Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W25Q32BVZPJP

Part No.:
W25Q32BVZPJP
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q32BVZPJP.pdf
Description:
IC FLASH 32MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,275

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W25Q32BVZPJP from Winbond is a 32M-bit (4MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with 104 MHz dual-output and 80 MHz quad-output clock rates. It features uniform 4KB sectors, 256-byte page programming, and hardware write protection via /WP and /HOLD pins. It is used in embedded boot code storage, firmware update storage, and XIP-capable microcontroller systems requiring low-power, high-reliability nonvolatile memory.

For engineers reviewing the W25Q32BVZPJP datasheet, W25Q32BVZPJP pinout, W25Q32BVZPJP application, or W25Q32BVZPJP equivalent, key selection considerations include its ZP (8-pad WSON 6×5-mm) package, Quad Enable (QE) bit dependency for quad I/O mode, 4mA active current draw, -40°C to +85°C industrial temperature range, and JEDEC-compliant manufacturer/device ID support.

Technical Context

The W25Q32BVZPJP implements a SPI command architecture with three operational modes: Standard (DI/DO), Dual (IO0/IO1), and Quad (IO0–IO3), where IO2 and IO3 are remapped from /WP and /HOLD only when the non-volatile Quad Enable (QE) bit in Status Register-2 is set. Its block diagram integrates a 256-byte page buffer, sector/block erase logic, SFDP register, and three 256-byte security registers with OTP locks.

It supports continuous read mode with as few as 8 clocks of instruction overhead per 24-bit address access, enabling true execute-in-place (XIP) operation. Erase granularity includes 4KB sectors (1,024 total), 32KB blocks (128), and 64KB blocks (64), with suspend/resume capability for program/erase operations and >100,000 program/erase cycles.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 32 M-bit (4,194,304 bytes), organized as 16,384 × 256-byte pages
Supply Voltage 2.7 V to 3.6 V - enables direct integration into 3.3 V embedded systems without level-shifting
Active Current 4 mA typical at 104 MHz - supports low-power boot and firmware fetch in battery-backed applications
Power-down Current 1 µA typical - allows deep-sleep retention during system idle states
SPI Clock Rate 104 MHz (Dual I/O), 80 MHz (Quad I/O) - delivers up to 40 MB/s continuous read throughput
Erase Endurance 100,000 program/erase cycles per sector - ensures long-term field reliability for firmware update partitions
Data Retention 20 years at +25°C - meets industrial lifecycle requirements for unattended deployments
Operating Temp -40°C to +85°C - qualified for industrial-grade embedded control and automotive body electronics

Pinout & Package

W25Q32BVZPJP uses the ZP package: 8-pad WSON (6 mm × 5 mm, 0.75 mm height), lead-free and RoHS-compliant, with wettable flank side walls for automated optical inspection (AOI).

Pin/Terminal Circuit Role Design Meaning
/CS Chip Select Input Active-low enable signal; places DO/IO pins in high-impedance state when deasserted, reducing bus contention
DO (IO1) Bidirectional Data Output/Input Serial data output in Standard/Dual SPI; becomes IO1 in Dual/Quad mode - supports full-duplex reads
/WP (IO2) Write Protect Input / Quad I/O Pin Hardware write-protection for status register when QE=0; remapped to IO2 in Quad mode (QE=1)
GND Ground Reference Primary return path for all digital and internal high-voltage charge-pump circuits
DI (IO0) Bidirectional Data Input/Input Serial data input in Standard SPI; becomes IO0 in Dual/Quad mode - carries instructions, addresses, and data
CLK Serial Clock Input Edge-triggered timing reference for all SPI transfers; supports Mode 0 and Mode 3 clock polarity/idle states
/HOLD (IO3) Hold Input / Quad I/O Pin Pauses ongoing SPI transfer when asserted low (Standard/Dual only); remapped to IO3 in Quad mode (QE=1)
VCC Power Supply Single 2.7–3.6 V supply powers core logic, charge pumps, and I/O buffers - no auxiliary voltage required

