Winbond Electronics Corporation W25Q32FVTBIG
- Part No.:
- W25Q32FVTBIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25Q32FVTBIG.pdf
- Description:
- IC FLASH 32MBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W25Q32FVTBIG from Winbond is a 32M-bit (4MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, operating from 2.7V to 3.6V with 104MHz max clock, 4KB uniform sector erase, and 1µA typical power-down current. It enables XIP (execute-in-place) in embedded boot code storage, firmware update partitions, and parameter logging in space-constrained microcontroller systems.
For engineers reviewing the W25Q32FVTBIG datasheet, W25Q32FVTBIG pinout, W25Q32FVTBIG application, or W25Q32FVTBIG equivalent, key selection criteria include Quad Enable (QE) bit configuration, /HOLD vs /RESET pin behavior across package variants, 4KB sector granularity for data logging, and JEDEC SFDP register support for auto-configuration in modern bootloaders.
Technical Context
The W25Q32FVTBIG implements a flexible SPI command set with hardware- and software-controlled write protection, including volatile/non-volatile BP2–BP0 bits, TB/SEC/CMP bits, and three 256-byte OTP-locked security registers. Its architecture supports erase/program suspend/resume and continuous read mode with wrap lengths of 8/16/32/64 bytes.
QPI mode reduces instruction overhead via 2-clock-cycle opcodes and enables 416MHz equivalent throughput using IO0–IO3 bidirectional lines; QE bit (Status Register-2, bit 1) must be set non-volatily or volatily to enable Quad I/O operation, repurposing /WP and /HOLD pins as IO2 and IO3 respectively.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 M-bit (4 MB), organized as 16,384 × 256-byte pages |
| Interface Support | Standard SPI (4-wire), Dual SPI (2 I/O), Quad SPI (4 I/O), QPI (4 I/O + 2-cycle opcodes) |
| Max Clock Frequency | 104 MHz (SPI), enabling 208 MB/s dual-I/O and 416 MB/s quad-I/O effective throughput |
| Erase Granularity | Uniform 4 KB sectors (1,024 total), plus 32 KB and 64 KB blocks (64 total) |
| Write Endurance | 100,000 program/erase cycles per sector |
| Data Retention | 20 years at +25°C, verified per JEDEC JESD22-A117 |
| Power Supply | Single 2.7 V to 3.6 V supply; active current ≤4 mA, power-down current ≤1 µA (typ.) |
| Operating Temp | -40°C to +85°C industrial grade temperature range |
Pinout & Package
W25Q32FVTBIG is supplied in an 8-pin TFBGA 8×6-mm package (Package Code TB or TC, 24-ball array), with ball pitch 0.8 mm and body size 8.0 mm × 6.0 mm × 1.0 mm. Pin functions are defined per JEDEC MO-241AC standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B2 | CLK | Input: Serial clock for all SPI/QPI operations; timing-critical path requiring controlled impedance routing |
| B3 | GND | Ground reference for all I/O and core logic; requires low-inductance connection to PCB ground plane |
| B4 | VCC | Primary power supply (2.7–3.6 V); decoupling capacitor (100 nF ceramic) required within 5 mm |
| C2 | /CS | Active-low chip select; must transition high→low before each instruction; controls device enable and output tri-state |
| C4 | /WP (IO2) | Hardware write protect input (active low) in Standard/Dual SPI; becomes IO2 in Quad SPI when QE=1 |
| D2 | DO (IO1) | Serial data output (Standard SPI) or bidirectional I/O line 1 (Dual/Quad SPI/QPI) |
| D3 | DI (IO0) | Serial data input (Standard SPI) or bidirectional I/O line 0 (Dual/Quad SPI/QPI) |
| D4 | /HOLD or /RESET (IO3) | Hold input (active low) in Standard/Dual SPI; becomes IO3 in Quad SPI when QE=1; dedicated /RESET on SOIC-16 only |
Key Features
| Feature | Design Value |
|---|---|
| Quad Peripheral Interface (QPI) | Reduces instruction overhead to 2 clock cycles per opcode, enabling deterministic XIP latency and higher effective bandwidth than parallel flash |
| Continuous Read Mode | Supports 8/16/32/64-byte wrap; requires only 8 clocks to address memory after initial instruction, optimizing sequential access in boot loaders |
| Flexible Write Protection | Combines hardware /WP pin, volatile/non-volatile status register bits (BP2–BP0, TB, SEC, CMP), and individual sector lock/unlock commands |
| Security Registers | Three 256-byte OTP-lockable registers for secure key storage, firmware signature validation, or calibration data with write-protection granularity |
| JEDEC SFDP Support | Enables automatic configuration by host bootloader via Read SFDP Register (5Ah) instruction, eliminating hard-coded timing parameters |
| Unique 64-bit ID | Factory-programmed serial number accessible via Read Unique ID (4Bh), used for device authentication and traceability in production |
Applications
| Boot Code Storage | Firmware Update Partition |
|---|---|
|
Use Scenario: Storing primary bootloader and application firmware images for ARM Cortex-M or RISC-V microcontrollers. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability; provides deterministic read latency under QPI mode for fast startup. Use Value: Eliminates need for external RAM copy during boot; leverages 104MHz SPI clock and continuous read mode to achieve sub-100ms firmware load time. |
Use Scenario: Dedicated partition for over-the-air (OTA) firmware updates in IoT edge nodes with limited internal flash. IC Role / Device Role / Timing Role: Field-upgradable storage with atomic sector erase and program suspend/resume for fail-safe update rollback. Use Value: Enables safe dual-bank update scheme using 4KB sectors; 100K endurance ensures >5 years of daily updates at 20 cycles/year. |
| Parameter & Calibration Data | Secure Key Storage |
|
