Winbond Electronics Corporation W25Q256JWBIM
- Part No.:
- W25Q256JWBIM
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25Q256JWBIM.pdf
- Description:
- IC FLASH 256MBIT SPI 24TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W25Q256JWBIM from Winbond is a 1.8V, 256M-bit serial flash memory supporting Dual/Quad SPI, QPI, and DTR read modes with up to 133MHz Quad I/O clock frequency, 4KB uniform sector erase granularity, and integrated hardware write protection via /WP and /HOLD pins - deployed in embedded boot code storage, firmware update partitions, and secure parameter retention.
For engineers reviewing the W25Q256JWBIM datasheet, W25Q256JWBIM pinout, W25Q256JWBIM application, or W25Q256JWBIM equivalent, key selection considerations include 1.7–1.95V supply compatibility, 8-pin WSON 6×5-mm (Package Code P) footprint, 4-byte address mode support, JEDEC ID and SFDP register compliance, and quad I/O timing validation for XIP-capable microcontrollers.
Technical Context
The W25Q256JWBIM implements a flexible SPI-compatible interface with configurable operation modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), Quad SPI (IO0–IO3), and QPI with Double Transfer Rate (DTR) reads. Its architecture supports both 3- and 4-byte addressing, with ADS bit controlling current address mode and ADP bit setting power-up default.
Internal logic includes volatile/non-volatile status registers (SR1–SR3) managing block protection (BP3–BP0), quad enable (QE), output driver strength (DRV1/DRV0), and /HOLD or /RESET function selection. Erase/program suspend/resume capability enables concurrent background operations without interrupting host communication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 M-bit (32 MB), organized as 131,072 × 256-byte pages |
| Supply Voltage | 1.7 V to 1.95 V - ensures compatibility with low-voltage SoCs and battery-powered systems |
| Max Clock Frequency | 133 MHz Quad I/O - enables 532 MB/s effective throughput using Quad I/O Fast Read instructions |
| Erase Granularity | 4 KB sectors (8,192 total), 32 KB blocks (2,048), 64 KB blocks (512) - supports fine-grained firmware partitioning |
| Data Retention | 20+ years - validated under industrial temperature conditions (-40°C to +85°C) |
| Endurance | 100,000 program/erase cycles per sector - suitable for field-updatable configuration storage |
| Interface Modes | Standard/Dual/Quad SPI, QPI, and DTR - selectable via instruction set and QE bit; no external mode pins required |
| Security Features | 64-bit unique ID, three 256-byte OTP-locked security registers, SFDP register, and individual sector lock/unlock commands |
Pinout & Package
W25Q256JWBIM uses the 8-pad WSON 6×5-mm package (Package Code P), with exposed thermal pad on bottom. Pin 1 is /CS, pin 2 is DO (IO1), pin 3 is /WP (IO2), pin 4 is GND, pin 5 is DI (IO0), pin 6 is CLK, pin 7 is /HOLD or /RESET (IO3), and pin 8 is VCC. /WP and /HOLD are functional only in Standard/Dual SPI modes; in Quad SPI, they become IO2 and IO3 respectively.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS (Pin 1) | Chip Select input | Active-low enable: high = device deselected, DO in high-Z; must transition high→low after power-up before first instruction |
| DO (IO1) (Pin 2) | Bidirectional data I/O | Output in Standard SPI; bidirectional in Dual/Quad SPI; requires QE=1 for Quad mode use as IO1 |
| /WP (IO2) (Pin 3) | Hardware write protect | Active-low lock for status register writes; disabled in Quad SPI when repurposed as IO2 |
| GND (Pin 4) | Ground reference | Primary return path for VCC and all I/O signals; must be low-impedance connection |
| DI (IO0) (Pin 5) | Bidirectional data I/O | Input in Standard SPI; bidirectional in Dual/Quad SPI; always active as primary data input path |
| CLK (Pin 6) | Serial clock input | Edge-triggered master clock; rising edge for input sampling, falling edge for output sampling across all modes |
| /HOLD or /RESET (IO3) (Pin 7) | Hold or reset control | Pauses ongoing SPI transaction when low (/HOLD); dedicated hardware reset when asserted (SOIC/TFBGA/WLCSP variants) |