Key Features

Feature Design Value
Quad SPI Interface Enables 4-line bidirectional data transfer (IO0–IO3) after setting QE bit - doubles bandwidth vs. Dual SPI and quadruples vs. Standard SPI
Continuous Read Mode Reduces instruction overhead to ≤8 clocks per 24-bit address - eliminates repeated command reissuance for sequential XIP execution
Flexible Erase Architecture Supports 4KB sector, 32KB block, 64KB block, and chip-wide erase - allows fine-grained firmware partitioning and wear leveling
Hardware Write Protection /WP pin + BP/TB/SEC bits provide overlapping, hierarchical lock-down of memory regions - prevents accidental overwrites during power transitions
Unique 64-bit ID Factory-programmed serial number accessible via 4Bh instruction - enables device authentication and secure firmware binding
Security Registers Three 256-byte OTP-lockable registers for keys, certificates, or calibration data - isolated from main array and protected by SRP bits

Applications

Boot Code Storage Firmware Update Storage

Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M or RISC-V microcontrollers.

IC Role / Device Role / Timing Role: Nonvolatile storage accessed at power-on reset via SPI; provides deterministic fetch latency for XIP or copy-to-RAM boot sequences.

Use Value: 40 MB/s Quad I/O read speed reduces boot time by >60% vs. standard SPI flash; 4KB sector granularity enables atomic firmware updates without erasing entire image.

Use Scenario: Holding field-upgradable firmware images in IoT gateways and industrial HMIs.

IC Role / Device Role / Timing Role: Dual-bank storage partitioned into active/inactive banks; supports background download and atomic swap on reboot.

Use Value: Erase/program suspend/resume allows interruption of large firmware writes during real-time events; >100K endurance ensures 10+ years of daily OTA updates.

Secure Configuration Storage Audio/Log Data Buffer

Use Scenario: Storing cryptographic keys, device certificates, and calibrated sensor offsets in medical or payment terminals.

IC Role / Device Role / Timing Role: Dedicated security register access via 42h/44h/48h instructions; isolated from main flash array and locked via OTP bits.

Use Value: Hardware-enforced write-protection prevents runtime tampering; 64-bit unique ID binds keys to physical device identity.

Use Scenario: Capturing diagnostic logs or voice prompts in edge AI audio processors and smart speakers.

IC Role / Device Role / Timing Role: High-throughput sequential write buffer using page programming (02h/32h); leverages continuous read mode for fast playback streaming.

Use Value: 256-byte page programming minimizes write latency; 1 µA power-down current extends battery life during silent intervals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L3233FZNI-10G 32 M-bit, 104 MHz max clock, same ZP package; lacks Quad I/O and SFDP register; uses legacy status register layout No native Quad SPI support limits XIP performance; no SFDP means fixed parameter discovery instead of dynamic configuration Choose for cost-sensitive designs where Dual SPI suffices and firmware does not require flexible configuration or high-speed XIP.
S25FL132K0XMFI010 32 M-bit, 80 MHz Quad SPI, same 6×5-mm WSON; includes HyperBus interface option and configurable dummy cycles HyperBus compatibility adds pinout and protocol complexity; higher standby current (5 µA) vs. W25Q32BVZPJP's 1 µA Choose when future migration to HyperFlash or mixed-interface systems is planned; avoid if minimizing power or simplifying driver stack is critical.

Compared with MX25L3233FZNI-10G and S25FL132K0XMFI010, W25Q32BVZPJP delivers superior XIP readiness via continuous read mode and lower power-down current, while maintaining broad software compatibility through JEDEC ID and SFDP support - making it optimal for resource-constrained, battery-aware, and firmware-flexible embedded systems.

Availability

W25Q32BVZPJP is available at Aetrix Electronics and suitable for boot code storage, firmware update storage, and secure configuration storage requiring stable component supply, long-term industrial availability, and consistent parametric performance across production lots.

Supply support for W25Q32BVZPJP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial flash, PSRAM, and code storage devices for embedded and industrial markets.

