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Winbond Electronics Corporation W25Q256FVFIQ
- Part No.:
- W25Q256FVFIQ
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
W25Q256FVFIQ.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,633
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Product details
Overview
W25Q256FVFIQ from Winbond is a 256M-bit (32MB) serial NOR flash memory supporting Standard/Dual/Quad SPI and QPI interfaces, operating at 2.7–3.6V with 104MHz max clock, 4KB uniform sector erase, and 256-byte page programming. It enables XIP execution in embedded boot code storage, firmware update partitions, and parameter retention in industrial controllers.
For engineers reviewing the W25Q256FVFIQ datasheet, W25Q256FVFIQ pinout, W25Q256FVFIQ application, or W25Q256FVFIQ equivalent, key selection criteria include 4-byte addressing support, Quad Enable (QE) bit configuration, /HOLD or /RESET pin multiplexing in 8-pin packages, and JEDEC SFDP register compatibility for auto-configuration.
Technical Context
The W25Q256FVFIQ implements a flexible SPI command architecture with three address modes (3-byte, 4-byte, and ADP-configurable power-up mode), enabling seamless migration from legacy 16MB designs to 32MB capacity without bus width changes. Its status register includes volatile/non-volatile BP3–BP0, TB, CMP, SRP0/SRP1, and QE bits for granular hardware/software write protection.
It supports dual/quad I/O data transfers using IO0–IO3 pins, where /WP and /HOLD become IO2 and IO3 respectively when QE=1 - a configuration that disables their standard functions. The device integrates three 256-byte one-time-programmable (OTP) security registers and a 64-bit unique ID for secure firmware binding.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 M-bit (32 MB), organized as 131,072 × 256-byte pages |
| Interface Modes | Standard SPI, Dual I/O SPI, Quad I/O SPI, and QPI - all supporting 3- or 4-byte addressing |
| Max Clock Frequency | 104 MHz (SPI); enables 208 MB/s dual-I/O and 416 MB/s quad-I/O effective throughput |
| Erase Granularity | Uniform 4 KB sectors (8,192 total), plus 32 KB and 64 KB blocks - critical for OTA firmware partitioning |
| Write Endurance | 100,000 program/erase cycles per sector - validated for field-updatable control logic |
| Data Retention | 20 years at +85°C - meets industrial temperature lifecycle requirements |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3 V logic rails and brown-out tolerant power domains |
| Operating Temp | –40°C to +85°C - qualified for extended-temperature industrial and automotive ECUs |
Pinout & Package
W25Q256FVFIQ uses an 8-pad WSON 8×6-mm package (JEDEC MO-252, package code E), with exposed thermal pad. Pin 1 is /CS; pins 2–3–5–7 are bidirectional I/Os (IO1, IO2, IO0, IO3); pin 4 is GND; pin 6 is CLK; pin 8 is VCC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS (Pin 1) | Chip Select input | Active-low enable: high = high-Z outputs and standby current (<1 µA); must transition high→low after power-up before first instruction |
| DO / IO1 (Pin 2) | Data output / bidirectional I/O | Standard SPI output only; becomes bidirectional in Dual/Quad modes - requires no external pull-up in QPI |
| /WP / IO2 (Pin 3) | Write protect input / bidirectional I/O | Hardware lock for status register when QE=0; repurposed as IO2 in Quad mode - disables WP function |
| GND (Pin 4) | Ground reference | Primary return path for VCC and I/O signals; must be low-inductance connection for timing integrity |
| DI / IO0 (Pin 5) | Data input / bidirectional I/O | Standard SPI input only; becomes bidirectional in Dual/Quad modes - used for all instruction/address/data ingress |
| CLK (Pin 6) | Serial clock input | Edge-triggered timing source for all SPI/QPI operations; 104 MHz max frequency defines minimum tCH/tCL |
| /HOLD or /RESET / IO3 (Pin 7) | Hold or reset input / bidirectional I/O | Pauses ongoing read/write when active low (QE=0); becomes IO3 in Quad mode - disables both HOLD and RESET |
| VCC (Pin 8) | Power supply | 2.7–3.6 V core voltage; decoupling capacitor (≥1 µF) required within 5 mm of pin for stable 104 MHz operation |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode with Wrap | Enables true XIP execution with ≤8-clock instruction overhead per 24-bit address - eliminates wait states in boot ROM fetches |
| Erase/Program Suspend & Resume | Allows background interrupt servicing during long erase cycles (e.g., 64KB block erase ~300 ms) without data corruption |
| JEDEC SFDP Register | Provides standardized, vendor-agnostic parameter discovery - eliminates hard-coded timing constants in bootloader drivers |
| 64-bit Unique Serial Number | Factory-programmed per-device ID used for cryptographic binding, license enforcement, and anti-cloning in secure boot flows |
| Three 256-byte Security Registers | OTP-locked storage for keys, certificates, or calibration data - prevents runtime overwrite or readback after programming |
| Quad Enable (QE) Bit Control | Non-volatile Status Register-2 bit that reconfigures /WP and /HOLD as IO2/IO3 - enables full quad I/O without additional pins |
Applications
| Boot Code Storage | Firmware Update Partition |
|---|---|
Use Scenario: Storing primary bootloader and initial application image in microcontroller-based edge gateways. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability via Quad SPI interface, directly executed by ARM Cortex-M7 core. Use Value: Eliminates external RAM copy step during boot; 416 MB/s quad I/O bandwidth reduces boot time by >40% vs. standard SPI. | Use Scenario: Isolating field-upgradable firmware images in medical diagnostic devices requiring A/B partitioning. IC Role / Device Role / Timing Role: Dual-bank flash memory with atomic sector erase and suspend/resume - ensures safe over-the-air updates. Use Value: Enables fail-safe rollback using 4KB sector granularity; 100K-cycle endurance supports ≥500 field updates over product lifetime. |
| Parameter & Calibration Data | Secure Key Storage |
