Winbond Electronics Corporation W25Q256JWBIM TR
- Part No.:
- W25Q256JWBIM TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25Q256JWBIM TR.pdf
- Description:
- IC FLASH 256MBIT SPI 24TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,310
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W25Q256JWBIM TR from Winbond is a 1.8V, 256M-bit serial NOR flash memory supporting Dual/Quad SPI, QPI, and Double Transfer Rate (DTR) read modes. It delivers up to 133 MHz Quad I/O clock speed (532 MB/s equivalent bandwidth), features uniform 4KB sectors (8,192 total), supports 4-byte addressing, and includes hardware /WP and /HOLD pins plus dedicated /RESET in SOIC/TFBGA packages - deployed in boot code storage for industrial microcontrollers.
For engineers reviewing the W25Q256JWBIM TR datasheet, W25Q256JWBIM TR pinout, W25Q256JWBIM TR application, or W25Q256JWBIM TR equivalent, key selection criteria include DTR-enabled high-speed XIP capability, JEDEC-compliant SFDP register support, 1.7–1.95 V supply tolerance, -40°C to +85°C operation, and configurable write protection via Status Register BP bits and hardware pins.
Technical Context
The W25Q256JWBIM TR implements a flexible SPI-compatible interface with mode-selectable operation: Standard SPI (DI/DO), Dual SPI (IO0/IO1), Quad SPI (IO0–IO3), and QPI with DTR timing. Its internal architecture supports simultaneous instruction/data transfer using quad I/O lines when the non-volatile Quad Enable (QE) bit in Status Register-2 is set.
It integrates volatile and non-volatile status/configuration registers including Block Protect (BP3–BP0), Top/Bottom protect (TB), Complement Protect (CMP), Security Register Locks (LB3–LB1), and Output Driver Strength (DRV1/DRV0). The device enables 4-byte address mode via Enter 4-Byte Address Mode (B7h) instruction and supports Erase/Program Suspend & Resume for real-time system responsiveness.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 M-bit (32 M-byte), organized as 131,072 × 256-byte pages |
| Supply Voltage | 1.7 V to 1.95 V - enables low-power operation in battery-backed or energy-constrained systems |
| Max Clock Frequency | 133 MHz Quad I/O SPI - achieves 532 MB/s effective throughput for fast code execution |
| Erase Granularity | Uniform 4 KB sectors (8,192), 32 KB blocks (4,096), 64 KB blocks (2,048), and full-chip erase |
| Data Retention | >20 years at +85°C - ensures long-term reliability in industrial deployments |
| Endurance | 100,000 program/erase cycles per sector - supports frequent firmware updates in fielded devices |
| Operating Temp | -40°C to +85°C - qualified for extended industrial temperature range applications |
| Power-down Current | <1 µA (typ.) - minimizes standby power in always-on embedded systems |
Pinout & Package
W25Q256JWBIM TR uses an 8-pad WSON 6×5-mm package (Package Code P), with exposed thermal pad. Pin functions are fully compatible with standard SPI, Dual SPI, and Quad SPI protocols, and support hardware reset only in SOIC/TFBGA variants - not in this WSON variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable signal; places DO/IO pins in high-impedance state when deasserted |
| DO (IO1) | Data Output / Quad I/O Line 1 | Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad modes |
| /WP (IO2) | Write Protect Input / Quad I/O Line 2 | Hardware lock for Status Register writes; repurposed as IO2 when QE=1 |
| GND | Ground Reference | Primary return path for all digital and analog circuitry; requires low-impedance PCB connection |
| DI (IO0) | Data Input / Quad I/O Line 0 | Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad modes |
| CLK | Serial Clock Input | Synchronizes all data transfers; rising edge samples inputs, falling edge outputs data |
| /HOLD (IO3) | Hold Input / Quad I/O Line 3 | Pauses ongoing SPI transaction without deselecting device; repurposed as IO3 when QE=1 |
| VCC | Power Supply | 1.7–1.95 V core supply; must be stable during all operations including power-up/power-down sequences |
Key Features
| Feature | Design Value |
|---|---|
| DTR Read Support | Enables double-data-rate sampling on CLK edges for higher effective bandwidth in Fast Read DTR instructions (0Dh, BDh, EDh) |