The W25Q series was designed specifically for high-performance, low-power code execution and firmware storage in microcontroller-based systems - emphasizing Quad SPI throughput, sector-level flexibility, and integrated security features.

FAQ

What is the package type and footprint of W25Q32BVZPJP?

W25Q32BVZPJP uses the ZP package: an 8-pad WSON measuring 6 mm × 5 mm with 0.75 mm height and wettable flank side walls. It is compatible with standard reflow profiles and supports automated optical inspection. The pinout matches SOIC/VSOP/PDIP variants for /CS, DO, /WP, GND, DI, CLK, /HOLD, and VCC - but with compact surface-mount geometry optimized for space-constrained PCBs.

Does W25Q32BVZPJP support Quad SPI mode out of the box?

No - W25Q32BVZPJP requires explicit configuration to enable Quad SPI. The non-volatile Quad Enable (QE) bit in Status Register-2 must be set via Write Status Register (01h) instruction. Until QE=1, /WP and /HOLD remain dedicated control pins; after setting QE, they become IO2 and IO3. This prevents accidental mode changes during initialization or field operation.

How does W25Q32BVZPJP handle power-down and wake-up sequences?

W25Q32BVZPJP enters ultra-low-power mode (<1 µA) upon receiving Power-down (B9h) instruction. Wake-up occurs automatically on next /CS low transition, with no additional delay beyond standard power-up timing (tPU). The device retains all status register settings and memory contents during power-down, and requires no reinitialization - making it ideal for intermittent logging or sensor node sleep/wake cycles.

Can W25Q32BVZPJP be used for execute-in-place (XIP) applications?

Yes - W25Q32BVZPJP supports true XIP via Continuous Read Mode, which reduces instruction overhead to as few as 8 clocks per 24-bit address. Combined with Fast Read Quad I/O (EBh) delivering up to 40 MB/s throughput, it enables deterministic code fetch directly from flash without RAM shadowing - validated in Cortex-M4/M7 and RISC-V SoC reference designs.

What security mechanisms does W25Q32BVZPJP provide for firmware integrity?

W25Q32BVZPJP offers layered security: hardware write protection via /WP pin and status register BP/TB/SEC bits; 64-bit unique ID for device binding; three 256-byte OTP-lockable security registers; and SFDP-based parameter discovery to prevent misconfiguration. These features collectively protect against unauthorized firmware modification, cloning, and replay attacks in certified industrial and medical systems.

W25Q32BVZPJP Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
32Mbit
Memory Organization:
4M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (6x5)

W25Q32BVZPJP FAQ

1.How can I place an order for W25Q32BVZPJP through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q32BVZPJP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q32BVZPJP reliable?

The price and inventory of W25Q32BVZPJP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q32BVZPJP is usually 5 days.

3.What payment methods are accepted for W25Q32BVZPJP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q32BVZPJP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q32BVZPJP?

W25Q32BVZPJP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q32BVZPJP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q32BVZPJP?

For technical support, including W25Q32BVZPJP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q32BVZPJP requirements.

6.How does Aetrix verify that W25Q32BVZPJP is sourced from the original manufacturer or authorized distributors?

All W25Q32BVZPJP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q32BVZPJP meets industry standards.

7.What is the process for return or replacement of W25Q32BVZPJP?

All W25Q32BVZPJP units undergo pre-shipment inspection (PSI). If there is an issue with W25Q32BVZPJP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q32BVZPJP part is unused and in its original packaging.

Return procedure for W25Q32BVZPJP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q32BVZPJP Tags

  • W25Q32BVZPJP
  • W25Q32BVZPJP PDF
  • W25Q32BVZPJP Datasheet
  • W25Q32BVZPJP Specifications
  • W25Q32BVZPJP Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W25Q32BVZPJP
  • Buy W25Q32BVZPJP
  • W25Q32BVZPJP Price
  • W25Q32BVZPJP Distributor
  • W25Q32BVZPJP Supplier
  • W25Q32BVZPJP Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER