Winbond Electronics Corporation W25Q32BVTBJP TR
- Part No.:
- W25Q32BVTBJP TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25Q32BVTBJP TR.pdf
- Description:
- IC FLASH 32MBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,054
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W25Q32BVTBJP TR from Winbond is a 32M-bit (4MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with up to 104 MHz clock rate, 4KB uniform sector architecture, and 1µA power-down current. It enables execute-in-place (XIP) code execution, parameter storage, and firmware updates in space-constrained embedded systems.
For engineers reviewing the W25Q32BVTBJP TR datasheet, W25Q32BVTBJP TR pinout, W25Q32BVTBJP TR application, or W25Q32BVTBJP TR equivalent, key selection criteria include Quad SPI enable (QE bit), 4KB sector erase granularity, hardware write protection via /WP and /HOLD pins, and compatibility with JEDEC-standard SFDP and Unique ID registers.
Technical Context
The W25Q32BVTBJP TR implements a SPI command set compliant with Mode 0 and Mode 3 clock polarity/idle states, supports dual/quad I/O protocols using IO0–IO3 bidirectional pins, and requires non-volatile Quad Enable (QE) bit setting in Status Register-2 to activate Quad SPI functionality. Its block diagram integrates a 256-byte page buffer, sector/block erase logic, and three 256-byte security registers with OTP locks.
It features programmable write protection with top/bottom array control, erase/program suspend/resume capability, and continuous read mode with as few as 8 clocks for address setup - enabling true XIP operation without external buffering. The device uses internal high-voltage generators for erase/program cycles and supports JEDEC-standard manufacturer/device ID and 64-bit unique serial number reads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 M-bit (4,194,304 bytes), organized as 16,384 × 256-byte pages |
| Operating Voltage | 2.7 V to 3.6 V single supply - compatible with 3.3 V logic systems without level shifting |
| SPI Clock Rate | Up to 104 MHz for Dual SPI, 80 MHz for Quad SPI - delivers 208 MB/s (Dual) and 320 MB/s (Quad) effective throughput |
| Erase Granularity | Uniform 4 KB sectors (1,024 total), plus 32 KB and 64 KB blocks - enables fine-grained firmware partitioning and OTA update safety |
| Endurance & Retention | 100,000 program/erase cycles minimum; 20-year data retention at +85°C - suitable for industrial firmware storage |
| Power Consumption | 4 mA active current (typ.), <1 µA power-down (typ.) - critical for battery-backed or low-power IoT nodes |
| Temperature Range | –40°C to +85°C industrial grade - validated for automotive infotainment and industrial HMI applications |
Pinout & Package
W25Q32BVTBJP TR is packaged in an 8-pin TSSOP (Thin Shrink Small Outline Package) 208-mil (package code "TJ"), with gull-wing leads and standard SOIC footprint compatibility. Pin 1 marked by notch or dot; body width 4.4 mm, lead pitch 1.27 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable: drives DO/IOx to high-Z when high; required low-to-high transition before new instruction acceptance |
| 2 DO (IO1) | Data Output / Bidirectional I/O | Standard SPI output only; becomes IO1 in Dual/Quad modes - used for read data and status feedback |
| 3 /WP (IO2) | Write Protect Input / Bidirectional I/O | Hardware lock for Status Register when QE=0; repurposed as IO2 in Quad SPI (QE=1) |
| 4 GND | Ground Reference | Primary return path for all I/O and core logic; must be low-impedance connection to system ground plane |
| 5 DI (IO0) | Data Input / Bidirectional I/O | Standard SPI input only; becomes IO0 in Dual/Quad modes - carries instructions, addresses, and program data |
| 6 CLK | Serial Clock Input | Edge-triggered timing reference for all SPI operations; supports Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1) |
| 7 /HOLD (IO3) | Hold Input / Bidirectional I/O | Pauses ongoing SPI transaction when low (active); repurposed as IO3 in Quad SPI (QE=1) |
| 8 VCC | Power Supply | 2.7–3.6 V core and I/O supply; decoupling capacitor (0.1 µF ceramic) required within 5 mm of pin |
Key Features
| Feature | Design Value |
