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Winbond Electronics Corporation W25Q256JVCJM
- Part No.:
- W25Q256JVCJM
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25Q256JVCJM.pdf
- Description:
- IC FLASH 256MBIT SPI 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,463
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Product details
Overview
W25Q256JVCJM from Winbond is a 256M-bit (32MB) serial NOR flash memory IC supporting Dual/Quad SPI, QPI, and DTR read modes with 133MHz clock rate, 4KB uniform sector architecture, and industrial temperature range (–40°C to +85°C). It enables XIP execution, firmware storage, and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25Q256JVCJM datasheet, W25Q256JVCJM pinout, W25Q256JVCJM application, or W25Q256JVCJM equivalent, key selection criteria include 4-byte addressing support, Quad Enable (QE) bit configuration, /HOLD vs /RESET pin behavior in 8-pin packages, and JEDEC SFDP register compatibility for auto-configuration.
Technical Context
The W25Q256JVCJM implements a flexible SPI-compatible interface with configurable I/O modes: standard single I/O (DI/DO), dual I/O (IO0/IO1), quad I/O (IO0–IO3), and QPI with double-transfer-rate (DTR) capability. Its internal architecture includes 131,072 × 256-byte programmable pages, 8,192 erasable 4KB sectors, and three 256-byte one-time-programmable security registers.
It supports volatile and non-volatile status register bits including Quad Enable (QE), Top/Bottom protect (TB), Block Protect (BP3–BP0), and Output Driver Strength (DRV1/DRV0). The ADP bit determines power-up address mode (3- or 4-byte), and the HOLD/RST bit configures IO3 as /HOLD or /RESET in 8-pin packages when QE=0.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 M-bit (32 MB), organized as 131,072 × 256-byte pages |
| Interface Modes | Standard/Dual/Quad SPI, QPI, and DTR read - enables up to 532 MHz effective data rate in Quad I/O mode |
| Max Clock Frequency | 133 MHz - supports 66 MB/s continuous read throughput with Fast Read Quad I/O |
| Erase Granularity | Uniform 4KB sectors, 32KB blocks, 64KB blocks, and full-chip erase - allows fine-grained firmware partitioning |
| Endurance & Retention | 100,000 program/erase cycles per sector; >20 years data retention at 85°C |
| Operating Voltage | 2.7 V to 3.6 V - compatible with 3.3 V logic systems without level shifting |
| Temperature Range | –40°C to +85°C (Industrial Grade) - validated for extended thermal operation in embedded control |
| Security Features | 64-bit unique ID, JEDEC SFDP register, three 256-byte OTP security registers, and individual sector lock/unlock commands |
Pinout & Package
W25Q256JVCJM uses the 8-pad WFLGA 6×5-mm package (Package Code M), with exposed pad for thermal dissipation and no lead finish restrictions. Pin functions are shared across SPI modes: IO0–IO3 serve as bidirectional data lines in Quad mode, while /WP and /HOLD become IO2 and IO3 respectively when Quad Enable (QE) is set.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; high-impedance DO/IO outputs when deasserted; required high-to-low transition after power-up to accept instructions |
| 2 DO (IO1) | Data Output / Bidirectional I/O | Unidirectional output in Standard SPI; bidirectional in Dual/Quad SPI; used for status/data reads on falling CLK edge |
| 3 /WP (IO2) | Write Protect Input / Bidirectional I/O | Hardware write protection when low; repurposed as IO2 in Quad mode (QE=1); not available as /WP during Quad operation |
| 4 GND | Ground Reference | Primary signal and power return path; must be low-impedance connection to minimize noise coupling into SPI signals |
| 5 DI (IO0) | Data Input / Bidirectional I/O | Unidirectional input in Standard SPI; bidirectional in Dual/Quad SPI; carries instructions, addresses, and data on rising CLK edge |
| 6 CLK | Serial Clock Input | Master-generated timing reference; all I/O transitions synchronized to rising/falling edges per SPI mode definition |
| 7 /HOLD or /RESET (IO3) | Hold or Reset Input / Bidirectional I/O | Pauses ongoing SPI transaction when low (/HOLD); hardware reset trigger when asserted (/RESET); becomes IO3 in Quad mode (QE=1) |
