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Winbond Electronics Corporation W25Q256JVBJM

Part No.:
W25Q256JVBJM
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25Q256JVBJM.pdf
Description:
IC FLASH 256MBIT SPI 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,749

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Product details

Overview

W25Q256JVBJM from Winbond is a 256 M-bit (32 MB) serial NOR flash memory IC supporting Dual/Quad SPI, QPI, and Double Transfer Rate (DTR) read modes, operating from 2.7V to 3.6V with -40°C to +105°C industrial-plus temperature range. It features 131,072 × 256-byte programmable pages, 4 KB uniform sector erase, and hardware /WP and /HOLD pins - used in embedded boot code storage, firmware update storage, and XIP-capable microcontroller systems.

For engineers reviewing the W25Q256JVBJM datasheet, W25Q256JVBJM pinout, W25Q256JVBJM application, or W25Q256JVBJM equivalent, key selection criteria include 133 MHz SPI clock support, DTR read capability, 4-byte addressing mode, JEDEC SFDP register compliance, and 8-pad WFLGA 6×5-mm (Package Code M) footprint compatibility.

Technical Context

The W25Q256JVBJM implements a flexible SPI/QPI command architecture with volatile/non-volatile status register control, enabling dynamic switching between 3- and 4-byte address modes via B7h/E9h instructions and QPI entry/exit via 38h/FFh. Its dual-mode /HOLD or /RESET pin (configurable via Status Register) supports both pause-and-resume operation and hardware reset without external logic.

It integrates three 256-byte one-time-programmable (OTP) security registers, 64-bit unique ID, and programmable output driver strength (DRV1/DRV0), while supporting Erase/Program Suspend & Resume for real-time system responsiveness during background flash operations.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density256 M-bit (32 MB), organized as 131,072 × 256-byte pages
Operating Voltage2.7 V to 3.6 V - compatible with standard 3.3 V I/O domains and low-power MCU interfaces
Max Clock Frequency133 MHz SPI - enables 532 MB/s effective Quad I/O throughput using Fast Read Quad I/O (EBh/EDh)
Erase GranularityUniform 4 KB sectors (8,192 total), plus 32 KB and 64 KB blocks - supports fine-grained firmware partitioning
Data Retention20+ years - validated for long-life industrial and automotive control applications
Endurance100,000 program/erase cycles per sector - sufficient for frequent OTA update logging and parameter storage
Temperature Range-40°C to +105°C - qualified for industrial-plus grade operation without derating
Interface ModesStandard/Dual/Quad SPI, QPI, and DTR - all supported simultaneously with mode-selectable instruction sets

Pinout & Package

W25Q256JVBJM uses the 8-pad WFLGA 6×5-mm package (Package Code M), with exposed thermal pad on underside for enhanced thermal dissipation in compact PCB layouts.

Pin/Terminal Circuit Role Design Meaning
/CSChip Select InputActive-low enable signal; places DO/IO pins in high-impedance state when deasserted to reduce bus contention
DO (IO1)Data Output / Bidirectional I/OUnidirectional output in Standard SPI; bidirectional data lane 1 in Dual/Quad SPI and QPI modes
/WP (IO2)Write Protect Input / Bidirectional I/OHardware write lock for status register when QE=0; becomes IO2 in Quad mode (QE=1)
GNDGround ReferencePrimary return path for all digital and power circuits; must be low-impedance connection to system ground plane
DI (IO0)Data Input / Bidirectional I/OUnidirectional input in Standard SPI; bidirectional data lane 0 in Dual/Quad SPI and QPI modes
CLKSerial Clock InputEdge-triggered timing reference for all SPI/QPI transactions; supports up to 133 MHz with controlled slew rate
/HOLD or /RESET (IO3)Hold or Reset Input / Bidirectional I/OSelectable function: active-low pause (/HOLD) in Standard/Dual SPI; dedicated hardware reset (/RESET) in SOIC/TFBGA packages or when configured via SR
VCCPower SupplySingle 2.7–3.6 V supply; decoupling capacitor (≥1 µF ceramic) required within 5 mm of pin

