Winbond Electronics Corporation W25Q256JVCIM TR
- Part No.:
- W25Q256JVCIM TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25Q256JVCIM TR.pdf
- Description:
- IC FLASH 256MBIT SPI 24TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,556
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Product details
Overview
W25Q256JVCIM TR from Winbond is a 256M-bit (32MB) serial NOR flash memory IC supporting standard, dual, and quad SPI interfaces with up to 133 MHz clock frequency, 4KB uniform sector architecture, and hardware write protection via /WP and /HOLD pins. It operates from 2.7V to 3.6V and is used for code execution in place (XIP), firmware storage, and parameter retention in embedded microcontroller systems.
For engineers reviewing the W25Q256JVCIM TR datasheet, W25Q256JVCIM TR pinout, W25Q256JVCIM TR application, or W25Q256JVCIM TR equivalent, key selection criteria include 4-byte addressing support, Quad Enable (QE) bit configuration, JEDEC ID and SFDP register compliance, and compatibility with 8-pad WSON 8×6-mm package layout constraints.
Technical Context
The W25Q256JVCIM TR implements a SPI-compatible serial interface with configurable 3- or 4-byte addressing modes, where 4-byte mode is enabled via B7h instruction and stored in non-volatile ADP bit. Its dual/quad I/O operation requires QE bit (Status Register-2, bit 1) to be set, repurposing /WP and /HOLD as IO2 and IO3.
It features volatile/non-volatile status register bits for block protection (BP3–BP0), top/bottom lock (TB), complement protection (CMP), and security register locks (LB3–LB1), alongside erase/program suspend/resume functionality and three 256-byte OTP-locked security registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 M-bit (32 MB), organized as 131,072 × 256-byte pages |
| Interface Support | Standard/Dual/Quad SPI with 3- or 4-byte addressing; QE bit required for Quad I/O |
| Max Clock Frequency | 133 MHz (standard), enabling 266 MB/s dual and 532 MB/s quad effective throughput |
| Erase Granularity | Uniform 4 KB sectors (8,192 total), 32 KB blocks (2,048), 64 KB blocks (1,024), and full chip erase |
| Endurance & Retention | 100,000 program/erase cycles per sector; >20 years data retention at +25°C |
| Supply Voltage | 2.7 V to 3.6 V; typical power-down current <1 µA |
| Operating Temp | –40°C to +85°C industrial grade temperature range |
Pinout & Package
W25Q256JVCIM TR uses the 8-pad WSON 8×6-mm package (Package Code E), with exposed thermal pad. Pin functions are defined per JEDEC MO-241AC standard and validated per Winbond datasheet Figure 1a.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable; high-impedance DO and standby current when high |
| DO (IO1) | Data Output / I/O1 | Unidirectional output in Standard SPI; bidirectional I/O1 in Dual/Quad SPI |
| /WP (IO2) | Write Protect Input / I/O2 | Hardware sector lock when low; becomes IO2 in Quad SPI when QE=1 |
| GND | Ground Reference | Primary return path for VCC and all I/O signals; connects to thermal pad |
| DI (IO0) | Data Input / I/O0 | Unidirectional input in Standard SPI; bidirectional I/O0 in Dual/Quad SPI |
| CLK | Serial Clock Input | Edge-triggered timing source; supports SPI Mode 0 and Mode 3 |
| /HOLD or /RESET (IO3) | Hold Input / I/O3 | Pauses ongoing SPI transfer when low; becomes IO3 in Quad SPI when QE=1 |
| VCC | Power Supply | 2.7–3.6 V supply; decoupling capacitor required within 10 mm of pin |
Key Features
| Feature | Design Value |
|---|---|
| Quad Enable (QE) Bit | Non-volatile Status Register-2 bit enables IO2/IO3 and unlocks full 532 MB/s quad throughput |
| 4-Byte Address Mode | Enabled via B7h instruction; ADP bit stores default mode in non-volatile memory for power-up consistency |
| SFDP Register Support | JEDEC-standard Serial Flash Discoverable Parameters enables automatic driver configuration in boot ROMs |
| Security Registers | Three 256-byte OTP-lockable registers for secure key or calibration storage with LB1–LB3 control |
| Erase/Program Suspend | 75h/7Ah instructions allow background operations to pause/resume without data loss or timeout failure |
Applications
| Industrial HMI Firmware Storage | Automotive Telematics Boot Code |
|---|---|
Use Scenario: Storing GUI assets, firmware images, and configuration profiles in panel-mounted HMIs with space-constrained PCB layouts. IC Role / Device Role / Timing Role: Non-volatile code and data storage with XIP-capable quad SPI interface for direct execution from flash. Use Value: 4KB sector granularity enables atomic firmware updates without erasing unrelated configuration data; 133 MHz clock supports <50 ms boot time. | Use Scenario: Hosting boot loader and OTA update partitions in automotive telematics modules requiring AEC-Q100 alignment and field reliability. IC Role / Device Role / Timing Role: Primary boot memory mapped via MCU's QSPI controller; leverages SFDP for auto-negotiated timing parameters. Use Value: 100K endurance and >20-year retention ensure integrity across 15-year vehicle lifecycles; hardware /WP pin prevents accidental corruption during CAN bus noise events. |
| Medical Device Calibration Data | Network Router Configuration Archive |
