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Winbond Electronics Corporation W25Q256FVFJF TR

Part No.:
W25Q256FVFJF TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25Q256FVFJF TR.pdf
Description:
IC FLASH 256MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,975

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Product details

Overview

W25Q256FVFJF TR from Winbond is a 256M-bit (32MB) serial NOR flash memory supporting Standard/Dual/Quad SPI and QPI interfaces, organized into 131,072 × 256-byte pages with 4KB uniform sector erase granularity. It operates from 2.7V to 3.6V, delivers up to 104MHz SPI clock speed (416MHz equivalent Quad I/O), and targets code storage, XIP execution, and firmware update in space-constrained embedded systems.

For engineers reviewing the W25Q256FVFJF TR datasheet, W25Q256FVFJF TR pinout, W25Q256FVFJF TR application, or W25Q256FVFJF TR equivalent, this page provides verified package mapping (8-pad WSON 8×6 mm), confirmed pin functions including /CS, CLK, DI/DO/IO0–IO3, /WP, /HOLD, VCC and GND, real-world timing behavior, and validated alternative options for firmware storage and boot code applications.

Technical Context

The W25Q256FVFJF TR implements a flexible SPI-compatible command set with dual- and quad-I/O modes enabled via non-volatile Quad Enable (QE) bit in Status Register-2. Its architecture supports both 3-byte and 4-byte addressing, with dedicated instructions for sector/block/chip erase, page program, suspend/resume, and security register access.

It integrates JEDEC-standard Manufacturer/Device ID, SFDP register for discoverable parameters, 64-bit unique serial number, and three 256-byte OTP-lockable security registers. The /WP and /HOLD pins function as IO2 and IO3 respectively in Quad mode, and the device supports hardware reset via /RESET only in SOIC-16 and TFBGA packages-not in the WSON variant.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 M-bit (32 MB), enabling full firmware image storage for mid-tier microcontrollers
Interface ModesStandard SPI, Dual I/O, Quad I/O, and QPI - selectable via QE bit and instruction set
Max Clock Frequency104 MHz SPI; enables 416 MB/s effective throughput in Quad I/O Fast Read mode
Erase GranularityUniform 4 KB sectors (8,192 total), allowing fine-grained firmware partitioning and OTA updates
Write Endurance100,000 program/erase cycles per sector - sufficient for field firmware revision management
Data Retention20 years at +85°C - qualified for industrial temperature operation without refresh
Supply Voltage2.7 V to 3.6 V - compatible with 3.3 V logic domains and low-power MCU host systems
Operating Temp−40°C to +85°C - meets extended industrial grade requirements

Pinout & Package

W25Q256FVFJF TR is packaged in an 8-pad WSON 8×6 mm (Package Code E), with exposed thermal pad (non-electrical). Pin 1 is /CS; pins 2–3 and 5–7 serve bidirectional I/O roles depending on interface mode; pin 4 is GND; pin 8 is VCC.

Pin/TerminalCircuit RoleDesign Meaning
/CS (Pin 1)Chip Select InputActive-low enable: high = high-Z output, low = active SPI communication; must transition high→low after power-up to accept commands
DO / IO1 (Pin 2)Data Output / Quad I/OUnidirectional output in Standard SPI; bidirectional I/O in Dual/Quad modes; used for status/data readback
/WP / IO2 (Pin 3)Write Protect Input / Quad I/OHardware write lock for status register when QE=0; becomes IO2 in Quad mode (QE=1)
GND (Pin 4)Ground ReferencePrimary return path for VCC and all I/O signals; requires low-impedance PCB connection
DI / IO0 (Pin 5)Data Input / Quad I/OUnidirectional input in Standard SPI; bidirectional I/O in Dual/Quad modes; carries instructions, addresses, and data
CLK (Pin 6)Serial Clock InputMaster-generated edge-triggered timing source; rising edge for input, falling edge for output in all modes
/HOLD / IO3 (Pin 7)Hold Input / Quad I/OPauses ongoing transfer when low (active); becomes IO3 in Quad mode (QE=1); not functional as /RESET in WSON
VCC (Pin 8)Power Supply2.7–3.6 V supply; decoupling capacitor (≥1 µF) required within 5 mm of pin for stable operation

Key Features

FeatureDesign Value
Continuous Read ModeEnables true XIP execution with ≤8-clock instruction overhead per 24-bit address, reducing CPU wait states
Erase/Program SuspendAllows background interrupt handling during long erase/program operations without data corruption risk
Security RegistersThree 256-byte OTP-lockable registers for secure key storage, bootloader validation, or calibration data
JEDEC SFDP SupportProvides standardized, host-readable parameter table for automatic configuration of timing, voltage, and feature sets
Unique 64-bit IDFactory-programmed serial number enabling device-level traceability and secure provisioning in production

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing firmware images and configuration tables in programmable logic controllers with limited board area and no parallel bus.

IC Role / Device Role / Timing Role: Primary non-volatile code storage device interfaced via Quad SPI to ARM Cortex-M7 MCU; provides boot code and runtime firmware.

Use Value: 4KB sector erase enables incremental firmware patching without full reflash; 104MHz interface sustains >40 MB/s read throughput for fast boot times.

Use Scenario: Holding boot loader and safety-critical sensor fusion firmware in automotive camera modules operating across −40°C to +85°C.

IC Role / Device Role / Timing Role: Secure boot memory accessed via QPI by SoC during cold start; leverages Unique ID and Security Registers for authentication.

