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Winbond Electronics Corporation W25Q32FVTBJQ TR

Part No.:
W25Q32FVTBJQ TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25Q32FVTBJQ TR.pdf
Description:
IC FLASH 32MBIT SPI/QUAD 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,134

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Product details

Overview

W25Q32FVTBJQ TR from Winbond is a 32M-bit (4MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, operating at 2.7–3.6V with 104MHz max clock rate and 4KB uniform sector architecture. It delivers up to 50MB/s continuous read throughput and supports execute-in-place (XIP) for microcontroller code storage in space-constrained embedded systems.

For engineers reviewing the W25Q32FVTBJQ TR datasheet, W25Q32FVTBJQ TR pinout, W25Q32FVTBJQ TR application, or W25Q32FVTBJQ TR equivalent, key selection considerations include Quad Enable (QE) bit configuration, /HOLD vs /RESET pin behavior per package variant, 4KB sector granularity for firmware partitioning, and JEDEC SFDP register support for auto-configuration.

Technical Context

The W25Q32FVTBJQ TR implements a flexible SPI-compatible command set with hardware-controlled /WP and /HOLD pins active-low, and supports volatile/non-volatile status register bits including QE (Status Register-2, Bit 1), TB, BP2–BP0, and DRV0/DRV1 for output driver strength control. Its block diagram integrates a 256-byte page buffer, column/row decode logic, high-voltage generators, and three 256-byte security registers with OTP locks.

It enables true XIP via Continuous Read Mode (as few as 8 clocks overhead per 24-bit address) and QPI mode (2-clock instruction cycle), achieving 416MHz equivalent bandwidth in Quad I/O Fast Read. Erase/program suspend/resume functionality allows background operations without interrupting host communication.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 32 M-bit (4 MB) organized as 16,384 × 256-byte pages
Interface Modes Standard SPI (4-wire), Dual SPI (4-wire), Quad SPI (4-wire), QPI (6-wire); QE bit required for Quad I/O
Max Clock Frequency 104 MHz (SPI), enabling 208 MHz dual-I/O and 416 MHz quad-I/O effective data rates
Erase Granularity Uniform 4 KB sectors (1,024 total), 32 KB blocks (512), 64 KB blocks (64), and full chip erase
Write Endurance 100,000 program/erase cycles per sector, with >20-year data retention at +25°C
Power Supply Single 2.7 V to 3.6 V supply; typical active current 4 mA, power-down current <1 µA
Operating Temperature –40°C to +85°C industrial grade range

Pinout & Package

W25Q32FVTBJQ TR uses the 8-pin TFBGA 8x6-mm package (Package Code TB, 5×5 ball array). Pin functions are defined per JEDEC-standard ball layout with dedicated CLK, /CS, VCC, GND, and bidirectional IO0–IO3 signals.

Pin/Terminal Circuit Role Design Meaning
B2 CLK Serial clock input; rising edge triggers input sampling, falling edge triggers output valid timing
B3 GND Ground reference for all I/O and core logic; must be low-impedance connection
B4 VCC Primary power supply (2.7–3.6 V); decoupling capacitor required within 10 mm
C2 /CS Chip select input; low enables device and activates I/O drivers; high places DO/IOx in high-Z state
C4 /WP (IO2) Hardware write protect input (active-low); disabled when QE=1 (used as IO2 in Quad mode)
D2 DO (IO1) Data output in Standard/Dual SPI; bidirectional I/O1 in Dual/Quad modes; requires pull-up if shared bus
D3 DI (IO0) Data input in Standard SPI; bidirectional I/O0 in Dual/Quad modes; driven by host on rising CLK edge
D4 /HOLD or /RESET (IO3) Hold function active-low during /CS low; /RESET available only in 16-pin SOIC or when QE=0 in 8-pin packages

Key Features

Feature Design Value
Continuous Read Mode Enables XIP with ≤8-clock instruction overhead per 24-bit address, reducing CPU wait states
Quad Peripheral Interface (QPI) Reduces instruction overhead via 2-clock-cycle commands, improving throughput over standard SPI
Erase/Program Suspend & Resume Allows host to pause background erase/program operations and service higher-priority interrupts
64-bit Unique Serial Number Factory-programmed per-device ID for secure firmware binding and anti-cloning applications
JEDEC SFDP Register Standardized parameter table enabling automatic driver initialization without hard-coded timing values
Three 256-byte Security Registers OTP-lockable storage for keys, certificates, or calibration data with hardware-enforced access control

Applications

Industrial HMI Firmware Storage Automotive Telematics Boot Code

Use Scenario: Storing boot firmware and UI assets for programmable logic controllers with limited PCB real estate.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability, interfaced via Quad SPI to reduce pin count and improve boot speed.

Use Value: 4KB sector granularity enables independent firmware update of bootloader vs application partitions without erasing full image.

Use Scenario: Holding certified boot loader and OTA update staging area in vehicle infotainment ECUs.

IC Role / Device Role / Timing Role: Secure, AEC-Q100-aligned code storage with SFDP auto-configuration and security register protection.

Use Value: 100K endurance and 20-year retention ensure reliable operation across automotive lifecycle requirements.

IoT Edge Sensor Node Configuration Medical Diagnostic Device Parameter Tables

Use Scenario: Retaining calibrated sensor offsets, network credentials, and device-specific thresholds in battery-powered nodes.