Use Scenario: Persistent storage of sensor calibration coefficients, motor tuning parameters, and user preferences in industrial HMIs. IC Role / Device Role / Timing Role: Low-power, byte-addressable non-volatile memory with hardware write protection against accidental overwrite. Use Value: /WP pin + BP bits prevent runtime corruption; 1µA power-down current extends battery life in always-on monitoring devices. |
Use Scenario: Secure storage of cryptographic keys, TLS certificates, and device identity tokens in payment terminals and medical devices. IC Role / Device Role / Timing Role: Tamper-resistant storage using OTP-locked security registers and unique 64-bit ID for device binding. Use Value: Three 256-byte security registers with independent OTP locks prevent key extraction; SFDP register enables secure boot chain verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L3233FZNI-10G | 32 M-bit, 104 MHz, SOIC-8 only; no QPI mode; lacks SFDP register and security registers | Suitable for cost-sensitive legacy designs without XIP or secure boot requirements | Select when QPI, SFDP, or security features are unnecessary and SOIC-8 footprint is mandatory |
| S25FL132K0XMFI010 | 32 M-bit, 80 MHz max clock; supports HyperBus interface (not SPI/QPI); includes ECC and configurable dummy cycles | Targeted at automotive infotainment where HyperBus integration and ECC are required | Choose only if HyperBus controller is present and ECC for bit-error resilience is critical |
Compared with MX25L3233FZNI-10G, W25Q32FVTBIG adds QPI, SFDP, and security registers for modern boot architectures; versus S25FL132K0XMFI010, it offers higher clock rate and SPI/QPI compatibility but lacks built-in ECC and HyperBus support.
Availability
W25Q32FVTBIG is available at Aetrix Electronics and suitable for industrial control HMI boot storage, IoT edge node firmware updates, and medical device parameter logging requiring stable component supply across multi-year production cycles.
Supply support for W25Q32FVTBIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including serial NOR/NAND flash, PSRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.
The W25Q series targets embedded systems requiring high-speed, low-power, and secure code/data storage; W25Q32FVTBIG specifically addresses demand for QPI-enabled XIP and field-upgradable firmware in compact form factors.
FAQ
What is the package type and footprint of W25Q32FVTBIG?
W25Q32FVTBIG uses an 8×6-mm TFBGA package with 24 balls (Package Code TB or TC, 5×5 or 6×4 ball array) and 0.8-mm pitch. It conforms to JEDEC MO-241AC and requires stencil-defined solder paste deposition for reliable reflow. The package supports automated optical inspection (AOI) due to exposed pad visibility.
How does the /HOLD pin function differ between Standard SPI and Quad SPI modes on W25Q32FVTBIG?
In Standard/Dual SPI mode, the /HOLD pin (ball D4) pauses ongoing read/write operations when pulled low while /CS is active; in Quad SPI mode, that same pin becomes IO3 and loses /HOLD functionality-hardware hold must instead be implemented via software polling of BUSY status. This behavior is controlled by the QE bit in Status Register-2.
Does W25Q32FVTBIG support execute-in-place (XIP) operation, and what conditions are required?
Yes, W25Q32FVTBIG supports true XIP via Continuous Read Mode and QPI interface. Required conditions: QE bit set in Status Register-2, host controller supporting QPI or Fast Read Quad I/O instructions (EBh), and proper timing setup per AC Electrical Characteristics table (tCH/tCL ≥5 ns, tSU ≥6 ns). No external buffer or RAM copy is needed for direct CPU instruction fetch.
What write protection mechanisms are available on W25Q32FVTBIG, and how are they configured?
W25Q32FVTBIG provides layered write protection: hardware /WP pin (active low), volatile/non-volatile status register bits (BP2–BP0, TB, SEC, CMP), and individual sector lock commands (36h/39h). Configuration is done via Write Status Register (01h/31h/11h) instructions; SRP0/SRP1 bits lock register writes until power cycle or reset.
Is the 64-bit Unique ID in W25Q32FVTBIG factory-programmed and readable without special voltage or timing?
Yes, the 64-bit Unique ID is factory-programmed into one-time-programmable (OTP) memory and is permanently fixed per unit. It is read using the standard Read Unique ID instruction (4Bh) at normal VCC (2.7–3.6 V) and SPI clock rates up to 50 MHz, with no special voltage sequencing or timing constraints beyond those specified in the AC Electrical Characteristics table.
W25Q32FVTBIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25Q32FVTBIG FAQ
1.How can I place an order for W25Q32FVTBIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q32FVTBIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q32FVTBIG reliable?
The price and inventory of W25Q32FVTBIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q32FVTBIG is usually 5 days.
3.What payment methods are accepted for W25Q32FVTBIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q32FVTBIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q32FVTBIG?
W25Q32FVTBIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q32FVTBIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q32FVTBIG?
For technical support, including W25Q32FVTBIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q32FVTBIG requirements.
6.How does Aetrix verify that W25Q32FVTBIG is sourced from the original manufacturer or authorized distributors?
All W25Q32FVTBIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q32FVTBIG meets industry standards.
7.What is the process for return or replacement of W25Q32FVTBIG?
All W25Q32FVTBIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q32FVTBIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q32FVTBIG part is unused and in its original packaging.
Return procedure for W25Q32FVTBIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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