Winbond Electronics Corporation W25Q32FVTCIG
- Part No.:
- W25Q32FVTCIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25Q32FVTCIG.pdf
- Description:
- IC FLASH 32MBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W25Q32FVTCIG from Winbond is a 32M-bit (4MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, operating from 2.7V to 3.6V with 104MHz max clock rate, 4KB uniform sector architecture, and integrated hardware write protection via /WP and /HOLD pins. It enables XIP (execute-in-place) in embedded microcontrollers for code storage and firmware updates in space-constrained IoT edge nodes.
For engineers reviewing the W25Q32FVTCIG datasheet, W25Q32FVTCIG pinout, W25Q32FVTCIG application, or W25Q32FVTCIG equivalent, key selection criteria include Quad SPI timing compliance, 4KB sector erase granularity, JEDEC ID/SFDP register support, and /RESET pin availability in TFBGA vs SOIC variants - all confirmed for this specific TCIG marking.
Technical Context
The W25Q32FVTCIG implements a unified SPI/QPI command set with configurable I/O modes: Standard SPI uses DI/DO unidirectionally; Dual/Quad SPI repurposes /WP and /HOLD as IO2/IO3 when the non-volatile Quad Enable (QE) bit in Status Register-2 is set. Its block diagram integrates a 256-byte page buffer, column/row decode logic, high-voltage generators, and three 256-byte security registers with OTP locks.
Functional operation includes hardware reset via dedicated /RESET pin (in 16-pin SOIC) or shared IO3 (in 8-pin packages, configurable via HOLD/RST bit), plus suspend/resume for erase/program operations. The device supports continuous read mode with ≤8-clock instruction overhead and wrap lengths of 8/16/32/64 bytes - enabling deterministic latency for real-time firmware fetch.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 M-bit (4 MB) organized as 16,384 × 256-byte pages |
| Interface Modes | Standard SPI (4-wire), Dual SPI (4-wire), Quad SPI (4-wire), QPI (6-wire); QE bit controls IO2/IO3 remapping |
| Max Clock Frequency | 104 MHz (SPI), enabling 208 MB/s dual-I/O and 416 MB/s quad-I/O effective throughput |
| Erase Granularity | Uniform 4 KB sectors (1,024 total), 32 KB blocks (128), 64 KB blocks (64), and full-chip erase |
| Write Endurance | ≥100,000 program/erase cycles per sector, ensuring field-upgrade reliability in firmware storage |
| Data Retention | ≥20 years at +25°C, validated for long-life industrial deployments without refresh |
| Operating Voltage | 2.7 V to 3.6 V single supply - compatible with 3.3 V LDOs and avoids level-shifting in MCU designs |
| Power Consumption | 4 mA active current (typ.), <1 µA power-down current (typ.) - critical for battery-powered edge sensors |
Pinout & Package
W25Q32FVTCIG is supplied in an 8-pin TFBGA package (8x6-mm, 24-ball array, Package Code TC), with ball pitch of 0.8 mm and moisture sensitivity level (MSL) 3. Pin functions are defined per JEDEC-standard ball map and match the 8-pin SOIC/VSOP/WSON functional assignment where applicable.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B2 | CLK | Serial clock input; rising-edge sampled for instruction/address/data input, falling-edge for output - defines maximum 104 MHz timing budget |
| B3 | GND | Digital ground reference; must be low-impedance and decoupled near VCC pin to suppress switching noise during fast reads |
| B4 | VCC | 2.7–3.6 V power supply; requires ≥1 µF ceramic decoupling capacitor placed within 5 mm of ball for stable core voltage |
| C2 | /CS | Chip select input; active-low enable; must transition high→low before each instruction; high-impedance DO state when deasserted |
| C4 | /WP (IO2) | Hardware write protect input (active-low); disabled in Quad SPI mode when QE=1 - used with BP bits for sector-level lock |
| D2 | DO (IO1) | Data output (or bidirectional IO1); carries status, ID, or memory data; high-impedance when /CS high or /HOLD asserted |
| D3 | DI (IO0) | Data input (or bidirectional IO0); receives instructions, addresses, and program data; sampled on CLK rising edge |
| D4 | /HOLD or /RESET (IO3) | Hold/resume control (active-low); in 8-pin packages, function depends on HOLD/RST bit; not available in QPI mode - pauses ongoing transfers without deselecting |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode | Enables true XIP with ≤8-clock instruction overhead and configurable 8/16/32/64-byte wrap - eliminates address retransmission for sequential code fetch |
| Quad Peripheral Interface (QPI) | Reduces instruction overhead by encoding commands in 2-clock cycles; supports 416 MB/s effective bandwidth - outperforms parallel x16 flash in pin-count-constrained designs |
| Erase/Program Suspend & Resume | Allows background interrupt handling during long erase cycles (e.g., 64KB block erase ~200 ms); resumes from exact byte offset - essential for real-time OS integration |
| Security Registers | Three 256-byte OTP-lockable registers store cryptographic keys or calibration data; protected by LB1–LB3 bits - prevents unauthorized readback even after power cycle |
| JEDEC SFDP & Unique ID | 64-bit factory-programmed serial number and discoverable SFDP register enable automated BOM validation and secure device identity binding in production test |
| Flexible Write Protection | Combines hardware (/WP pin) and software (BP0–BP2, TB, SEC, CMP bits) controls for top/bottom/complement sector locking - supports dual-bank firmware update schemes |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Image |
|---|---|
|
Use Scenario: Storing boot firmware and configuration parameters in programmable logic controllers deployed in factory automation environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Primary non-volatile code storage device interfaced directly to ARM Cortex-M7 MCU via Quad SPI; provides deterministic 4KB sector erase for safe over-the-air updates. Use Value: 20-year data retention and -40°C to +85°C operation ensure firmware integrity across 15+ year equipment lifecycles without refresh; /WP pin prevents accidental corruption during brown-out events. |
Use Scenario: Holding boot images and sensor calibration data for automotive camera modules requiring ASIL-B compliant firmware loading at startup. IC Role / Device Role / Timing Role: Secondary boot memory accessed by SoC's ROM bootloader via QPI interface; delivers 416 MB/s burst reads to meet <500 ms cold-boot timing requirements. Use Value: SFDP register enables automatic configuration of timing parameters per host SoC; unique 64-bit ID supports traceability and anti-counterfeit verification in Tier-1 supply chain. |
| Medical Wearable Sensor Logging | Smart Home Gateway OTA Storage |
|
Use Scenario: Capturing and retaining physiological sensor logs in battery-powered wearable patches with strict power budgets and limited PCB area. IC Role / Device Role / Timing Role: Data logger memory interfaced to ultra-low-power MCU via Standard SPI; leverages 1 µA power-down mode between 10-second sampling intervals. Use Value: 4KB sector granularity allows efficient logging without erasing unrelated calibration data; security registers store encryption keys isolated from user-accessible memory space. |
Use Scenario: Hosting downloadable firmware images and configuration profiles in Wi-Fi/BLE gateways that perform remote updates for connected lighting and HVAC subsystems. IC Role / Device Role / Timing Role: Dual-bank update storage accessed via Dual SPI; one bank active while the other receives OTA payload, enabling atomic firmware swaps. Use Value: Erase/program suspend allows interruption of 64KB block erase during network packet loss recovery; /HOLD pin maintains bus ownership during MCU context switches. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L3233FZNI-10G | 32 M-bit, 104 MHz max clock, but lacks QPI mode and SFDP register; uses different security register layout | No QPI support limits bandwidth in high-throughput boot scenarios; no SFDP requires hard-coded timing parameters | Select when QPI and SFDP are unused and cost sensitivity outweighs future-proofing needs |
| S25FL132K0XMFI010 | 32 M-bit, 80 MHz max clock, supports Octal DTR mode (not QPI); includes hardware ECC and configurable dummy cycles | Lower bandwidth than W25Q32FVTCIG in Quad SPI mode; ECC improves reliability in high-radiation environments | Prefer for aerospace or medical systems requiring error correction, accepting 23% lower peak throughput |
Compared with MX25L3233FZNI-10G and S25FL132K0XMFI010, the W25Q32FVTCIG delivers superior bandwidth via QPI and automated configuration via SFDP - making it optimal for consumer and industrial designs prioritizing boot speed and design reuse across multiple host platforms.
