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Winbond Electronics Corporation W25Q256JWFIM

Part No.:
W25Q256JWFIM
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25Q256JWFIM.pdf
Description:
IC FLASH 256MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,733

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Product details

Overview

W25Q256JWFIM from Winbond is a 1.8V, 256M-bit serial NOR flash memory supporting Dual/Quad SPI, QPI, and DTR read modes. It delivers up to 133MHz Quad I/O clocking (532MB/s equivalent bandwidth), features uniform 4KB sectors (8,192 total), 100K program-erase cycles, and operates across –40°C to +85°C. It serves as nonvolatile code storage for microcontroller boot images in space-constrained embedded systems.

For engineers reviewing the W25Q256JWFIM datasheet, W25Q256JWFIM pinout, W25Q256JWFIM application, or W25Q256JWFIM equivalent, key selection criteria include 1.8V operation, DTR read support, quad I/O timing compliance, sector-level write protection granularity, and compatibility with XIP (execute-in-place) architectures requiring fast random-access reads.

Technical Context

The W25Q256JWFIM implements a flexible SPI-compatible interface with configurable I/O width: standard (1-bit), dual (2-bit), or quad (4-bit) data paths, plus QPI mode for command/data multiplexing. Its internal architecture supports both 3-byte and 4-byte addressing modes, with ADP bit enabling persistent 4-byte mode on power-up.

It integrates volatile and non-volatile status registers controlling Quad Enable (QE), block protection (BP3–BP0), top/bottom lock (TB), complement protect (CMP), and output driver strength (DRV1/DRV0). The /HOLD and /WP pins function as IO3 and IO2 respectively when QE=1, enabling full quad I/O operation without dedicated control pins.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 M-bit (32 MB), organized as 131,072 × 256-byte pages
Supply Voltage1.7 V to 1.95 V - enables direct integration with 1.8V logic domains without level shifting
Max Clock Frequency133 MHz Quad I/O - achieves 532 MB/s effective throughput for burst reads
Erase GranularityUniform 4 KB sectors (8,192), 32 KB blocks (4,096), 64 KB blocks (2,048) - supports fine-grained firmware update partitioning
Endurance & Retention100,000 program/erase cycles; >20 years data retention at 25°C - suitable for field-upgradable firmware storage
Interface ModesStandard/Dual/Quad SPI, QPI, and DTR (Double Transfer Rate) - enables backward compatibility and performance scaling
Security Features64-bit unique ID, three 256-byte OTP-locked security registers, SFDP register - supports secure boot and device authentication

Pinout & Package

W25Q256JWFIM uses the 8-pad WSON 6×5-mm package (Package Code P), with exposed thermal pad. Pin functions are shared across SPI modes: IO0–IO3 serve as DI/DO/WP/HOLD in standard/dual mode, and as full quad I/O when QE=1.

Pin/TerminalCircuit RoleDesign Meaning
/CSChip Select InputActive-low enable; high-impedance DO/IOx outputs when deasserted; required low-to-high transition before new instruction acceptance
DO (IO1)Data Output / I/O1Unidirectional output in standard SPI; bidirectional I/O in dual/quad modes; used for status/data readback
/WP (IO2)Write Protect Input / I/O2Hardware lock for status register writes; repurposed as IO2 when Quad Enable (QE) bit is set
GNDGround ReferencePrimary return path for all digital and core power currents; connects to thermal pad for heat dissipation
DI (IO0)Data Input / I/O0Unidirectional input in standard SPI; bidirectional I/O in dual/quad modes; carries instructions, addresses, and write data
CLKSerial Clock InputSynchronous edge-triggered interface clock; rising edge latches inputs, falling edge samples outputs
/HOLD or /RESET (IO3)Hold Input / I/O3 / ResetPauses ongoing SPI transaction when low; functions as hardware reset in SOIC/TFBGA packages; repurposed as IO3 when QE=1
VCCPower Supply1.7–1.95 V core supply; powers memory array, logic, and I/O buffers; requires local decoupling

Key Features

FeatureDesign Value
DTR Read SupportEnables double-data-rate sampling on CLK edges, doubling effective throughput without increasing clock frequency
Erase/Program Suspend & ResumeAllows background erase or program operations to be paused for higher-priority reads, improving real-time system responsiveness
Volatile & Non-Volatile Status Register BitsSupports runtime configuration changes (e.g., QE, DRV0/1) while preserving critical protection settings (BP, TB, CMP) across power cycles
Individual Block/Sector LockPermits selective locking of specific 4KB sectors via 32-bit lock register, enabling secure firmware partitioning
Discoverable Parameters (SFDP)Standardized JEDEC register providing programmable timing, voltage, and feature parameters - simplifies host driver auto-configuration

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing firmware images and configuration tables for programmable logic controllers operating in harsh industrial environments.

IC Role / Device Role / Timing Role: Nonvolatile code storage with execute-in-place (XIP) capability using Quad SPI fast read commands.

Use Value: 4KB sector erase enables incremental firmware patching without full reflash; 100K endurance ensures longevity over 10+ years of field updates.

Use Scenario: Holding boot code and safety-critical calibration data for vision processors in autonomous driving systems.

IC Role / Device Role / Timing Role: Primary boot memory accessed during cold start; supports DTR read for sub-100ms firmware load latency.

Use Value: 1.8V operation matches SoC I/O voltage; -40°C to +85°C rating meets automotive AEC-Q100 ambient requirements.

