Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W25Q32DWZEIG

Part No.:
W25Q32DWZEIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q32DWZEIG.pdf
Description:
IC FLASH 32MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,449

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W25Q32DWZEIG from Winbond is a 1.8V, 32M-bit (4MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces. It delivers up to 104MHz clock rate (416MHz equivalent Quad I/O), 50MB/s continuous read throughput, and features uniform 4KB sectors, 64KB blocks, and hardware write protection via /WP and /HOLD pins. It is used for code execution in place (XIP), firmware storage, and parameter retention in space-constrained embedded systems.

For engineers reviewing the W25Q32DWZEIG datasheet, W25Q32DWZEIG pinout, W25Q32DWZEIG application, or W25Q32DWZEIG equivalent, key selection considerations include its 1.7–1.95V supply range, JEDEC-compliant ID support, 64-bit unique serial number, quad-enable bit (QE) dependency for IO2/IO3 functionality, and compatibility with SOIC-208, WSON-6x5mm, and WSON-8x6mm packages - with W25Q32DWZEIG specifically using the ZE (8-pin WSON 8x6mm) variant.

Technical Context

The W25Q32DWZEIG implements a flexible SPI command architecture supporting four operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), Quad SPI (IO0–IO3), and QPI (all four IOs active with 2-clock instruction fetch). Its internal memory array comprises 16,384 pages of 256 bytes each, organized into 1,024 erasable 4KB sectors and 64 erasable 64KB blocks.

It integrates dual status registers with non-volatile Quad Enable (QE) bit, volatile/non-volatile write protection controls (BP0–BP2, TB, SEC, CMP, SRP0/SRP1), erase/program suspend/resume capability, and four 256-byte security registers with OTP locks. The device requires explicit QE bit setting to enable Quad SPI/QPI mode, repurposing /WP and /HOLD as IO2 and IO3 respectively.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density32 M-bit (4 MB) - supports full firmware images for mid-tier microcontrollers without external memory expansion.
Supply Voltage1.7 V to 1.95 V - enables direct integration with 1.8V logic domains and low-power SoCs.
Max Clock Frequency104 MHz - achieves 416 MB/s effective bandwidth in Quad I/O mode, exceeding X16 parallel flash in sustained throughput.
Erase Granularity4 KB sectors / 32 KB & 64 KB blocks - allows fine-grained firmware update partitioning and robust OTA rollback design.
Endurance & Retention100,000 program/erase cycles / 20-year data retention - suitable for field-upgradable industrial controllers and automotive ECUs.
Interface ModesStandard/Dual/Quad SPI + QPI - QPI reduces instruction overhead to 2 clocks per command, critical for deterministic XIP latency.
Security Features64-bit unique ID, 4×256B security registers with OTP lock, hardware/software write protect - meets basic secure boot and anti-cloning requirements.

Pinout & Package

W25Q32DWZEIG uses the 8-pin WSON 8×6 mm package (JEDEC MO-241AC, Winbond package code ZE), with exposed thermal pad (non-electrical). Pin functions are identical to SOIC-208 and WSON-6x5 variants but optimized for higher thermal dissipation and board area efficiency.

Pin/Terminal Circuit Role Design Meaning
/CSChip Select InputActive-low enable: drives DO/IOx high-Z when deasserted; required to transition high→low after power-up before first instruction.
DO (IO1)Data Output / Bidirectional I/OSerial data output in Standard SPI; becomes bidirectional IO1 in Dual/Quad/QPI modes - supports full-duplex read/write at up to 416 MB/s.
/WP (IO2)Write Protect Input / Bidirectional I/OHardware write protect for status register when QE=0; becomes IO2 in Quad/QPI mode - functionally disabled as /WP once QE bit is set.
GNDGround ReferencePrimary return path for VCC and all I/O signals; must be low-impedance and adjacent to thermal pad for stable 1.8V operation.
DI (IO0)Data Input / Bidirectional I/OSerial data input in Standard SPI; becomes bidirectional IO0 in Dual/Quad/QPI - carries instructions, addresses, and data on rising CLK edge.
CLKSerial Clock InputMaster-generated timing signal; supports SPI modes 0 and 3; frequency up to 104 MHz determines maximum interface bandwidth.
/HOLD (IO3)Hold Input / Bidirectional I/OPauses ongoing SPI transaction when asserted low (CS=low); becomes IO3 in Quad/QPI mode - not available as /HOLD when QE=1.
VCCPower Supply1.7–1.95 V core supply; decoupling capacitor (≥1 µF ceramic) required within 5 mm for stable high-speed operation.