| 8 VCC | Power Supply | 2.7–3.6 V supply; requires local 100 nF ceramic decoupling near pin; powers internal charge pump for erase/program operations |
Key Features
| Feature | Design Value |
|---|---|
| 4-Byte Address Mode Support | Enables access beyond 16 MB using B7h/E9h commands; ADP bit sets default power-up mode - critical for firmware images >16 MB |
| Erase/Program Suspend & Resume | Allows background interrupt handling during long erase/program cycles (e.g., 4KB sector erase ~200 ms); preserves state without data loss |
| Volatile & Non-Volatile Status Register Bits | BP3–BP0, TB, CMP, SRP, QE, DRV1/DRV0, HOLD/RST configurable per application need - enables runtime reconfiguration of protection and drive strength |
| JEDEC SFDP Register | Standardized 256-byte parameter table readable via 5Ah command - enables automatic driver initialization without hard-coded timing values |
| Individual Sector Lock/Unlock | 36h/39h commands allow per-sector write protection independent of BP bits - supports secure bootloader + field-upgradable application partitioning |
| DTR Read Capability | 0Dh/BDh/EDh instructions double data rate per clock edge - reduces instruction overhead and improves XIP cache line fill efficiency |
Applications
| Bootloader Storage | Firmware Over-the-Air (OTA) |
|---|---|
|
Use Scenario: Storing immutable bootloader code that initializes DRAM, configures peripherals, and validates application image integrity before execution. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP-capable Quad SPI interface; provides deterministic <100 ns access latency for first-instruction fetch. Use Value: Enables secure boot chain via hardware write-protection (BP bits + /WP pin) and verified signature checks using internal security registers. |
Use Scenario: Hosting compressed firmware updates downloaded wirelessly to edge devices, then decompressed and written to designated memory regions. IC Role / Device Role / Timing Role: High-throughput data buffer with 66 MB/s read speed and 4KB sector granularity for atomic update rollback. Use Value: Supports concurrent read (active firmware) and program (update image) via Erase/Program Suspend, minimizing device downtime. |
| Configuration & Calibration Data | Industrial HMI Display Assets |
|
Use Scenario: Retaining factory-calibrated sensor offsets, user preferences, and network credentials across power cycles in PLCs and motor drives. IC Role / Device Role / Timing Role: Parameter storage with byte-level write capability and 100K-cycle endurance - survives frequent field recalibration. Use Value: Leverages uniform 4KB sectors to isolate volatile calibration data from static firmware, preventing corruption during partial updates. |
Use Scenario: Caching bitmap fonts, UI icons, and animation sequences for touch-based HMIs in manufacturing equipment. IC Role / Device Role / Timing Role: High-bandwidth asset repository accessed via Continuous Read Mode with wrap-around burst - reduces GUI frame load latency. Use Value: Delivers 532 MHz effective Quad I/O bandwidth to feed display controller FIFOs without CPU intervention or external RAM buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L25645GMI-10G | 256 M-bit, 104 MHz max clock, no DTR support, SOIC-16 only, lacks SFDP register and 4-byte address auto-detection | Requires fixed 3-byte addressing; no hardware reset pin in 8-pin variants; lower read throughput limits XIP performance | Select when DTR and SFDP are unnecessary and legacy SOIC-16 footprint is mandated. |
| S25FL256SAGMFI000 | 256 M-bit, 80 MHz max clock, HyperBus interface option, integrated ECC, 10-year data retention (vs 20+ years) | Supports error-correcting code for mission-critical logging; HyperBus offers higher bandwidth but requires different controller IP | Select when system-level ECC is required or HyperBus controller is already integrated; avoid if SPI-only interface is mandatory. |
Compared with MX25L25645GMI-10G and S25FL256SAGMFI000, the W25Q256JVCJM delivers superior DTR-enabled throughput, longer data retention, and standardized SFDP auto-configuration - making it optimal for modern XIP-capable microcontrollers requiring flexible, future-proof flash integration.