Key Features

Feature Design Value
DTR Read SupportEnables double-data-rate sampling on CLK edges for higher effective bandwidth without increasing clock frequency - critical for latency-sensitive XIP execution
JEDEC SFDP RegisterProvides standardized, self-describing configuration parameters (e.g., erase sizes, timing, address modes) - eliminates hard-coded flash initialization in bootloader
4-Byte Address ModeConfigurable via B7h/E9h instructions; required for full 32 MB addressing beyond 16 MB limit of 3-byte mode - essential for large firmware images
Security RegistersThree 256-byte OTP-locked regions for secure key storage, calibration data, or device-specific credentials - protected against overwrite or readout by hardware locks
Erase/Program SuspendAllows interrupting long erase/program operations to service time-critical host requests, then resuming - improves real-time system responsiveness
Unique 64-Bit IDFactory-programmed per-device serial number accessible via 4Bh instruction - enables secure device authentication and traceability in production and field

Applications

Boot Code Storage Firmware Update Storage

Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M or RISC-V microcontrollers requiring fast, reliable nonvolatile code storage.

IC Role / Device Role / Timing Role: NOR flash memory providing XIP-capable instruction fetch via Quad SPI at ≤133 MHz clock, with deterministic 4 KB sector erase for incremental updates.

Use Value: Enables direct execution from flash without RAM copy, reducing BOM cost and boot latency while supporting secure firmware validation via unique ID and SFDP-defined layout.

Use Scenario: Holding staged firmware images during over-the-air (OTA) updates in industrial gateways and edge AI devices.

IC Role / Device Role / Timing Role: Dual-bank capable flash with suspend/resume and 4-byte addressing - allows background download into one region while executing from another.

Use Value: Guarantees atomic update rollback and zero-downtime field upgrades, leveraging 100K-cycle endurance and hardware write protection to prevent corruption during power loss.

Parameter & Configuration Storage Secure Device Identity

Use Scenario: Retaining calibrated sensor offsets, motor tuning coefficients, and user preferences across power cycles in medical and test equipment.

IC Role / Device Role / Timing Role: High-reliability data store with 4 KB sector granularity and software/hardware write protection - isolates critical parameters from application code regions.

Use Value: Ensures 20-year data retention and immunity to accidental overwrite, using BP bits and /WP pin to enforce immutable configuration zones.

Use Scenario: Providing cryptographically verifiable device identity in IoT nodes and smart meters requiring regulatory compliance and anti-counterfeiting.

IC Role / Device Role / Timing Role: Source of factory-programmed 64-bit unique ID and three OTP-locked security registers - used to seed device keys and bind firmware to hardware.

Use Value: Eliminates need for external secure elements by embedding immutable identity and credential storage directly in flash, validated via 4Bh and 42h/44h instructions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L25645GMI-08G256 M-bit, 3.3 V, supports DTR but lacks QPI mode; max SPI clock 104 MHz; no /RESET pin in 8-pin WSONLower bandwidth and no QPI simplifies controller driver stack but limits peak throughput vs. W25Q256JVBJMPrefer when QPI support or >104 MHz operation is unnecessary and legacy SPI-only firmware is deployed
S25FL256SAGMFV010256 M-bit, 3.0 V nominal, supports HyperBus interface (not SPI/QPI); includes built-in ECC and configurable latency modesRequires HyperFlash controller IP; not pin-compatible; targets high-reliability automotive infotainment rather than general-purpose MCU bootChoose only if migrating to Cypress/Infineon ecosystem with HyperBus-enabled SoC and need on-die ECC for ASIL-B compliance

Compared with MX25L25645GMI-08G and S25FL256SAGMFV010, the W25Q256JVBJM delivers broader interface flexibility (SPI/QPI/DTR), higher clock speed (133 MHz), and integrated security features (unique ID, OTP registers) in an industry-standard 8-pad WFLGA package - making it optimal for new designs requiring scalable, secure, and high-throughput serial flash.