IC Role / Device Role / Timing Role: Low-power parameter storage using <1µA power-down mode and hardware /WP protection against accidental writes.

Use Value: Uniform 4KB sectors allow atomic updates of configuration blocks without corrupting adjacent operational data.

Use Scenario: Storing FDA-compliant calibration coefficients, usage logs, and audit trails in portable ultrasound units.

IC Role / Device Role / Timing Role: Tamper-resistant data vault leveraging OTP-locked security registers and unique serial number binding.

Use Value: Three 256-byte security registers provide isolated, write-once storage for cryptographic keys and regulatory metadata.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L3233FZNI-10G 32M-bit, 104MHz max clock, same 8-pin TFBGA package but lacks QPI mode and SFDP register No QPI or SFDP support limits auto-configuration flexibility in complex SoC environments Select when QPI and SFDP are unnecessary and cost sensitivity outweighs feature parity
S25FL132K0XMFI010 32M-bit, 85MHz max clock, supports HyperBus interface (not SPI/QPI), different pinout and command set Requires HyperBus controller; incompatible with standard SPI host peripherals Choose only for designs already committed to Cypress HyperFlash ecosystem and higher bandwidth needs

Compared with MX25L3233FZNI-10G and S25FL132K0XMFI010, the W25Q32FVTBJQ TR provides broader interface compatibility (QPI + SFDP), higher clock rate, and finer 4KB sector control-making it optimal for new designs requiring XIP, field-upgradable firmware, and multi-vendor supply chain resilience.

Availability

W25Q32FVTBJQ TR is available at Aetrix Electronics and suitable for industrial HMI, automotive telematics, and IoT edge sensor node applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for W25Q32FVTBJQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer markets.

The W25Q32FV product line delivers high-performance, low-power serial NOR flash targeting code storage, XIP execution, and secure parameter retention in resource-constrained embedded systems.

FAQ

What package type does W25Q32FVTBJQ TR use?

W25Q32FVTBJQ TR uses an 8x6-mm TFBGA package with 5×5 ball array (Package Code TB). This compact footprint supports high-density PCB layouts while maintaining thermal performance and signal integrity for high-speed Quad SPI operation. The ball map includes dedicated CLK, /CS, VCC, GND, and bidirectional IO0–IO3 terminals, with no NC balls in this configuration.

Does W25Q32FVTBJQ TR support execute-in-place (XIP) operation?

Yes, W25Q32FVTBJQ TR supports true XIP via Continuous Read Mode, requiring as few as 8 clock cycles to initiate a read after address transmission. When used with Quad SPI Fast Read Quad I/O (EBh) or QPI instructions, it achieves up to 416MHz effective bandwidth-enabling direct code execution from flash without RAM shadowing in microcontrollers with appropriate bus controllers.

How is the /HOLD pin configured on W25Q32FVTBJQ TR?

On W25Q32FVTBJQ TR, the /HOLD function is implemented on Ball D4 and operates as an active-low input during /CS low. However, when the Quad Enable (QE) bit in Status Register-2 is set to '1', Ball D4 becomes IO3 for Quad SPI operation and /HOLD is disabled. Hardware reset is not available on this 8-pin TFBGA variant-only the 16-pin SOIC package includes a dedicated /RESET pin.

What security features does W25Q32FVTBJQ TR provide?

W25Q32FVTBJQ TR includes three 256-byte security registers with OTP lock bits, a factory-programmed 64-bit unique serial number, software/hardware write protection (via /WP pin and status register BP bits), and SFDP register for standardized parameter discovery. These features enable secure boot, firmware authentication, and tamper-resistant storage of calibration data or cryptographic keys.

Can W25Q32FVTBJQ TR be used in automotive applications?

W25Q32FVTBJQ TR operates across –40°C to +85°C and meets industrial reliability standards (100K erase/program cycles, >20-year data retention), making it suitable for under-hood and cabin automotive subsystems such as telematics gateways and ADAS sensor modules. While not AEC-Q100 qualified itself, it is widely deployed in automotive designs where full qualification is managed at the module level.

W25Q32FVTBJQ TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
32Mbit
Memory Organization:
4M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (8x6)

W25Q32FVTBJQ TR FAQ

1.How can I place an order for W25Q32FVTBJQ TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q32FVTBJQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q32FVTBJQ TR reliable?

The price and inventory of W25Q32FVTBJQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q32FVTBJQ TR is usually 5 days.

3.What payment methods are accepted for W25Q32FVTBJQ TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q32FVTBJQ TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q32FVTBJQ TR?

W25Q32FVTBJQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q32FVTBJQ TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q32FVTBJQ TR?

For technical support, including W25Q32FVTBJQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q32FVTBJQ TR requirements.

6.How does Aetrix verify that W25Q32FVTBJQ TR is sourced from the original manufacturer or authorized distributors?

All W25Q32FVTBJQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q32FVTBJQ TR meets industry standards.

7.What is the process for return or replacement of W25Q32FVTBJQ TR?

All W25Q32FVTBJQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q32FVTBJQ TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q32FVTBJQ TR part is unused and in its original packaging.

Return procedure for W25Q32FVTBJQ TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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