|---|---|
| Quad SPI Interface Support | Enables 4-line data transfer (IO0–IO3) after QE bit is set - doubles bandwidth vs Dual SPI and quadruples vs Standard SPI |
| Continuous Read Mode | Reduces instruction overhead to ≤8 clocks per 24-bit address - eliminates latency penalties during XIP execution |
| 4KB Uniform Sector Architecture | Allows independent erasure of smallest 4KB units - essential for reliable parameter storage and incremental firmware updates |
| Hardware Write Protection | /WP and /HOLD pins provide physical lockout of Status Register writes - prevents accidental configuration corruption in field-deployed units |
| 64-Bit Unique Serial Number | Factory-programmed, read-only identifier per device - enables secure device authentication and traceability in production and field service |
| Security Register Set | Three 256-byte OTP-lockable security registers - supports encrypted key storage and secure boot credential management |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Boot Code |
|---|---|
|
Use Scenario: Storing boot loader and real-time OS images in programmable logic controllers with limited PCB area and no parallel bus interface. IC Role / Device Role / Timing Role: Primary non-volatile code storage device accessed via Quad SPI for fast XIP execution during cold start and firmware recovery. Use Value: 4KB sector erase allows safe over-the-air (OTA) updates without disrupting running control logic; 100K-cycle endurance ensures >10 years of field reprogramming. |
Use Scenario: Hosting boot code and UI assets in head unit ECUs where EMI sensitivity limits parallel bus use and thermal constraints demand low active power. IC Role / Device Role / Timing Role: High-reliability NOR flash providing deterministic read latency and guaranteed 80 MHz Quad SPI access for boot ROM emulation. Use Value: Continuous Read Mode enables zero-wait-state execution directly from flash; –40°C to +85°C rating meets AEC-Q100 Grade 3 requirements. |
| Medical Device Configuration Memory | Smart Meter Parameter Storage |
|
Use Scenario: Retaining calibration coefficients, user preferences, and audit logs in portable diagnostic equipment with strict power budget and data integrity requirements. IC Role / Device Role / Timing Role: Secure, tamper-resistant parameter store leveraging hardware /WP lock and OTP security registers for HIPAA-compliant data retention. Use Value: 20-year data retention at +85°C ensures lifetime validity of stored calibration; 64-bit Unique ID enables per-device cryptographic binding. |
Use Scenario: Storing tariff tables, metering history, and communication stack parameters in ANSI C12.19-compliant utility meters deployed in uncontrolled outdoor environments. IC Role / Device Role / Timing Role: Industrial-grade serial flash with robust ESD immunity and sector-level write protection to prevent corruption during power interruption events. Use Value: Uniform 4KB sectors allow atomic updates of tariff schedules; <1 µA power-down current extends battery life in AMI endpoint sleep modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L3233FZNI-10G | 32 M-bit, 104 MHz max clock, same 8-pin TSSOP package but lacks Quad Enable bit in Status Register-2; supports only Standard/Dual SPI | No native Quad SPI support - limits XIP performance and bandwidth in high-speed boot scenarios | Select when Quad SPI is unnecessary and legacy Dual SPI compatibility is prioritized over peak throughput |
| S25FL132K0XMFI010 | 32 M-bit, 80 MHz Quad SPI, 8-pin SOIC package; includes SFDP v1.6 and configurable dummy cycle support not present in W25Q32BVTBJP TR | Better configurability for variable-latency host controllers but requires additional initialization sequence | Select when host SoC requires advanced SFDP-driven timing adaptation or extended dummy cycle tuning |
Compared with MX25L3233FZNI-10G and S25FL132K0XMFI010, the W25Q32BVTBJP TR delivers higher Quad SPI bandwidth (320 MB/s vs 240 MB/s), simpler QE bit activation, and broader industrial temperature validation - making it optimal for cost-sensitive, high-throughput embedded boot applications requiring minimal driver complexity.