Use Value: 20-year data retention ensures firmware integrity over vehicle lifetime; hardware write protection prevents accidental corruption during ECU reset sequences.

IoT Edge Gateway ConfigurationMedical Imaging Device Update Storage

Use Scenario: Storing encrypted configuration profiles, TLS certificates, and OTA update payloads in battery-powered cellular gateways.

IC Role / Device Role / Timing Role: Parameter and credential store accessed via Dual SPI by ESP32-WROVER; isolated from main application flash.

Use Value: Individual sector lock (via 36h/39h instructions) secures certificate partitions against overwrite; <1 µA power-down current extends battery life.

Use Scenario: Hosting DICOM firmware patches and calibration data in portable ultrasound devices requiring FDA-compliant traceability.

IC Role / Device Role / Timing Role: Field-upgradable firmware repository interfaced via Standard SPI to FPGA-based imaging controller.

Use Value: JEDEC SFDP register allows automatic timing adaptation across production batches; 100K-cycle endurance supports frequent clinical software updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX25L25645GMI-10GSame density (256Mb), 104MHz max clock, but uses different SFDP layout and lacks QPI modeNo QPI support limits high-speed XIP performance; different security register implementationChoose when QPI is unused and Winbond-specific features like Octal Word Read are unnecessary
S25FL256SAGMFI010256Mb, 80MHz max clock, supports HyperBus interface (not SPI/QPI); different pinout and command setRequires HyperFlash-capable host controller; incompatible with standard SPI boot ROMsSelect only if migrating to Cypress/Infineon ecosystem with HyperBus-enabled SoC

Compared with MX25L25645GMI-10G and S25FL256SAGMFI010, the W25Q256FVFJF TR offers broader interface compatibility (QPI included), higher clock rate, and Winbond's mature SPI command ecosystem-making it optimal for new designs requiring flexibility, speed, and broad MCU vendor support.

Availability

W25Q256FVFJF TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and IoT edge gateway configuration requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for W25Q256FVFJF TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.

The W25Q series is designed for high-performance, space-constrained embedded systems requiring reliable code storage, execute-in-place capability, and robust security features - targeting industrial, automotive, and networking applications.

FAQ

What interface protocols does the W25Q256FVFJF TR support?

The W25Q256FVFJF TR supports Standard SPI, Dual SPI, Quad SPI, and Quad Peripheral Interface (QPI) protocols. QPI mode is enabled by setting the Quad Enable (QE) bit in Status Register-2 and using the 38h instruction. All modes operate with 3-byte or 4-byte addressing, and the device maintains full command compatibility across interfaces. The W25Q256FVFJF TR does not support Octal SPI or HyperBus.

Does the W25Q256FVFJF TR include hardware reset functionality?

No, the W25Q256FVFJF TR in its 8-pad WSON 8×6 mm package (FJF suffix) does not provide a dedicated /RESET pin. The /HOLD pin (Pin 7) can be configured as /RESET only in SOIC-16 and TFBGA packages, per datasheet Section 3.4 and 4.6. For WSON-packaged W25Q256FVFJF TR, reset must be implemented via software command (66h + 99h) or power cycle.

What is the actual erase block structure of the W25Q256FVFJF TR?

The W25Q256FVFJF TR contains 8,192 uniform 4KB sectors, 512 32KB blocks, and 256 64KB blocks. Sector erase (20h) affects one 4KB unit; 32KB block erase (52h) clears 8 contiguous sectors; 64KB block erase (D8h) clears 16 contiguous sectors; chip erase (C7h/60h) clears the entire 32MB array. This hierarchy enables precise firmware partitioning and OTA update strategies.

Can the W25Q256FVFJF TR be used for Execute-in-Place (XIP) applications?

Yes, the W25Q256FVFJF TR supports true XIP operation via Continuous Read Mode with Quad I/O or QPI. Its ≤8-clock instruction overhead per 24-bit address and 104MHz clock (416MB/s effective bandwidth) allow direct code execution from flash without copying to RAM. Verified use cases include ARM Cortex-M and RISC-V SoCs with SPI/XIP boot ROM support.

How is write protection implemented on the W25Q256FVFJF TR?

Write protection on the W25Q256FVFJF TR combines hardware and software methods: hardware /WP pin (active-low, disabled in Quad mode), volatile/non-volatile Block Protect (BP0–BP3), Top/Bottom (TB), Complement (CMP), and Status Register Protect (SRP0/SRP1) bits. Protection granularity ranges from single 4KB sectors to full array, and settings persist through power cycles when written to non-volatile bits.

W25Q256FVFJF TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25Q256FVFJF TR FAQ

1.How can I place an order for W25Q256FVFJF TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q256FVFJF TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q256FVFJF TR reliable?

The price and inventory of W25Q256FVFJF TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256FVFJF TR is usually 5 days.

3.What payment methods are accepted for W25Q256FVFJF TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256FVFJF TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q256FVFJF TR?

W25Q256FVFJF TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q256FVFJF TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q256FVFJF TR?

For technical support, including W25Q256FVFJF TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256FVFJF TR requirements.

6.How does Aetrix verify that W25Q256FVFJF TR is sourced from the original manufacturer or authorized distributors?

All W25Q256FVFJF TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256FVFJF TR meets industry standards.

7.What is the process for return or replacement of W25Q256FVFJF TR?

All W25Q256FVFJF TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256FVFJF TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q256FVFJF TR part is unused and in its original packaging.

Return procedure for W25Q256FVFJF TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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