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Winbond Electronics Corporation W25Q256JVFJM TR

Part No.:
W25Q256JVFJM TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25Q256JVFJM TR.pdf
Description:
IC FLASH 256MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,033

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Product details

Overview

W25Q256JVFJM TR from Winbond is a 256M-bit (32MB) serial NOR flash memory IC supporting Dual/Quad SPI, QPI, and DTR read modes with 133MHz clock, 4KB uniform sectors, and industrial-grade -40°C to +105°C operation. It enables XIP execution, firmware storage, and secure parameter retention in space-constrained embedded systems.

For engineers reviewing the W25Q256JVFJM TR datasheet, W25Q256JVFJM TR pinout, W25Q256JVFJM TR application, or W25Q256JVFJM TR equivalent, key selection criteria include 4-byte addressing support, Quad Enable (QE) bit configuration, /HOLD vs /RESET pin mapping in 8-pin packages, and DTR timing compliance for high-speed boot code fetch.

Technical Context

The W25Q256JVFJM TR implements a flexible SPI-compatible interface with configurable I/O modes: standard single I/O (DI/DO), dual I/O (IO0/IO1), quad I/O (IO0–IO3), and QPI with double-transfer-rate (DTR) capability. Its architecture supports both 3-byte and 4-byte addressing via ADP bit and B7h/E9h instructions.

It integrates volatile/non-volatile status registers (SR1–SR3) controlling block protection (BP0–BP3), top/bottom lock (TB), quad enable (QE), driver strength (DRV0/DRV1), and HOLD/RESET function selection. Erase suspend/resume, security registers (3×256B OTP-locked), and 64-bit unique ID are hardware-supported features.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 M-bit (32 MB), organized as 131,072 × 256-byte pages
Operating Voltage2.7 V to 3.6 V - compatible with 3.3 V logic systems without level shifting
Max Clock Frequency133 MHz SPI - enables 532 MB/s effective quad-I/O throughput using Fast Read Quad I/O (6Bh/6Ch)
Erase Granularity4 KB sector / 32 KB block / 64 KB block - supports fine-grained firmware partitioning and data logging
Data Retention20 years at +85°C - validated for long-life industrial deployments
Endurance100,000 program/erase cycles per sector - sufficient for frequent OTA update partitions
Temperature Range-40°C to +105°C - qualified for extended industrial and automotive under-hood applications
Interface ModesStandard/Dual/Quad SPI, QPI, DTR - selectable via instruction set and QE bit; no external mode pins required

Pinout & Package

W25Q256JVFJM TR uses the 8-pad WSON 8x6-mm package (Package Code E), with exposed thermal pad. Pin functions are shared across SPI modes: IO0–IO3 serve as bidirectional data lines in quad mode, while /WP and /HOLD become IO2 and IO3 when Quad Enable (QE) is set.

Pin/TerminalCircuit RoleDesign Meaning
/CSChip Select InputActive-low enable; must transition high→low before each instruction; controls power state and DO high-impedance
DO (IO1)Data Output / I/O1Unidirectional output in standard SPI; bidirectional in dual/quad modes; used for status/data reads
/WP (IO2)Write Protect Input / I/O2Hardware write lock for status register; repurposed as IO2 when QE=1; not available in quad mode
GNDGround ReferenceSignal and power return path; requires low-inductance connection for stable DTR timing
DI (IO0)Data Input / I/O0Unidirectional input in standard SPI; bidirectional in dual/quad modes; carries instructions and addresses
CLKSerial Clock InputRising-edge sampled input; timing-critical for DTR mode; requires controlled impedance routing
/HOLD or /RESET (IO3)Hold or Reset Input / I/O3Selectable function via SR2 bit; active-low hold pauses ongoing transfers; dedicated /RESET only in SOIC/TFBGA
VCCPower Supply2.7–3.6 V supply; decoupling capacitor required near pin for fast transient response during burst reads

Key Features

FeatureDesign Value
DTR Read SupportEnables double-data-rate sampling on CLK edges - reduces instruction overhead and improves XIP latency by ~30% vs standard Fast Read
4-Byte Address ModeConfigurable via ADP bit and B7h/E9h commands - essential for >16MB address space access without bank switching
Erase/Program SuspendAllows background erase or program to be paused for urgent reads - critical for real-time firmware update handlers
Security RegistersThree 256-byte OTP-locked regions - store cryptographic keys or calibration data immune to field reprogramming
Unique 64-bit IDFactory-programmed per-device serial number - enables secure device authentication and anti-cloning in IoT edge nodes
SFDP RegisterJEDEC-standard discoverable parameter table - allows host bootloader to auto-detect timing, density, and feature set without hard-coded assumptions

Applications

Boot Code StorageFirmware Update Partition

Use Scenario: Storing primary bootloader and initial application image executed directly from flash (XIP) on ARM Cortex-M or RISC-V SoCs.

IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic 133MHz Quad I/O read timing and DTR support for sub-100ns instruction fetch latency.

Use Value: Eliminates external RAM copy step; reduces BOM cost and boot time by enabling direct execution from 4KB-aligned sectors.

Use Scenario: Dedicated 2–4MB partition holding signed firmware images for over-the-air (OTA) updates in industrial gateways.

IC Role / Device Role / Timing Role: Secure, wear-leveled storage with erase suspend capability - allows concurrent OTA download and system operation.