| 4-Byte Address Mode | Supports >16 MB addressing space via B7h/E9h instructions - essential for large firmware images and secure boot partitions |
| Security Registers | Three 256-byte OTP-locked security registers for storing cryptographic keys or calibration data with hardware-enforced write protection |
| Unique ID | 64-bit factory-programmed serial number per device - enables secure device authentication and traceability in production |
| SFDP Register | JDEC-standard Serial Flash Discoverable Parameters table - allows automatic driver configuration without hard-coded timing values |
| Erase/Program Suspend | 75h/7Ah instructions let host pause background erase/program to service time-critical interrupts - critical for real-time OS environments |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Code |
|---|---|
|
Use Scenario: Storing firmware and configuration data for programmable logic controllers operating in harsh factory environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Primary boot memory providing XIP-capable code execution via Quad SPI with DTR timing to reduce MCU boot latency. Use Value: 4KB uniform sectors allow granular firmware patching; 100K endurance and 20-year retention ensure field longevity without replacement. |
Use Scenario: Hosting certified bootloader and safety-critical application code in Class II medical equipment requiring traceable, tamper-resistant storage. IC Role / Device Role / Timing Role: Secure non-volatile memory with OTP-locked security registers and unique 64-bit ID for device identity binding and firmware signature validation. Use Value: Hardware /WP and /HOLD pins provide deterministic control during power transitions; SFDP enables auto-negotiated driver initialization across product variants. |
| Automotive ADAS Camera Module | Smart Energy Meter Firmware |
|
Use Scenario: Storing image processing firmware and calibration tables in automotive surround-view camera modules subject to AEC-Q100 stress testing. IC Role / Device Role / Timing Role: High-speed serial flash interfaced to SoC via Quad I/O SPI for sub-100ms cold-boot time and real-time firmware updates over CAN FD. Use Value: 133 MHz Quad I/O clock and DTR read support achieve >500 MB/s effective throughput - enabling rapid loading of neural network models. |
Use Scenario: Holding metrology firmware, tariff tables, and encrypted communication stacks in utility-grade smart meters deployed outdoors for 15+ years. IC Role / Device Role / Timing Role: Industrial-grade NOR flash with -40°C to +85°C rating and <1 µA power-down current for battery-assisted operation during mains failure. Use Value: Block protect bits (BP3–BP0) and TB/CMP configuration allow hardware-level partitioning of updateable vs. immutable firmware regions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L25645GMI-10G | 3.3 V supply, no DTR support, 104 MHz max Quad SPI clock, lacks SFDP and Unique ID | Requires level-shifting for 1.8 V systems; lower bandwidth limits XIP performance in resource-constrained MCUs | Select only if 3.3 V supply and legacy driver compatibility are mandatory; verify absence of DTR requirement in target use case |
| IS25LP256D-JBLE | 1.8 V supply, supports DTR and SFDP, but only 80 MHz Quad SPI clock and no dedicated /RESET pin in WSON | Lower throughput reduces boot speed; missing /RESET may require external reset IC in safety-critical designs | Prefer where cost sensitivity outweighs peak bandwidth needs; confirm system-level reset architecture accommodates no-hardware-reset constraint |
Compared with W25Q256JWBIM TR, MX25L25645GMI-10G trades voltage compatibility for reduced feature set and bandwidth, while IS25LP256D-JBLE matches voltage and DTR but sacrifices clock speed and reset integration - making W25Q256JWBIM TR optimal for high-reliability, high-throughput 1.8 V embedded boot applications.
Availability
W25Q256JWBIM TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot code, automotive ADAS camera modules, and smart energy meter firmware requiring stable component supply across multi-year production cycles.
Supply support for W25Q256JWBIM TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial NOR/NAND flash, RAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.
The W25Q256JW family targets high-performance, low-voltage embedded systems requiring fast code execution, robust security, and long-term data integrity - with design emphasis on XIP-capable boot memory for microcontrollers and SoCs.
FAQ
What is the package type and footprint of W25Q256JWBIM TR?
W25Q256JWBIM TR uses an 8-pad WSON (Wafer-Level Small Outline No-Lead) package measuring 6 mm × 5 mm with an exposed thermal pad. It follows Package Code P per Winbond's ordering nomenclature and is compatible with standard reflow profiles for lead-free assembly. The pinout supports SPI, Dual SPI, and Quad SPI interfaces without requiring additional passives for level shifting due to its native 1.8 V operation.
Does W25Q256JWBIM TR support hardware reset functionality?
No, W25Q256JWBIM TR does not include a dedicated /RESET pin. Its WSON 6×5-mm package (Code P) implements /HOLD as a multifunction terminal that can serve as IO3 in Quad SPI mode but lacks hardware reset capability. For systems requiring hardware reset, Winbond offers SOIC-16 (Code F) and TFBGA (Codes B/C) variants of the W25Q256JW family with a dedicated /RESET pin - W25Q256JWBIM TR is not one of them.
How does W25Q256JWBIM TR enable secure firmware updates?
W25Q256JWBIM TR enables secure firmware updates through multiple hardware and register-level mechanisms: programmable Block Protect bits (BP3–BP0) with top/bottom/complement configuration, OTP-locked security registers for key storage, 64-bit unique ID for device binding, and SFDP register for authenticated parameter discovery. These features collectively prevent unauthorized writes, support cryptographic verification, and allow partitioned update zones without software-only reliance.
What is the role of the Quad Enable (QE) bit in W25Q256JWBIM TR operation?
The Quad Enable (QE) bit - located in Status Register-2 - must be set to '1' to activate Quad SPI mode on W25Q256JWBIM TR. When QE = 1, the /WP and /HOLD pins are reassigned as IO2 and IO3 respectively, enabling four-line bidirectional data transfer. This bit can be written in volatile or non-volatile form, allowing persistent Quad mode across power cycles when configured non-volatily - essential for reliable XIP and high-bandwidth read operations.
Can W25Q256JWBIM TR be used for Execute-in-Place (XIP) applications?
Yes, W25Q256JWBIM TR is explicitly designed for Execute-in-Place (XIP) applications. Its support for high-speed Quad I/O SPI (up to 133 MHz), DTR read instructions (e.g., EDh), uniform 4KB sectors, and fast read command bypass (66 MB/s) enables direct code execution from flash by microcontrollers and application processors. Combined with SFDP register support, it allows automatic timing configuration - reducing software overhead and improving boot determinism in XIP-based architectures.
W25Q256JWBIM TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI, DTR
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 5ms
- Access Time:
- 6 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (6x8)
W25Q256JWBIM TR FAQ
1.How can I place an order for W25Q256JWBIM TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q256JWBIM TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q256JWBIM TR reliable?
The price and inventory of W25Q256JWBIM TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256JWBIM TR is usually 5 days.
3.What payment methods are accepted for W25Q256JWBIM TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256JWBIM TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q256JWBIM TR?
W25Q256JWBIM TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q256JWBIM TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q256JWBIM TR?
For technical support, including W25Q256JWBIM TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256JWBIM TR requirements.
6.How does Aetrix verify that W25Q256JWBIM TR is sourced from the original manufacturer or authorized distributors?
All W25Q256JWBIM TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256JWBIM TR meets industry standards.
7.What is the process for return or replacement of W25Q256JWBIM TR?
All W25Q256JWBIM TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256JWBIM TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q256JWBIM TR part is unused and in its original packaging.
Return procedure for W25Q256JWBIM TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25Q256JWBIM TR Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