| VCC (Pin 8) | Power supply | 1.7–1.95 V core supply; decoupling capacitor (≥1 µF) required within 10 mm of pin |
Key Features
| Feature | Design Value |
|---|---|
| DTR Read Support | Enables double-data-rate sampling on CLK edges for higher effective bandwidth in SPI-based DTR instructions (e.g., 0Dh, BDh, EDh) |
| Erase/Program Suspend | Allows host to pause erase or program operations mid-execution and resume later - critical for real-time systems requiring deterministic latency |
| Flexible Protection Scheme | Combines hardware pins (/WP, /HOLD), volatile/non-volatile status bits (BPx, TB, CMP), and OTP-locked security registers for layered firmware integrity |
| 4-Byte Address Mode | Configurable via B7h/E9h instructions or ADP bit; eliminates address wraparound beyond 16 MB and enables full 32 MB addressing |
| JEDEC & SFDP Compliance | Supports standardized device identification (9Fh), manufacturer ID (90h), and Serial Flash Discoverable Parameters - simplifies auto-configuration in bootloader environments |
| Low-Power Operation | 1 µA typical standby current and fast wake-up (<5 µs) - extends battery life in portable and IoT edge devices |
Applications
| Boot Code Storage | Firmware Update Partition |
|---|---|
Use Scenario: Storing primary bootloader and initial firmware image for ARM Cortex-M or RISC-V microcontrollers during cold start. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable Quad SPI interface enabling direct execution from flash without RAM copy. Use Value: Reduces system BOM by eliminating parallel NOR flash; supports secure boot via 64-bit unique ID and OTP-locked security registers. | Use Scenario: Isolating field-upgradable firmware sections in medical or industrial controllers where runtime updates must not disrupt active control loops. IC Role / Device Role / Timing Role: Dedicated update partition with 4KB sector granularity allowing atomic patch writes and rollback-safe version management. Use Value: Enables safe over-the-air (OTA) updates using erase/program suspend/resume to maintain real-time responsiveness during flash reprogramming. |
| Secure Parameter Retention | Configuration & Calibration Data |
Use Scenario: Storing cryptographic keys, calibration coefficients, and device-specific credentials in automotive ECUs or payment terminals. IC Role / Device Role / Timing Role: Tamper-resistant non-volatile storage leveraging three 256-byte OTP-locked security registers and hardware write protection. Use Value: Prevents unauthorized read/write access through combined SRP/SRL bits, CMP protection, and dedicated /WP pin control. | Use Scenario: Holding factory-trimmed sensor offsets, display gamma tables, and user preferences in smart home hubs and industrial HMIs. IC Role / Device Role / Timing Role: High-endurance parameter store with 100K-cycle endurance and 20-year data retention at +85°C. Use Value: Eliminates need for external EEPROM; supports frequent small writes via page-program (1–256 bytes) without sector-level erasure overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L25645GMI-10G | 3V supply (2.7–3.6V), no DTR support, 104MHz max Quad SPI clock, same 256M-bit density and 4KB sectors | Requires separate 3V rail; lacks DTR timing margin for high-speed XIP; compatible with legacy SPI controllers lacking DTR capability | Select when system uses 3V I/O and does not require >104MHz Quad SPI throughput or DTR read optimization. |
| S25FL256SAGMFV001 | 1.8V supply, supports HyperBus interface (not SPI/QPI), 133MHz DDR clock, different command set and pinout (24-ball BGA only) | Designed for HyperFlash-compatible controllers (e.g., Cypress/Infineon Traveo); incompatible with standard SPI hosts without protocol translation | Select only for designs already committed to HyperBus architecture and requiring DDR-style burst reads; not drop-in SPI replacement. |
Compared with MX25L25645GMI-10G and S25FL256SAGMFV001, the W25Q256JWBIM uniquely delivers 1.8V operation with DTR-enabled read acceleration, full SPI/QPI mode flexibility, and 8-pin WSON packaging - making it optimal for space-constrained, low-power, and XIP-capable embedded systems requiring firmware agility and security.
Availability
W25Q256JWBIM is available at Aetrix Electronics and suitable for boot code storage, firmware update partitions, and secure parameter retention requiring stable component supply across industrial, automotive, and IoT product lifecycles.
Supply support for W25Q256JWBIM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for consumer, industrial, and communications markets.
The W25Q series targets high-performance, low-voltage embedded systems requiring robust code storage, secure firmware updates, and flexible interface compatibility - with W25Q256JWBIM optimized for compact 1.8V designs needing DTR-enhanced throughput and industrial-grade reliability.
FAQ
What is the operating voltage range for W25Q256JWBIM?
The W25Q256JWBIM operates from 1.7 V to 1.95 V. This narrow 1.8V nominal range ensures compatibility with modern ultra-low-power microcontrollers and SoCs while maintaining signal integrity and reducing dynamic power consumption. Operation outside this range may cause undefined behavior or permanent damage. The W25Q256JWBIM does not support 3.3V or dual-voltage operation.
Does W25Q256JWBIM support Quad SPI mode out of the box?
No - W25Q256JWBIM requires the Quad Enable (QE) bit in Status Register-2 to be set (via Write Status Register-2 instruction 31h) before Quad SPI functionality activates. Until QE=1, pins /WP and /HOLD remain dedicated hardware controls; after QE=1, they become IO2 and IO3. The W25Q256JWBIM defaults to Standard SPI mode at power-up.
What package type is used by W25Q256JWBIM?
W25Q256JWBIM uses the 8-pad WSON 6×5-mm package (Package Code P), with exposed thermal pad on the underside. It has no /RESET pin - the /HOLD pin serves dual function as /HOLD or /RESET depending on configuration, but in this variant (IM suffix), /HOLD is the default role unless explicitly remapped via HOLD/RST bit in Status Register-3.
Can W25Q256JWBIM be used for Execute-in-Place (XIP) applications?
Yes - W25Q256JWBIM supports XIP via Dual/Quad SPI Fast Read instructions (e.g., 3Bh, 6Bh, BBh, EBh) and DTR variants (BDh, EDh), delivering up to 532 MB/s effective throughput. Its 4KB uniform sector architecture, erase/program suspend/resume, and low-latency read enable deterministic code execution directly from flash in Cortex-M7/M33 and RISC-V cores with SPI memory-mapped peripherals.
How is hardware write protection implemented on W25Q256JWBIM?
W25Q256JWBIM implements hardware write protection using the /WP pin (active-low) in conjunction with Status Register bits SRP, SRL, BP3–BP0, TB, and CMP. When /WP is low and SRP=1, writes to status registers are blocked. Sector-level protection can be configured independently via BP bits and TB/CMP settings. The W25Q256JWBIM's /WP pin is disabled in Quad SPI mode (reassigned to IO2) and only functions in Standard/Dual SPI configurations.
W25Q256JWBIM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI, DTR
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 5ms
- Access Time:
- 6 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (6x8)
W25Q256JWBIM FAQ
1.How can I place an order for W25Q256JWBIM through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q256JWBIM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q256JWBIM reliable?
The price and inventory of W25Q256JWBIM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256JWBIM is usually 5 days.
3.What payment methods are accepted for W25Q256JWBIM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256JWBIM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q256JWBIM?
W25Q256JWBIM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q256JWBIM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q256JWBIM?
For technical support, including W25Q256JWBIM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256JWBIM requirements.
6.How does Aetrix verify that W25Q256JWBIM is sourced from the original manufacturer or authorized distributors?
All W25Q256JWBIM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256JWBIM meets industry standards.
7.What is the process for return or replacement of W25Q256JWBIM?
All W25Q256JWBIM units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256JWBIM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q256JWBIM part is unused and in its original packaging.
Return procedure for W25Q256JWBIM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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