Use Scenario: Retaining sensor calibration coefficients and user preferences across power cycles in HVAC controllers. IC Role / Device Role / Timing Role: Low-power, byte-addressable non-volatile storage accessed via SPI during system initialization. Use Value: 1 µA power-down current extends battery life in wireless sensors; 20-year data retention guarantees accuracy over equipment lifespan. | Use Scenario: Storing root-of-trust keys for secure boot in industrial PLCs with tamper-resistant firmware validation. IC Role / Device Role / Timing Role: OTP-protected security register bank accessed only by trusted execution environment (TEE). Use Value: Prevents key extraction via debugger or bus snooping; 256-byte per register allows RSA-2048 private key + certificate chain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L25635FMI-10G | Same density, 104 MHz clock, but uses different QE bit location (SR-1 vs SR-2) and lacks SFDP register | No auto-discovery support - requires hardcoded timing parameters in driver; no 4-byte address mode exit command (E9h) | Choose only if existing design already uses Macronix toolchain and does not require SFDP or 4-byte mode flexibility |
| S25FL256SAGMFIR00 | Offers 133 MHz QPI, integrated ECC, and configurable dummy cycles - but requires 1.8 V I/O supply alongside 3.3 V core | Higher performance with error correction for mission-critical logging; dual-voltage interface adds PCB complexity | Select when system demands built-in bit-flip correction and >104 MHz throughput, and can accommodate dual-rail power design |
Compared with MX25L25635FMI-10G and S25FL256SAGMFIR00, the W25Q256FVFIQ provides standardized SFDP discovery, unified 3.3 V operation, and robust 4-byte addressing - making it optimal for scalable, maintainable bootloader and firmware architectures.
Availability
W25Q256FVFIQ is available at Aetrix Electronics and suitable for industrial control systems, medical diagnostics equipment, and automotive infotainment head units requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across manufacturing lots.
Supply support for W25Q256FVFIQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial NOR/NAND flash, RAM, and mobile DRAM, serving industrial, communications, and consumer markets.
The W25Q series targets high-reliability embedded systems needing fast, secure, and pin-efficient code storage - designed specifically for XIP-capable microcontrollers and secure boot implementations.
FAQ
What is the package type and lead count of the W25Q256FVFIQ?
The W25Q256FVFIQ uses an 8-pad WSON (8×6 mm) package with exposed thermal pad (JEDEC MO-252, package code E). It has eight terminals: /CS, DO/IO1, /WP/IO2, GND, DI/IO0, CLK, /HOLD or /RESET/IO3, and VCC. This compact footprint supports high-density PCB layouts while maintaining thermal performance for sustained 104 MHz operation.
Does the W25Q256FVFIQ support 4-byte addressing, and how is it enabled?
Yes, the W25Q256FVFIQ supports both 3-byte and 4-byte addressing modes. 4-byte mode is entered using the Enter 4-Byte Address Mode instruction (B7h) and exited with Exit 4-Byte Address Mode (E9h). The Power-Up Address Mode (ADP) bit in Status Register-3 determines default behavior at power-on, allowing persistent configuration without host intervention.
How does the Quad Enable (QE) bit affect pin functionality on the W25Q256FVFIQ?
The QE bit (bit 1 of Status Register-2) controls whether /WP and /HOLD pins function as hardware controls or as IO2/IO3 in Quad SPI mode. When QE=0, /WP and /HOLD retain their standard roles; when QE=1, they become bidirectional I/Os - disabling hardware write protection and hold functionality. This trade-off enables full quad I/O without adding pins.
Can the W25Q256FVFIQ be used for secure boot applications?
Yes, the W25Q256FVFIQ supports secure boot through multiple features: a factory-programmed 64-bit unique ID for device authentication, three 256-byte one-time-programmable (OTP) security registers for key storage, and software/hardware write protection with top/bottom and individual sector locking. These allow cryptographic binding and tamper-resistant firmware validation in trusted execution environments.
What is the difference between the W25Q256FVFIQ and W25Q256FVIQ?
The W25Q256FVFIQ and W25Q256FVIQ share identical electrical specifications, pinout, and feature set. The 'F' suffix in W25Q256FVFIQ denotes the 8-pad WSON 8×6-mm package (code E), while W25Q256FVIQ uses the 16-pin SOIC 300-mil package (code F) with dedicated /RESET pin. Both are functionally interchangeable in software but require different PCB footprints and layout considerations.
W25Q256FVFIQ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
W25Q256FVFIQ FAQ
1.How can I place an order for W25Q256FVFIQ through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q256FVFIQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q256FVFIQ reliable?
The price and inventory of W25Q256FVFIQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256FVFIQ is usually 5 days.
3.What payment methods are accepted for W25Q256FVFIQ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256FVFIQ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q256FVFIQ?
W25Q256FVFIQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q256FVFIQ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q256FVFIQ?
For technical support, including W25Q256FVFIQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256FVFIQ requirements.
6.How does Aetrix verify that W25Q256FVFIQ is sourced from the original manufacturer or authorized distributors?
All W25Q256FVFIQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256FVFIQ meets industry standards.
7.What is the process for return or replacement of W25Q256FVFIQ?
All W25Q256FVFIQ units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256FVFIQ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q256FVFIQ part is unused and in its original packaging.
Return procedure for W25Q256FVFIQ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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