Use Scenario: Retaining factory-calibrated sensor offsets and user-adjusted thresholds in portable diagnostic equipment. IC Role / Device Role / Timing Role: Parameter storage with individual sector lock (36h/39h) and security register encryption for HIPAA-compliant data isolation. Use Value: OTP-locked security registers store cryptographic keys; BP bits prevent overwrite of calibration sectors during field firmware upgrades. | Use Scenario: Archiving multiple configuration snapshots and fail-safe recovery images in enterprise-grade routers with frequent remote reconfiguration. IC Role / Device Role / Timing Role: High-reliability configuration vault supporting simultaneous read/write via suspend/resume (75h/7Ah). Use Value: 64KB block erase completes in ≤100 ms, enabling sub-second config rollback; JEDEC ID (9Fh) allows automated BOM verification during manufacturing test. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L25645GMI-10G | 256 M-bit, 104 MHz max clock, no /RESET pin in 8-pin SOIC; lacks SFDP register and 4-byte address mode | Requires software-managed address extension; not suitable for XIP with 4GB+ address spaces | Select only if legacy SPI host lacks 4-byte instruction support and SFDP auto-configuration is unnecessary |
| S25FL256SAGMFI000 | 256 M-bit, 80 MHz clock, supports 4-byte mode and SFDP but uses different QE bit location and security register layout | Requires firmware porting for status register access and security lock sequences | Prefer when Cypress-compatible toolchains or existing S25FL driver stack is mandated |
Compared with MX25L25645GMI-10G and S25FL256SAGMFI000, the W25Q256JVCIM TR delivers higher bandwidth (133 MHz vs. ≤104 MHz), native 4-byte addressing without external logic, and JEDEC-compliant SFDP for plug-and-play initialization - critical for fast-boot and secure boot implementations.
Availability
W25Q256JVCIM TR is available at Aetrix Electronics and suitable for industrial HMI firmware storage, automotive telematics boot code, medical device calibration data, and network router configuration archive applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for W25Q256JVCIM TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions including NOR/NAND flash, SRAM, and mobile DRAM.
The W25Q series targets high-performance embedded systems requiring reliable, low-power, SPI-based code and data storage with advanced security and flexible addressing - especially where space, pin count, and power budgets are constrained.
FAQ
What is the package type and footprint of W25Q256JVCIM TR?
W25Q256JVCIM TR uses an 8-pad WSON 8×6-mm package (Package Code E) with exposed thermal pad, compliant with JEDEC MO-241AC. It has no /RESET pin - that function is multiplexed with /HOLD on pin 7 and disabled in Quad SPI mode when QE=1. The footprint requires 0.3 mm pitch, 0.4 mm pad width, and thermal pad solder stencil design per Winbond specification.
Does W25Q256JVCIM TR support 4-byte addressing, and how is it enabled?
Yes, W25Q256JVCIM TR supports 4-byte addressing via the B7h instruction to enter mode and E9h to exit. The ADP bit (Status Register-3, bit 0) stores the default power-up address mode non-volatily. When ADP=1, the device powers up in 4-byte mode; when ADP=0, it defaults to 3-byte mode and requires Extended Address Register (C8h/C5h) for >16MB access.
How does the Quad Enable (QE) bit affect pin functionality on W25Q256JVCIM TR?
The QE bit (Status Register-2, bit 1) must be set to 1 to enable Quad SPI operation on W25Q256JVCIM TR. When QE=1, /WP (pin 3) becomes IO2 and /HOLD (pin 7) becomes IO3. If QE=0, those pins retain their hardware protection functions. QE is non-volatile and persists across power cycles unless explicitly cleared.
What security features are implemented in W25Q256JVCIM TR?
W25Q256JVCIM TR includes hardware write protection (/WP pin), top/bottom/complement sector locking (TB, CMP, BP bits), individual sector lock/unlock (36h/39h), global lock (7Eh), three 256-byte OTP-locked security registers (LB1–LB3), and a 64-bit unique ID (4Bh). All protections are enforced at the silicon level and survive power loss.
Can W25Q256JVCIM TR be used for execute-in-place (XIP) applications?
Yes, W25Q256JVCIM TR supports true XIP via Fast Read Quad I/O (EBh) and Quad Peripheral Interface, delivering up to 532 MB/s effective throughput. Its uniform 4KB sectors, low latency random access, and SFDP register enable automatic timing configuration in boot ROMs - making it suitable for direct code execution in microcontrollers with QSPI controllers.
W25Q256JVCIM TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (6x8)
W25Q256JVCIM TR FAQ
1.How can I place an order for W25Q256JVCIM TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q256JVCIM TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q256JVCIM TR reliable?
The price and inventory of W25Q256JVCIM TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256JVCIM TR is usually 5 days.
3.What payment methods are accepted for W25Q256JVCIM TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256JVCIM TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q256JVCIM TR?
W25Q256JVCIM TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q256JVCIM TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q256JVCIM TR?
For technical support, including W25Q256JVCIM TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256JVCIM TR requirements.
6.How does Aetrix verify that W25Q256JVCIM TR is sourced from the original manufacturer or authorized distributors?
All W25Q256JVCIM TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256JVCIM TR meets industry standards.
7.What is the process for return or replacement of W25Q256JVCIM TR?
All W25Q256JVCIM TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256JVCIM TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q256JVCIM TR part is unused and in its original packaging.
Return procedure for W25Q256JVCIM TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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