Medical Imaging Device ConfigurationSmart Home Gateway OTA Storage

Use Scenario: Storing DICOM metadata templates, user presets, and regulatory-compliant audit logs in portable ultrasound equipment.

IC Role / Device Role / Timing Role: Parameter and data archive with hardware write protection enabled via /WP pin and BP bits.

Use Value: Individual sector lock prevents accidental overwrite of FDA-mandated calibration records; 64-bit UID enables device traceability.

Use Scenario: Hosting encrypted firmware binaries and delta update patches for Wi-Fi/BLE gateways with constrained PCB area.

IC Role / Device Role / Timing Role: Secure OTA update payload storage with SFDP-driven timing adaptation and security register encryption keys.

Use Value: WLCSP-compatible footprint (in Y-package variants) reduces board space by 60% vs SOIC; OTP-locked security registers protect decryption keys.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX25L25645GMI-13G256Mb, 3.3V supply, max 133MHz Quad SPI, no DTR support, 100K enduranceLacks DTR read mode and 1.8V operation; requires level-shifting in 1.8V systemsSelect only if system uses 3.3V I/O and does not require DTR throughput boost or ultra-low-power sleep states.
S25FL256SAGMFIR00256Mb, 3.0V supply, 80MHz Quad SPI, supports XIP but no DTR, includes built-in ECCHigher voltage, lower max clock, no DTR; adds single-bit error correction for extended reliabilityPrefer when bit-error resilience is prioritized over speed and voltage compatibility; not drop-in due to voltage and timing mismatch.

Compared with MX25L25645GMI-13G and S25FL256SAGMFIR00, W25Q256JWFIM uniquely combines 1.8V operation, DTR read capability, and 133MHz Quad SPI - delivering optimal throughput and power efficiency for battery-powered and space-constrained 1.8V SoC designs.

Availability

W25Q256JWFIM is available at Aetrix Electronics and suitable for industrial automation, automotive infotainment, and medical diagnostics applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for W25Q256JWFIM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND flash, RAM, and mobile DRAM, serving industrial, automotive, and consumer markets.

The W25Q series targets high-performance, low-voltage embedded systems needing reliable code storage with advanced interface flexibility - specifically optimized for XIP, OTA updates, and secure boot applications.

FAQ

What is the operating voltage range for W25Q256JWFIM?

The W25Q256JWFIM operates from 1.7 V to 1.95 V. This narrow 1.8V nominal range eliminates the need for external level shifters when interfacing with 1.8V microcontrollers or application processors, reducing BOM cost and layout complexity. Its design ensures stable read/write/erase functionality across the full voltage window, with typical power-down current below 1 µA at 1.8V.

Does W25Q256JWFIM support execute-in-place (XIP) operation?

Yes, W25Q256JWFIM supports XIP via Dual and Quad SPI Fast Read instructions, enabling CPU instruction fetch directly from flash without copying to RAM. Its 133MHz Quad I/O clock and DTR read mode deliver up to 532MB/s effective bandwidth, minimizing latency for real-time code execution. The device's uniform 4KB sector architecture also allows precise mapping of executable code segments.

How is the /HOLD pin used in W25Q256JWFIM, and what happens when Quad Enable is set?

In standard/dual SPI mode, /HOLD (Pin 7) pauses active transactions when pulled low. When the Quad Enable (QE) bit in Status Register-2 is set, /HOLD becomes IO3 - a bidirectional data line for Quad SPI communication. This pin multiplexing maximizes I/O count without adding physical pins, but requires firmware to manage QE state before switching interface modes.

What package type does W25Q256JWFIM use, and is thermal pad connection required?

W25Q256JWFIM uses the 8-pad WSON 6×5-mm package (Package Code P) with an exposed thermal pad on the bottom. The thermal pad must be soldered to a PCB copper pour for thermal dissipation and mechanical stability. Electrical connection of the pad to GND is recommended per Winbond layout guidelines to reduce noise and improve signal integrity on high-speed Quad I/O lines.

Can W25Q256JWFIM be used in automotive applications, and what qualifications does it meet?

W25Q256JWFIM is rated for –40°C to +85°C operation and complies with RoHS and REACH standards. While not AEC-Q100 qualified as a standalone part, its temperature range, 100K endurance, and 20-year data retention make it suitable for under-hood-adjacent or cabin-infotainment applications where full automotive qualification is not mandated. System-level validation is required for safety-critical automotive use.

W25Q256JWFIM Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI, DTR
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
5ms
Access Time:
6 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25Q256JWFIM FAQ

1.How can I place an order for W25Q256JWFIM through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q256JWFIM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q256JWFIM reliable?

The price and inventory of W25Q256JWFIM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q256JWFIM is usually 5 days.

3.What payment methods are accepted for W25Q256JWFIM?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q256JWFIM transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q256JWFIM?

W25Q256JWFIM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q256JWFIM order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q256JWFIM?

For technical support, including W25Q256JWFIM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q256JWFIM requirements.

6.How does Aetrix verify that W25Q256JWFIM is sourced from the original manufacturer or authorized distributors?

All W25Q256JWFIM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q256JWFIM meets industry standards.

7.What is the process for return or replacement of W25Q256JWFIM?

All W25Q256JWFIM units undergo pre-shipment inspection (PSI). If there is an issue with W25Q256JWFIM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q256JWFIM part is unused and in its original packaging.

Return procedure for W25Q256JWFIM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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