Availability
W25Q32BVTBJP TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot code, medical device configuration memory, smart meter parameter storage, and embedded edge AI model caching requiring stable component supply across multi-year production cycles.
Supply support for W25Q32BVTBJP TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial NOR/NAND flash, RAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.
The W25Q32BVTBJP TR belongs to Winbond's W25QxxBV family of high-performance serial NOR flash devices, designed specifically for embedded systems requiring fast, reliable, and space-efficient code and data storage with robust security and long-term data integrity.
FAQ
What is the package type and lead count of the W25Q32BVTBJP TR?
The W25Q32BVTBJP TR uses an 8-pin TSSOP (Thin Shrink Small Outline Package) with 208-mil body width (package code "TJ"). It has gull-wing leads, 1.27 mm pitch, and is pin-compatible with standard SOIC-8 footprints. This package supports reflow soldering and meets JEDEC MS-012 standards for industrial reliability.
Does the W25Q32BVTBJP TR support Quad SPI mode out of the box?
No - the W25Q32BVTBJP TR requires the Quad Enable (QE) bit in Status Register-2 to be set to '1' before Quad SPI instructions (e.g., EBh, 6Bh) become functional. By default, QE = 0; users must issue Write Status Register (01h) with appropriate data to enable IO2 (/WP) and IO3 (/HOLD) as Quad I/O lines. Failure to set QE results in undefined behavior on Quad commands.
How does hardware write protection work on the W25Q32BVTBJP TR?
The W25Q32BVTBJP TR provides hardware write protection via the /WP pin, which - when held low - prevents writes to the Status Register regardless of software commands. This protection works independently of Block Protect (BP) bits and remains active even if QE=1 (Quad mode). For full memory array protection, /WP must be tied low and BP bits configured accordingly; /WP is inactive in Quad SPI mode since it becomes IO2.
What is the minimum erase unit size supported by the W25Q32BVTBJP TR?
The W25Q32BVTBJP TR supports a minimum erase unit of 4 KB (one uniform sector), with 1,024 such sectors across its 4 MB array. This granularity enables precise firmware patching and parameter updates without disturbing adjacent code or data. Larger erase options include 32 KB blocks (128 sectors) and 64 KB blocks (256 sectors), but no sub-sector or byte-level erase is supported.
Can the W25Q32BVTBJP TR be used for Execute-in-Place (XIP) applications?
Yes - the W25Q32BVTBJP TR supports true XIP via Continuous Read Mode, which reduces instruction overhead to as few as 8 clock cycles for address setup and enables seamless sequential reads. When paired with a host controller supporting Quad SPI and fast read instructions (e.g., EBh), it delivers deterministic latency and bandwidth sufficient for direct code execution in microcontrollers like ARM Cortex-M7 or RISC-V cores without external RAM buffering.
W25Q32BVTBJP TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25Q32BVTBJP TR FAQ
1.How can I place an order for W25Q32BVTBJP TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q32BVTBJP TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q32BVTBJP TR reliable?
The price and inventory of W25Q32BVTBJP TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q32BVTBJP TR is usually 5 days.
3.What payment methods are accepted for W25Q32BVTBJP TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q32BVTBJP TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q32BVTBJP TR?
W25Q32BVTBJP TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q32BVTBJP TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q32BVTBJP TR?
For technical support, including W25Q32BVTBJP TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q32BVTBJP TR requirements.
6.How does Aetrix verify that W25Q32BVTBJP TR is sourced from the original manufacturer or authorized distributors?
All W25Q32BVTBJP TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q32BVTBJP TR meets industry standards.
7.What is the process for return or replacement of W25Q32BVTBJP TR?
All W25Q32BVTBJP TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q32BVTBJP TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q32BVTBJP TR part is unused and in its original packaging.
Return procedure for W25Q32BVTBJP TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25Q32BVTBJP TR Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

