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Winbond Electronics Corporation W25Q256JWEIM

Part No.:
W25Q256JWEIM
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q256JWEIM.pdf
Description:
IC FLASH 256MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,097

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Product details

Overview

W25Q256JWEIM from Winbond is a 1.8V, 256M-bit serial NOR flash memory supporting Dual/Quad SPI, QPI, and DTR read modes with up to 133 MHz Quad I/O clock speed (532 MHz equivalent throughput), 4KB uniform sector erase architecture, and hardware write protection via /WP and /HOLD pins - deployed in embedded boot code storage, firmware update partitions, and XIP-capable microcontroller systems.

For engineers reviewing the W25Q256JWEIM datasheet, W25Q256JWEIM pinout, W25Q256JWEIM application, or W25Q256JWEIM equivalent, this page delivers verified package mapping (8-pin WSON 6×5 mm, Package Code P), confirmed pin functions including IO0–IO3 reconfiguration under Quad Enable, JEDEC ID and SFDP register support, and real-world timing constraints for DTR Fast Read (0Dh/EDh) and 4-byte addressing mode transitions.

Technical Context

The W25Q256JWEIM implements a flexible SPI interface with three operational modes: Standard (DI/DO), Dual (IO0/IO1), and Quad (IO0–IO3), where Quad mode requires non-volatile setting of the QE bit in Status Register-2. Its DTR (Double Transfer Rate) capability enables two data bits per clock edge during read operations, doubling effective bandwidth over standard SPI at identical clock frequencies.

Memory organization comprises 131,072 × 256-byte programmable pages across 8,192 erasable 4KB sectors and 512 erasable 64KB blocks. Erase/program suspend-resume functionality, volatile/non-volatile status register bits (BP0–BP3, TB, CMP, SRP), and three 256-byte OTP-locked security registers provide deterministic control over firmware integrity and field-upgrade safety.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 M-bit (32 MB), organized as 131,072 × 256-byte pages - supports full firmware images and multi-application partitioning.
Supply Voltage 1.7 V to 1.95 V - compatible with low-power 1.8V system rails; <1 µA typical standby current enables battery-backed retention.
Max Clock Frequency 133 MHz Quad I/O SPI - delivers 532 MB/s effective read throughput using Fast Read Quad I/O (6Bh/6Ch) or DTR Quad I/O (EDh/ECh).
Erase Granularity Uniform 4KB sectors, 32KB blocks, 64KB blocks - enables fine-grained firmware patching without disturbing adjacent code or configuration data.
Write Endurance 100,000 program/erase cycles per sector - validated for frequent OTA update scenarios in industrial gateways and automotive ECUs.
Data Retention 20+ years at +85°C - meets long-lifecycle requirements for medical devices and infrastructure controllers.
Security Features 64-bit unique ID, SFDP register, three 256-byte OTP-locked security registers, and individual sector lock/unlock (36h/39h) - supports secure boot key binding and anti-cloning.

Pinout & Package

W25Q256JWEIM is supplied in an 8-pad WSON package measuring 6×5 mm (Package Code P), with exposed thermal pad on underside. Pin 1 is marked by a dot or beveled corner; pin numbering follows counter-clockwise order from top-left when viewed from top side.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable: must transition high→low after power-up before instruction acceptance; high-impedance DO/IOx during deselect.
2 DO (IO1) Data Output / Bidirectional I/O Unidirectional output in Standard SPI; bidirectional data lane 1 in Dual/Quad SPI; requires QE=1 for Quad mode use.
3 /WP (IO2) Write Protect Input / Bidirectional I/O Hardware write lock for status register when active low; repurposed as IO2 in Quad mode (QE=1); not available during Quad operation.
4 GND Ground Reference Primary signal and power return path; must be low-inductance connection to minimize SPI noise and timing jitter.
5 DI (IO0) Data Input / Bidirectional I/O Unidirectional input in Standard SPI; bidirectional data lane 0 in Dual/Quad SPI; required for all instruction/address/data writes.
6 CLK Serial Clock Input Edge-triggered master clock (rising edge for input, falling edge for output); timing-critical path requiring controlled impedance routing.
7 /HOLD or /RESET (IO3) Hold or Reset Input / Bidirectional I/O Pauses ongoing SPI transfer when low (/HOLD); dedicated hardware reset when asserted (/RESET); becomes IO3 only if QE=1 and /RESET unused.
8 VCC Power Supply 1.7–1.95 V supply; requires local 100 nF ceramic decoupling within 5 mm of pin; voltage tracking with /CS mandatory at power-up/down.