Availability

W25Q256JVBJM is available at Aetrix Electronics and suitable for industrial control systems, automotive telematics modules, and medical diagnostic equipment requiring stable component supply, extended temperature operation, and long-term lifecycle assurance.

Supply support for W25Q256JVBJM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer markets.

The W25Q series is designed specifically for high-performance, space-constrained embedded systems requiring robust code storage, secure firmware updates, and seamless XIP execution - targeting industrial, automotive, and networking applications.

FAQ

What is the package type and footprint of W25Q256JVBJM?

W25Q256JVBJM uses the 8-pad WFLGA 6×5-mm package (Package Code M), with bottom-exposed thermal pad. Its pinout matches the standard 8-pin serial flash layout: /CS, DO (IO1), /WP (IO2), GND, DI (IO0), CLK, /HOLD or /RESET (IO3), and VCC. This footprint is compatible with automated optical inspection and reflow processes in high-volume manufacturing.

Does W25Q256JVBJM support 4-byte addressing, and how is it enabled?

Yes, W25Q256JVBJM supports 4-byte addressing to access its full 32 MB capacity. It is enabled by issuing the Enter 4-Byte Address Mode instruction (B7h). The ADP bit in Status Register-1 determines whether the device powers up in 3- or 4-byte mode. Once enabled, all subsequent read/write/erase commands use 32-bit addresses - critical for large firmware images exceeding 16 MB.

How does the /HOLD or /RESET pin function on W25Q256JVBJM?

On W25Q256JVBJM, pin 7 functions as either /HOLD (active-low pause) or /RESET (hardware reset), depending on the HOLD/RST bit in Status Register-1 and the package type. In the 8-pad WFLGA (M), it defaults to /HOLD in Standard/Dual SPI; /RESET is only available when explicitly configured and supported by the host. In SOIC/TFBGA packages, /RESET is a dedicated pin independent of configuration.

What security features are implemented in W25Q256JVBJM?

W25Q256JVBJM includes multiple hardware-enforced security features: a factory-programmed 64-bit unique ID (readable via 4Bh), three 256-byte OTP-locked security registers (programmable via 42h, readable via 48h), software/hardware write protection (BP bits, /WP pin), and status register lock bits (SRP/SRL). These enable secure key storage, device authentication, and tamper-resistant firmware partitioning.

Can W25Q256JVBJM be used for Execute-in-Place (XIP) applications?

Yes, W25Q256JVBJM supports true XIP operation via Continuous Read Mode with Fast Read Quad I/O (EBh/EDh) and DTR instructions. With 133 MHz clock and Quad I/O, it achieves up to 532 MB/s effective throughput and minimal instruction overhead (≤8 clocks per 24-bit address), enabling low-latency instruction fetch directly from flash - widely adopted in Cortex-M7/M33 and RISC-V SoCs.

W25Q256JVBJM Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (6x8)

W25Q256JVBJM FAQ

1.How can I place an order for W25Q256JVBJM through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q256JVBJM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q256JVBJM reliable?

The price and inventory of W25Q256JVBJM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256JVBJM is usually 5 days.

3.What payment methods are accepted for W25Q256JVBJM?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256JVBJM transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q256JVBJM?

W25Q256JVBJM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q256JVBJM order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q256JVBJM?

For technical support, including W25Q256JVBJM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256JVBJM requirements.

6.How does Aetrix verify that W25Q256JVBJM is sourced from the original manufacturer or authorized distributors?

All W25Q256JVBJM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256JVBJM meets industry standards.

7.What is the process for return or replacement of W25Q256JVBJM?

All W25Q256JVBJM units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256JVBJM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q256JVBJM part is unused and in its original packaging.

Return procedure for W25Q256JVBJM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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