Key Features

Feature Design Value
Continuous Read ModeAs few as 8 clocks to issue address + start streaming - enables true execute-in-place (XIP) with sub-100 ns effective access latency for cached reads.
Quad Peripheral Interface (QPI)2-clock instruction fetch instead of 8-clock standard SPI - cuts command overhead by 75%, improving real-time interrupt response in XIP applications.
Erase/Program Suspend & ResumeAllows background erase or program to pause on interrupt, then resume - essential for deterministic real-time firmware updates without blocking system tasks.
Uniform 4KB Sector ArchitectureEnables independent sector locking and partial chip updates - supports A/B firmware partitioning and atomic OTA rollbacks in resource-limited devices.
JEDEC Manufacturer & Device ID + Unique 64-bit Serial NumberEnables automated BOM verification, secure provisioning, and counterfeit detection during manufacturing and field deployment.

Applications

Industrial PLC Firmware Storage Automotive Infotainment Boot Code

Use Scenario: Storing boot firmware and configuration parameters in programmable logic controllers operating continuously in harsh environments (-40°C to +85°C).

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP-capable Quad SPI interface, delivering deterministic boot time and field-upgrade resilience.

Use Value: 4KB sector granularity enables safe over-the-air patching without erasing full firmware; 100K-cycle endurance ensures >10 years of daily updates in maintenance cycles.

Use Scenario: Hosting boot loader and safety-critical startup code for head unit SoCs requiring fast, reliable cold-boot performance.

IC Role / Device Role / Timing Role: High-speed NOR flash executing code directly from bus (XIP) via QPI mode, reducing boot latency versus NAND+RAM solutions.

Use Value: 104 MHz QPI clock yields 416 MB/s effective bandwidth - loads 2 MB bootloader in <5 ms, meeting automotive ASAM boot timing constraints.

Medical Device Parameter Logging IoT Edge Gateway Secure Boot

Use Scenario: Recording calibration data, usage logs, and diagnostic snapshots in portable ultrasound and infusion pumps with strict data integrity requirements.

IC Role / Device Role / Timing Role: Non-volatile parameter store with hardware write protection (/WP pin + BP bits) and 20-year data retention guarantee.

Use Value: Independent 4KB sector locking prevents accidental overwrite of FDA-mandated calibration records while allowing dynamic log rotation in adjacent sectors.

Use Scenario: Storing root-of-trust keys and verified boot images in cellular-connected gateways deployed in unattended remote locations.

IC Role / Device Role / Timing Role: Secure firmware vault leveraging 64-bit unique ID, OTP-locked security registers, and JEDEC ID authentication.

Use Value: Hardware-enforced write protection and immutable serial ID enable cryptographic binding of firmware to physical device, blocking cloning and unauthorized reflashing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L3233FZBI-10G32 M-bit, 1.65–2.0 V supply, max 104 MHz, same WSON-8x6mm (ZBI) package; lacks QPI mode and security registers.No QPI instruction set or 64-bit UID - unsuitable for XIP-critical or secure provisioning use cases.Select when cost sensitivity outweighs QPI performance or security needs; verify /WP and /HOLD behavior matches legacy SPI-only designs.
S25FL132K0XMFI01032 M-bit, 2.7–3.6 V supply, max 80 MHz, SOIC-16 only; includes SFDP and 4-byte addressing but no unique ID or security registers.Higher voltage requirement prevents direct 1.8V replacement; no hardware UID impedes device-level attestation.Choose only for 3.3V systems where pin count permits SOIC-16; avoid in battery-powered or security-sensitive deployments.

Compared with MX25L3233FZBI-10G and S25FL132K0XMFI010, W25Q32DWZEIG uniquely combines 1.8V operation, QPI mode, 64-bit UID, and OTP-secured registers - making it the only option among the three qualified for secure, low-voltage, high-bandwidth XIP in compact WSON-8x6mm layouts.