Key Features

Feature Design Value
Dual/Quad SPI + QPI + DTR Read Modes Enables scalable bandwidth: 104 MHz Standard/Dual, 133 MHz Quad, and DTR doubling - eliminates need for parallel NOR in space-constrained designs.
4-Byte Addressing Mode Supports >16 MB addressing via B7h/E9h commands - essential for full 32 MB capacity access without address wrap or bank switching logic.
Erase/Program Suspend & Resume Allows background interrupt servicing during long erase cycles (e.g., 64KB block erase ~300 ms) - critical for real-time OS coexistence.
Volatile & Non-Volatile Status Register Bits BP0–BP3, TB, CMP, SRP, QE, ADS, ADP, DRV0/DRV1 configurable per application - enables runtime flexibility and factory-lockdown in same device.
Three 256-Byte Security Registers OTP-locked storage for cryptographic keys, calibration data, or device-specific credentials - prevents extraction via standard read commands.
JEDEC ID, SFDP, and 64-Bit Unique Serial Number Enables automated BOM validation, flash-aware bootloader initialization, and counterfeit detection in high-volume manufacturing.

Applications

Boot Code Storage Firmware Update Partition

Use Scenario: Storing primary bootloader and initial application image executed directly from flash (XIP) on Cortex-M7 or RISC-V SoCs.

IC Role / Device Role / Timing Role: Non-volatile code storage with Quad SPI XIP support and deterministic 4KB sector erase for safe dual-bank updates.

Use Value: Eliminates external RAM copy step; reduces boot time by >40% vs. Standard SPI; enables atomic firmware rollback via sector-level protection.

Use Scenario: Dedicated 8MB partition holding signed firmware deltas downloaded over cellular or Wi-Fi in IoT edge gateways.

IC Role / Device Role / Timing Role: Field-upgradable storage with Erase Suspend capability to maintain network stack responsiveness during 64KB block erases.

Use Value: Prevents communication timeout during background erase; supports secure signature verification using OTP-locked security registers.

Industrial HMI Configuration Automotive Telematics Log Buffer

Use Scenario: Storing display assets, language packs, and user preferences in human-machine interface panels with limited PCB area.

IC Role / Device Role / Timing Role: Parameter and asset storage with 4KB sector granularity enabling independent update of UI elements without full reflash.

Use Value: Reduces field service downtime; allows OEMs to deploy regional language packs post-deployment via targeted sector reprogramming.

Use Scenario: Cyclic logging of CAN bus diagnostics, GPS coordinates, and sensor metadata in telematics control units (TCUs).

IC Role / Device Role / Timing Role: High-endurance circular buffer leveraging 100K-cycle rating and fast 256-byte page programming for burst data capture.

Use Value: Survives 10+ years of daily 500MB logging; supports crash-triggered immediate write via /HOLD pin freeze to preserve last 2 seconds of data.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L25645GMI-08G 3V supply (2.7–3.6V); no DTR support; 104 MHz max Quad SPI; lacks SFDP and 64-bit UID. Requires separate 3V rail; unsuitable for DTR-timed systems or secure boot chains needing SFDP auto-discovery. Select only if legacy 3V design exists and DTR/SFDP/UID are unused; verify /HOLD timing compatibility with existing controller.
S25FL256SAGMFI000 1.8V supply; supports DTR but limited to 80 MHz Quad DTR; includes HyperBus interface option; larger 16-pin SOIC footprint. Lower peak bandwidth than W25Q256JWEIM; HyperBus adds pin count and layout complexity unless needed for higher density scaling. Prefer when migrating from Cypress platform or requiring HyperBus fallback; avoid if board space is constrained and 133 MHz DTR is required.

Compared with MX25L25645GMI-08G and S25FL256SAGMFI000, the W25Q256JWEIM delivers superior bandwidth via 133 MHz DTR Quad I/O, integrates essential security primitives (SFDP, UID, OTP registers) absent in the Macronix part, and maintains smaller 6×5 mm WSON footprint versus the Cypress SOIC variant - making it optimal for new 1.8V designs prioritizing speed, security, and miniaturization.

Availability

W25Q256JWEIM is available at Aetrix Electronics and suitable for industrial HMI, automotive telematics, and IoT gateway applications requiring stable component supply, long-term lifecycle assurance, and guaranteed traceability for ISO 13485 and IATF 16949 compliance programs.

Supply support for W25Q256JWEIM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including serial NOR/NAND flash, RAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.

The W25Q256JW series targets high-performance embedded systems requiring fast XIP execution, robust firmware update mechanisms, and integrated security - designed specifically for next-generation microcontrollers with advanced SPI peripherals and secure boot stacks.

FAQ

What is the package type and footprint of W25Q256JWEIM?

W25Q256JWEIM uses an 8-pin WSON package measuring 6 mm × 5 mm (Package Code P) with exposed thermal pad. It features a standard 0.5 mm pin pitch and is compatible with reflow soldering per J-STD-020. The pinout matches Figure 1a in the official datasheet, with /CS on Pin 1 and VCC on Pin 8. This compact footprint supports high-density PCB layouts in space-constrained applications like wearable medical devices and compact motor drives.

Does W25Q256JWEIM support 4-byte addressing, and how is it enabled?

Yes, W25Q256JWEIM fully supports 4-byte addressing to access its full 32 MB capacity. It is enabled via the Enter 4-Byte Address Mode command (B7h), which sets the ADP bit in Status Register-1 as non-volatile. Once set, all subsequent read/write/erase commands use 32-bit addresses. The device retains this mode across power cycles unless explicitly exited using E9h. This eliminates software bank-switching overhead in ARM Cortex-A and RISC-V Linux bootloaders.

How does the /HOLD pin function differ between Standard SPI and Quad SPI modes on W25Q256JWEIM?

In Standard/Dual SPI mode, the /HOLD pin pauses ongoing transfers while /CS remains low, placing DO/IOx in high-impedance state. In Quad SPI mode (QE=1), Pin 7 becomes IO3 - disabling /HOLD functionality unless the /RESET pin is unused and configured as /HOLD via the HOLD/RST bit in Status Register-3. This dual-role behavior requires careful initialization sequence planning in HAL drivers to avoid unintended mode conflicts during startup.

What security mechanisms does W25Q256JWEIM provide beyond basic write protection?

W25Q256JWEIM provides layered security: hardware /WP pin lock, non-volatile BP/TB/CMP bits for sector-level protection, OTP-locked security registers (256 bytes × 3), 64-bit unique serial number, and SFDP register for standardized parameter discovery. Unlike basic flash parts, it supports individual sector lock/unlock (36h/39h) and global lock (7Eh), enabling secure key storage and tamper-evident firmware signing workflows required in medical and industrial certifications.

Can W25Q256JWEIM be used for Execute-in-Place (XIP) applications, and what performance can be expected?

Yes, W25Q256JWEIM is optimized for XIP with Quad SPI and DTR support. Using Fast Read Quad I/O (6Bh) at 133 MHz, it achieves ~66 MB/s sustained read throughput - sufficient for real-time audio playback and GUI rendering on mid-tier MCUs. With DTR Quad I/O (EDh), effective bandwidth doubles, enabling seamless XIP of 1–2 MB application binaries without external RAM buffering in Cortex-M33 and RISC-V RV32IMC systems.

W25Q256JWEIM Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI, DTR
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
5ms
Access Time:
6 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25Q256JWEIM FAQ

1.How can I place an order for W25Q256JWEIM through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q256JWEIM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q256JWEIM reliable?

The price and inventory of W25Q256JWEIM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256JWEIM is usually 5 days.

3.What payment methods are accepted for W25Q256JWEIM?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256JWEIM transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q256JWEIM?

W25Q256JWEIM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q256JWEIM order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q256JWEIM?

For technical support, including W25Q256JWEIM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256JWEIM requirements.

6.How does Aetrix verify that W25Q256JWEIM is sourced from the original manufacturer or authorized distributors?

All W25Q256JWEIM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256JWEIM meets industry standards.

7.What is the process for return or replacement of W25Q256JWEIM?

All W25Q256JWEIM units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256JWEIM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q256JWEIM part is unused and in its original packaging.

Return procedure for W25Q256JWEIM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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