Availability
W25Q32FVTCIG is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot image hosting, medical wearable sensor logging, smart home gateway OTA storage, and embedded MCU code shadowing requiring stable component supply across multi-year production cycles.
Supply support for W25Q32FVTCIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.
The W25Q series was designed specifically for embedded systems requiring high-speed, low-pin-count non-volatile storage - balancing density, endurance, and interface flexibility for MCU-based code execution and data logging.
FAQ
What is the package type and footprint of the W25Q32FVTCIG?
The W25Q32FVTCIG uses an 8x6-mm 24-ball TFBGA package (Package Code TC) with 0.8 mm ball pitch and MSL3 rating. Its footprint matches JEDEC MO-249 standards and is pin-compatible with other Winbond W25Q32FV variants in the same TFBGA family, including ZP/ZE WSON and SS/ST SOIC packages at the signal level - though ball-to-pad mapping differs.
Does the W25Q32FVTCIG support Quad SPI and QPI modes simultaneously?
No - the W25Q32FVTCIG supports either Quad SPI or QPI mode, selected via the Enter QPI Mode (38h) instruction. In QPI mode, all six signals (CLK, /CS, IO0–IO3) operate in bidirectional mode with 2-clock-cycle command encoding. Quad SPI remains available only when QPI is disabled (via FFh exit command), using IO0–IO3 with standard SPI timing.
How is hardware write protection implemented on the W25Q32FVTCIG?
The W25Q32FVTCIG implements hardware write protection through the active-low /WP pin (Ball C4), which - when held low - prevents writes to the status register regardless of software enable state. This works in conjunction with volatile/non-volatile BP0–BP2, TB, SEC, and CMP bits to lock sectors or blocks. Note: /WP is disabled in QPI mode when the QE bit is set.
Can the W25Q32FVTCIG be used for execute-in-place (XIP) applications?
Yes - the W25Q32FVTCIG supports true XIP via Continuous Read Mode with ≤8-clock instruction overhead and configurable wrap lengths (8/16/32/64 bytes). When paired with a host MCU supporting Quad SPI or QPI prefetch, it delivers deterministic access latency suitable for direct code execution without RAM shadowing - validated in Cortex-M and RISC-V boot loaders.
What is the purpose of the three security registers in the W25Q32FVTCIG?
The W25Q32FVTCIG includes three 256-byte security registers (SR1–SR3) with one-time-programmable (OTP) lock bits (LB1–LB3). Once locked, their contents cannot be read or modified - making them ideal for storing cryptographic keys, calibration coefficients, or device-specific credentials. Access requires dedicated Program/Read/Erase Security Register instructions (42h/48h/44h).
W25Q32FVTCIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25Q32FVTCIG FAQ
1.How can I place an order for W25Q32FVTCIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q32FVTCIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q32FVTCIG reliable?
The price and inventory of W25Q32FVTCIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q32FVTCIG is usually 5 days.
3.What payment methods are accepted for W25Q32FVTCIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q32FVTCIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q32FVTCIG?
W25Q32FVTCIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q32FVTCIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q32FVTCIG?
For technical support, including W25Q32FVTCIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q32FVTCIG requirements.
6.How does Aetrix verify that W25Q32FVTCIG is sourced from the original manufacturer or authorized distributors?
All W25Q32FVTCIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q32FVTCIG meets industry standards.
7.What is the process for return or replacement of W25Q32FVTCIG?
All W25Q32FVTCIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q32FVTCIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q32FVTCIG part is unused and in its original packaging.
Return procedure for W25Q32FVTCIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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