Availability
W25Q256JVCJM is available at Aetrix Electronics and suitable for industrial control systems, automotive infotainment head units, and IoT edge gateways requiring stable component supply, long-lifecycle support, and guaranteed traceability.
Supply support for W25Q256JVCJM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial NOR/NAND flash, RAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.
The W25Q256JVCJM belongs to Winbond's W25Q256JV-DTR family, designed specifically for high-reliability embedded applications demanding fast XIP execution, robust security features, and extended temperature operation without sacrificing pin count or board area.
FAQ
What is the package type and footprint compatibility of the W25Q256JVCJM?
The W25Q256JVCJM uses an 8-pad WFLGA 6×5-mm package (Package Code M) with bottom-exposed thermal pad. It shares pinout and footprint compatibility with other W25Q256JV-DTR variants in WFLGA and WSON packages, enabling drop-in substitution where thermal and mechanical constraints permit. No PCB redesign is needed when migrating between same-code-package variants.
Does the W25Q256JVCJM support 4-byte addressing, and how is it enabled?
Yes, the W25Q256JVCJM supports both 3-byte and 4-byte addressing modes. The ADP bit in Status Register-1 determines the default power-up mode. To switch dynamically, issue the Enter 4-Byte Address Mode command (B7h) or Exit 4-Byte Address Mode command (E9h). All read, program, and erase instructions have 4-byte-address variants (e.g., 13h, 12h, 21h).
How does the /HOLD and /RESET functionality work on the W25Q256JVCJM's IO3 pin?
On the W25Q256JVCJM (8-pin WFLGA), IO3 serves as /HOLD by default. When the HOLD/RST bit in Status Register-1 is set to '1', IO3 becomes /RESET instead. This configuration is volatile and resets on power cycle. In Quad SPI mode (QE=1), IO3 is always used as data line IO3 and neither /HOLD nor /RESET is available.
What security mechanisms does the W25Q256JVCJM provide for firmware protection?
The W25Q256JVCJM provides layered security: hardware write protection via /WP pin and BP/TB bits; OTP-locked security registers for keys; 64-bit unique ID per device; and individual sector lock/unlock commands (36h/39h). These features collectively prevent unauthorized firmware modification, cloning, or reverse engineering in deployed systems.
Can the W25Q256JVCJM be used for Execute-in-Place (XIP) applications, and what interface mode is recommended?
Yes, the W25Q256JVCJM is optimized for XIP operation. Quad SPI with Continuous Read Mode and DTR (e.g., EDh command) is recommended - delivering up to 532 MHz effective bandwidth and minimal instruction overhead. This enables direct CPU instruction fetch from flash with latency comparable to SRAM, eliminating need for external RAM caching.
W25Q256JVCJM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (6x8)
W25Q256JVCJM FAQ
1.How can I place an order for W25Q256JVCJM through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q256JVCJM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q256JVCJM reliable?
The price and inventory of W25Q256JVCJM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256JVCJM is usually 5 days.
3.What payment methods are accepted for W25Q256JVCJM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256JVCJM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q256JVCJM?
W25Q256JVCJM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q256JVCJM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q256JVCJM?
For technical support, including W25Q256JVCJM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256JVCJM requirements.
6.How does Aetrix verify that W25Q256JVCJM is sourced from the original manufacturer or authorized distributors?
All W25Q256JVCJM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256JVCJM meets industry standards.
7.What is the process for return or replacement of W25Q256JVCJM?
All W25Q256JVCJM units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256JVCJM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q256JVCJM part is unused and in its original packaging.
Return procedure for W25Q256JVCJM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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