Use Value: Supports atomic update rollback via dual-bank sector layout; 100K endurance ensures >5 years of daily updates.

Configuration & Calibration DataSecure Key Storage

Use Scenario: Retaining factory-trimmed sensor calibration coefficients, network credentials, and device-specific parameters across power cycles.

IC Role / Device Role / Timing Role: Parameter storage with hardware write protection (BP bits + /WP pin) and 20-year data retention at +105°C.

Use Value: Prevents accidental overwrite during field service; eliminates need for battery-backed SRAM in harsh environments.

Use Scenario: Storing AES-256 keys, TLS certificates, and secure boot hashes in tamper-resistant non-volatile memory for IoT edge devices.

IC Role / Device Role / Timing Role: Cryptographic key vault using OTP-locked security registers and unique 64-bit ID for device binding.

Use Value: Blocks unauthorized firmware flashing; enables hardware-rooted trust chain without external secure element.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX25L25645GMI-08G256Mb, 3V, 104MHz max clock, no DTR support, 1.8V I/O compatibleLacks DTR and QPI modes; lower max frequency limits XIP performance in high-clock SoCsChoose when legacy SPI-only interface suffices and 1.8V I/O compatibility is required.
S25FL256SAGMFIR00256Mb, 3V, 133MHz, supports DTR but requires separate /RESET pin; no /HOLD function in 8-pinRequires SOIC or TFBGA for dedicated /RESET; lacks /HOLD in WSON packagePrefer when hardware reset independence is mandatory and board layout accommodates larger package.

Compared with MX25L25645GMI-08G and S25FL256SAGMFIR00, the W25Q256JVFJM TR delivers superior XIP efficiency via DTR and unified /HOLD-/RESET pin flexibility in WSON, making it optimal for compact, high-performance boot storage where pin count and timing margin are critical.

Availability

W25Q256JVFJM TR is available at Aetrix Electronics and suitable for industrial control panels, automotive telematics modules, and medical diagnostic equipment requiring stable component supply, extended temperature operation, and secure firmware storage.

Supply support for W25Q256JVFJM TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and mobile DRAM.

The W25Q series targets high-reliability embedded systems needing fast, secure, and flexible code and data storage - optimized for XIP, OTA updates, and industrial temperature resilience.

FAQ

What is the package type and pin count of the W25Q256JVFJM TR?

The W25Q256JVFJM TR uses an 8-pin WSON 8x6-mm package (Package Code E) with exposed thermal pad. It has eight functional terminals: /CS, DO (IO1), /WP (IO2), GND, DI (IO0), CLK, /HOLD or /RESET (IO3), and VCC. No NC pins are present in this variant.

Does the W25Q256JVFJM TR support 4-byte addressing, and how is it enabled?

Yes, the W25Q256JVFJM TR supports 4-byte addressing via the ADP bit in Status Register-1 and the Enter 4-Byte Address Mode (B7h) instruction. The ADP bit is non-volatile and defaults to 0 (3-byte mode); B7h must be issued after power-up to activate 4-byte mode until Exit 4-Byte Address Mode (E9h) is sent or power is cycled.

How does the /HOLD pin function differ between standard SPI and Quad SPI modes on the W25Q256JVFJM TR?

In standard or dual SPI mode (QE = 0), the /HOLD pin (IO3) provides active-low transfer pause functionality. When QE = 1 for quad SPI, IO3 becomes a data I/O line and /HOLD is disabled; the pin cannot be used for hold in quad mode. This behavior is documented in Section 4.4 and Figure 1a of the datasheet.

What is the role of the Quad Enable (QE) bit in the W25Q256JVFJM TR, and where is it located?

The Quad Enable (QE) bit is bit 1 of Status Register-2 (SR2). When QE = 1, the /WP and /HOLD pins become IO2 and IO3 respectively, enabling full quad I/O operation. QE is volatile by default but can be made non-volatile via SRP1/SRP0 bits; its state determines whether quad instructions like 6Bh or EBh are accepted.

Can the W25Q256JVFJM TR be used for execute-in-place (XIP) applications, and what features enable this?

Yes, the W25Q256JVFJM TR is explicitly designed for XIP. Key enablers include 133MHz Quad I/O with DTR support (reducing instruction overhead), continuous read mode, 4KB uniform sectors for aligned code placement, and fast read instructions (e.g., EDh DTR Quad I/O) achieving up to 66MB/s sustained throughput - all verified in Winbond's Application Note AN201.

W25Q256JVFJM TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25Q256JVFJM TR FAQ

1.How can I place an order for W25Q256JVFJM TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q256JVFJM TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q256JVFJM TR reliable?

The price and inventory of W25Q256JVFJM TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256JVFJM TR is usually 5 days.

3.What payment methods are accepted for W25Q256JVFJM TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256JVFJM TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q256JVFJM TR?

W25Q256JVFJM TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q256JVFJM TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q256JVFJM TR?

For technical support, including W25Q256JVFJM TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256JVFJM TR requirements.

6.How does Aetrix verify that W25Q256JVFJM TR is sourced from the original manufacturer or authorized distributors?

All W25Q256JVFJM TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256JVFJM TR meets industry standards.

7.What is the process for return or replacement of W25Q256JVFJM TR?

All W25Q256JVFJM TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256JVFJM TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q256JVFJM TR part is unused and in its original packaging.

Return procedure for W25Q256JVFJM TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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