable precise partitioning of bootloader, application, and rollback regions; 100K-cycle endurance supports daily field updates across 10+ years. | Use Scenario: Holding safety-critical boot code and sensor calibration data for camera/radar ECUs requiring ASIL-B functional safety certification. IC Role / Device Role / Timing Role: Secure boot ROM replacement with verified signature checking; provides deterministic <50ms cold-boot time via Continuous Read Mode. Use Value: 64-bit Unique ID binds firmware to hardware; Security Registers store asymmetric key pairs; 20-year data retention meets automotive lifecycle mandates. |
| Medical Imaging Device Log Buffer | Networking Equipment Configuration Archive |
Use Scenario: Capturing diagnostic logs, calibration history, and audit trails in portable ultrasound and MRI systems subject to FDA 21 CFR Part 11. IC Role / Device Role / Timing Role: High-reliability parameter archive with wear-leveling-aware firmware; supports concurrent log writes and firmware reads via Erase/Program Suspend. Use Value: 100,000 erase cycles ensure >10 years of daily log rotation; hardware write protection (BP bits + /WP pin) prevents accidental overwrite of regulatory records. | Use Scenario: Storing switch/router configuration templates, crypto certificates, and failover images in carrier-grade Ethernet equipment with zero-downtime upgrade requirements. IC Role / Device Role / Timing Role: Dual-bank configuration storage with atomic bank switching; QPI interface accelerates config reload during switchover. Use Value: 416MHz effective throughput reduces config restore time by 3× vs standard SPI; SFDP register auto-negotiates optimal timing for different PHY variants. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L25673FMI-10G | Same density (256Mb), 133MHz max clock, supports DTR mode; no QPI; uses different SFDP layout | Lacks QPI and 4-byte address auto-detect; requires manual address mode management in driver | Choose for higher clock margin in non-QPI systems; verify SFDP parser compatibility before migration |
| S25FL256SAGMFV000 | 256Mb, 80MHz max clock, HyperBus interface option; includes ECC engine; different security register model | Lower throughput than W25Q256FVFIP; ECC adds latency but improves reliability in high-radiation environments | Prefer where bit-error resilience outweighs speed; not drop-in due to pinout and command set differences |
Compared with MX25L25673FMI-10G and S25FL256SAGMFV000, the W25Q256FVFIP delivers superior XIP performance via QPI and Continuous Read Mode, broader hardware write protection granularity (4KB sectors), and standardized SFDP-based initialization - making it optimal for cost-sensitive, high-throughput embedded boot applications.
Availability
W25Q256FVFIP is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot image loading, and medical imaging device log buffering requiring stable component supply across multi-year production cycles.
Supply support for W25Q256FVFIP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer markets.
The W25Q series targets high-performance, low-power serial NOR flash applications demanding XIP capability, robust security, and flexible erase architecture - specifically engineered for boot code, firmware, and parameter storage in resource-constrained systems.
FAQ
What is the difference between W25Q256FVFIP and W25Q256FV?
The W25Q256FVFIP is a specific ordering variant of the W25Q256FV family, denoting the 8-pad WSON 8×6 mm package (Package Code E) with Industrial temperature range (−40°C to +85°C) and lead-free, RoHS-compliant finish. The base part number W25Q256FV refers to the product family; W25Q256FVFIP identifies the exact manufacturable part with defined package, marking, and qualification level. All electrical and functional specifications match the W25Q256FV datasheet.
Does W25Q256FVFIP support 4-byte addressing by default after power-up?
No. The W25Q256FVFIP powers up in 3-byte address mode. To enable 4-byte addressing, the host must issue the Enter 4-Byte Address Mode instruction (B7h). The power-up address mode (ADP bit in Status Register-3) can be programmed non-volatily to default to 4-byte mode on subsequent power cycles, but this requires explicit configuration via Write Status Register-3 (11h) after initial power-up.
How does the /HOLD pin behave when Quad SPI mode is enabled on W25Q256FVFIP?
When the Quad Enable (QE) bit in Status Register-2 is set to 1, the /HOLD pin on the W25Q256FVFIP is reassigned as IO3 for Quad SPI data I/O and its hold functionality is disabled. This behavior is documented in Section 3.2 and 4.4 of the datasheet. Hardware hold operation is only available in Standard and Dual SPI modes (QE = 0). In WSON and PDIP packages, IO3 serves dual purpose; in SOIC-16, /RESET remains independent.
Can W25Q256FVFIP be used as a direct replacement for W25Q256JVSIM in an existing design?
No - W25Q256FVFIP and W25Q256JVSIM are not pin-compatible or functionally identical. The W25Q256JVSIM is a 16-pin SOIC package with dedicated /RESET pin and different pinout (e.g., /RESET on Pin 3), whereas W25Q256FVFIP is an 8-pad WSON with /HOLD or /RESET shared on Pad 7. Electrical characteristics and timing parameters also differ slightly. Migration requires PCB layout change and firmware validation of status register behavior and QE bit handling.
What is the purpose of the Security Registers in W25Q256FVFIP and how are they protected?
The W25Q256FVFIP includes three 256-byte Security Registers (accessible via instructions 42h/44h/48h) designed to store sensitive data such as encryption keys, calibration coefficients, or device-specific credentials. Each register can be permanently locked using One-Time-Programmable (OTP) bits (LB1–LB3 in Status Register-3), preventing further writes once set. Access is restricted to standard SPI commands and requires no special voltage; protection relies entirely on OTP fuse integrity and register-level write disable.
W25Q256FVFIP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
W25Q256FVFIP FAQ
1.How can I place an order for W25Q256FVFIP through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q256FVFIP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q256FVFIP reliable?
The price and inventory of W25Q256FVFIP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256FVFIP is usually 5 days.
3.What payment methods are accepted for W25Q256FVFIP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256FVFIP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q256FVFIP?
W25Q256FVFIP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q256FVFIP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q256FVFIP?
For technical support, including W25Q256FVFIP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256FVFIP requirements.
6.How does Aetrix verify that W25Q256FVFIP is sourced from the original manufacturer or authorized distributors?
All W25Q256FVFIP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256FVFIP meets industry standards.
7.What is the process for return or replacement of W25Q256FVFIP?
All W25Q256FVFIP units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256FVFIP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q256FVFIP part is unused and in its original packaging.
Return procedure for W25Q256FVFIP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25Q256FVFIP Tags
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