Availability

W25Q32DWZEIG is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot code, medical device parameter logging, IoT edge gateway secure boot, and embedded code shadowing requiring stable component supply across long-life product cycles.

Supply support for W25Q32DWZEIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial NOR/NAND flash, RAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.

The W25Q series targets high-performance, low-voltage embedded systems needing reliable code storage, XIP execution, and integrated security - designed specifically for space-constrained, power-aware applications where parallel flash is impractical.

FAQ

What is the package type and footprint of W25Q32DWZEIG?

W25Q32DWZEIG uses an 8-pin WSON package measuring 8 mm × 6 mm (package code ZE, JEDEC MO-241AC). It features an exposed thermal pad on the bottom (non-electrical) and is compatible with standard reflow profiles. This footprint differs from the smaller WSON-6x5mm (ZP) and SOIC-208 variants - PCB layout must match ZE mechanical dimensions and pad stack.

Does W25Q32DWZEIG support execute-in-place (XIP) operation?

Yes, W25Q32DWZEIG supports true XIP via Continuous Read Mode and Quad SPI/QPI interfaces. With as few as 8 clocks to initiate streaming and up to 416 MB/s effective bandwidth in QPI mode, it enables deterministic code execution directly from flash - eliminating RAM copy latency and reducing system BoM cost in microcontroller-based designs.

How is Quad SPI or QPI mode enabled on W25Q32DWZEIG?

Quad SPI and QPI modes require the non-volatile Quad Enable (QE) bit in Status Register-2 to be set to '1' using the Write Status Register (01h) instruction. Once enabled, /WP and /HOLD pins become IO2 and IO3. W25Q32DWZEIG defaults to Standard SPI mode at power-up; QPI activation further requires the Enable QPI (38h) command after QE is set.

What write protection mechanisms does W25Q32DWZEIG provide?

W25Q32DWZEIG provides layered write protection: hardware via /WP pin (active-low, disabled in Quad/QPI mode), software via status register bits (BP0–BP2, TB, SEC, CMP), and OTP lock for security registers. Protection can be applied to individual 4KB sectors or the entire array - enabling robust firmware update and parameter safeguarding.

Is W25Q32DWZEIG compatible with 3.3V SPI buses?

No, W25Q32DWZEIG operates exclusively at 1.7–1.95 V and is not 3.3V-tolerant. Direct connection to 3.3V SPI masters will damage the device. Level translation (e.g., TXS0108E or discrete MOSFET buffers) is mandatory when interfacing with 3.3V controllers - verify voltage thresholds and timing margins in translated signal paths.

W25Q32DWZEIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
32Mbit
Memory Organization:
4M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25Q32DWZEIG FAQ

1.How can I place an order for W25Q32DWZEIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q32DWZEIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q32DWZEIG reliable?

The price and inventory of W25Q32DWZEIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q32DWZEIG is usually 5 days.

3.What payment methods are accepted for W25Q32DWZEIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q32DWZEIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q32DWZEIG?

W25Q32DWZEIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q32DWZEIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q32DWZEIG?

For technical support, including W25Q32DWZEIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q32DWZEIG requirements.

6.How does Aetrix verify that W25Q32DWZEIG is sourced from the original manufacturer or authorized distributors?

All W25Q32DWZEIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q32DWZEIG meets industry standards.

7.What is the process for return or replacement of W25Q32DWZEIG?

All W25Q32DWZEIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q32DWZEIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q32DWZEIG part is unused and in its original packaging.

Return procedure for W25Q32DWZEIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q32DWZEIG Tags

  • W25Q32DWZEIG
  • W25Q32DWZEIG PDF
  • W25Q32DWZEIG Datasheet
  • W25Q32DWZEIG Specifications
  • W25Q32DWZEIG Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W25Q32DWZEIG
  • Buy W25Q32DWZEIG
  • W25Q32DWZEIG Price
  • W25Q32DWZEIG Distributor
  • W25Q32DWZEIG Supplier
  • W25Q32DWZEIG Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER