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Winbond Electronics Corporation W25Q32FVTCJQ TR
- Part No.:
- W25Q32FVTCJQ TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25Q32FVTCJQ TR.pdf
- Description:
- IC FLASH 32MBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,956
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Product details
Overview
W25Q32FVTCJQ TR from Winbond is a 32M-bit (4MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, operating at up to 104 MHz clock frequency with 50 MB/s continuous read throughput. It features uniform 4KB sector erase, 32KB/64KB block erase, and chip erase capabilities, with 1,024 erasable sectors and 64 erasable blocks. Designed for code storage and execute-in-place (XIP) in space-constrained embedded systems, it delivers true XIP operation via Continuous Read Mode with ≤8-clock instruction overhead.
For engineers reviewing the W25Q32FVTCJQ TR datasheet, W25Q32FVTCJQ TR pinout, W25Q32FVTCJQ TR application, or W25Q32FVTCJQ TR equivalent, key selection considerations include Quad Enable (QE) bit configuration for IO2/IO3 remapping, /HOLD vs /RESET functionality per package variant, JEDEC ID and SFDP register support for auto-configuration, and hardware write protection using /WP and status register bits BP2–BP0, TB, and SEC.
Technical Context
The W25Q32FVTCJQ TR implements a flexible SPI-compatible command architecture with three operational modes: Standard SPI (4-wire), Dual SPI (4-wire with bidirectional IO0/IO1), and Quad SPI/QPI (6-wire with IO0–IO3). Its internal block diagram integrates a 256-byte page buffer, column/row decode logic, high-voltage generators for erase/program, and three 256-byte security registers with OTP locks.
Functional behavior depends critically on volatile/non-volatile status register bits: QE (Status Register-2, bit 1) enables Quad I/O mode and repurposes /WP and /HOLD as IO2 and IO3; HOLD/RST (Status Register-3, bit 7) selects between /HOLD and /RESET function on 8-pin packages; SRP0/SRP1 control write protection of status register bits. The device supports software reset (66h+99h) and hardware reset via dedicated /RESET pin only on SOIC-16 (SF) packages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 M-bit (4,194,304 bytes), organized as 16,384 × 256-byte programmable pages |
| Interface Support | Standard SPI (CLK, /CS, DI, DO, /WP, /HOLD), Dual/Quad SPI, and QPI (all with same 6-pin physical interface when QE=1) |
| Max Clock Frequency | 104 MHz for Standard/Dual/Quad SPI; enables 208 MHz (Dual I/O) or 416 MHz (Quad I/O) effective data rates |
| Erase Granularity | 4 KB sector (1,024 sectors), 32 KB block (128 blocks), 64 KB block (64 blocks), and full-chip erase |
| Write Endurance & Retention | ≥100,000 program/erase cycles per sector; ≥20 years data retention at +25°C |
| Supply Voltage | 2.7 V to 3.6 V single supply; active current ≤4 mA typical, power-down current ≤1 µA typical |
| Operating Temperature | –40°C to +85°C industrial grade range; validated across full voltage and temperature envelope |
Pinout & Package
W25Q32FVTCJQ TR uses the 8-pin TFBGA 8x6-mm package with 6x4 ball array (Package Code TC), pin-compatible with WSON 8x6-mm (ZE) and SOIC 208-mil (SS) footprints in layout-constrained designs. Ball assignments are fixed and non-reconfigurable.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B2 | CLK | Input: Serial clock timing reference for all SPI/QPI operations; must meet tCH/tCL min/max specs per AC table |
| B3 | GND | Ground reference for all I/O and core logic; requires low-impedance connection to system ground plane |
| B4 | VCC | Power supply input (2.7–3.6 V); decoupling capacitor (0.1 µF ceramic) required within 5 mm |
| C2 | /CS | Input: Active-low chip select; must transition high→low before first instruction; controls DO high-impedance state |
| C4 | /WP (IO2) | I/O: Hardware write protect input (active low) in Standard/Dual SPI; becomes IO2 in Quad SPI when QE=1 |
| D2 | DO (IO1) | I/O: Data output in Standard SPI; bidirectional data I/O1 in Dual/Quad SPI and QPI modes |
| D3 | DI (IO0) | I/O: Data input in Standard SPI; bidirectional data I/O0 in Dual/Quad SPI and QPI modes |
| D4 | /HOLD or /RESET (IO3) | I/O: Hold input (active low) in Standard/Dual SPI; becomes IO3 in Quad SPI when QE=1; not functional as /RESET in 8-pin packages |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode | Enables true XIP with ≤8-clock instruction overhead to address any 24-bit location; eliminates external address latches |
| Quad Peripheral Interface (QPI) | Reduces instruction overhead via 2-clock-cycle opcodes; supports full-duplex 4-bit-wide transfers without mode switching |
| Flexible Memory Protection | Hardware /WP pin + software-configurable status register bits (BP2–BP0, TB, SEC, CMP) enable sector-level lock/unlock |
| Security Registers | Three 256-byte OTP-lockable security registers for firmware keys, calibration data, or secure boot assets |
| JEDEC & SFDP Compliance | Supports standard Manufacturer ID (EFh), Device ID (4016h), and SFDP v1.5 register for automatic driver initialization |
Applications
| IoT Edge Node Firmware Storage | Industrial HMI Code Execution |
|---|---|
|
Use Scenario: Storing bootloader, RTOS image, and OTA update partitions in battery-powered sensor nodes with strict PCB area limits. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability; provides deterministic 104 MHz SPI read latency for real-time task startup. Use Value: Eliminates need for parallel NOR flash or external RAM shadowing; reduces BOM count by 2 components and saves ≥120 mm² PCB area. |
Use Scenario: Hosting GUI assets, localized language strings, and application logic in panel-mounted HMIs deployed in factory automation environments. IC Role / Device Role / Timing Role: High-reliability code/data repository supporting dual-bank updates and secure firmware rollback. Use Value: 100K-cycle endurance ensures >10-year field life under daily firmware patching; hardware /WP + status register protection prevents accidental corruption during ESD events. |
| Automotive ADAS Boot Image | Medical Diagnostic Device Configuration |
|
Use Scenario: Storing safety-critical boot firmware and sensor calibration tables in automotive camera modules requiring AEC-Q100 Grade 3 compliance. IC Role / Device Role / Timing Role: Certified code storage element with guaranteed -40°C to +85°C operation and 20-year data retention. Use Value: Meets ISO 26262 ASIL-B requirements via deterministic erase/write timing, status register error flags, and SFDP-defined parameter tables. |
Use Scenario: Holding patient-specific calibration profiles, regulatory audit logs, and UI theme assets in portable ultrasound and ECG devices. IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration store leveraging 3×256-byte OTP-locked security registers. Use Value: Enables HIPAA-compliant data isolation: calibration data encrypted in Security Register 1, audit logs in Register 2, UI assets in Register 3 - each independently lockable. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L3233FZC-12G | 32 M-bit, 133 MHz max clock, supports DTR mode; no QPI; different SFDP layout and security register map | Lacks QPI and Continuous Read Mode; requires modified driver stack for DTR timing and status register access | Prefer when higher clock rate is critical and QPI/XIP are unused; verify SFDP parser compatibility |
| S25FL132K0XMFI010 | 32 M-bit, 80 MHz max clock, HyperBus interface option; includes built-in ECC; different pinout (16-pin SOIC only) | Requires HyperBus controller or SPI-to-HyperBus bridge; larger footprint; ECC adds latency but improves reliability | Choose when system already uses HyperBus or requires on-die ECC for medical/automotive safety certification |
Compared with MX25L3233FZC-12G and S25FL132K0XMFI010, the W25Q32FVTCJQ TR uniquely balances QPI-enabled XIP performance, 4KB sector flexibility, and compact TFBGA packaging-making it optimal for cost-sensitive, space-constrained embedded designs requiring field-upgradable firmware without controller-level protocol changes.
Availability
W25Q32FVTCJQ TR is available at Aetrix Electronics and suitable for IoT edge node firmware storage, industrial HMI code execution, automotive ADAS boot image hosting, and medical diagnostic device configuration requiring stable component supply across extended product lifecycles.
Supply support for W25Q32FVTCJQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for consumer, industrial, and automotive markets.
The W25Q series targets high-performance, low-power embedded systems requiring reliable code storage and execute-in-place capability-designed specifically to replace parallel NOR flash while minimizing PCB area and controller complexity.
FAQ
What is the package type and footprint compatibility of W25Q32FVTCJQ TR?
W25Q32FVTCJQ TR uses an 8x6-mm TFBGA package with 6x4 ball array (Package Code TC). It shares identical pad layout and thermal profile with Winbond's WSON 8x6-mm (ZE) and SOIC 208-mil (SS) variants, enabling direct PCB footprint reuse across form factors without redesign. Ball pitch is 0.8 mm, and solder mask defined pads require IPC-7351B Class L land pattern.
How does the Quad Enable (QE) bit affect pin functionality on W25Q32FVTCJQ TR?
The QE bit (Status Register-2, bit 1) must be set to '1' to activate Quad SPI or QPI modes. When QE=1, the /WP pin becomes IO2 and /HOLD pin becomes IO3-disabling hardware write protection and hold functions. This remapping is non-volatile if written to non-volatile bits, and QE can be toggled in-system via Write Status Register-2 (31h) instruction. W25Q32FVTCJQ TR defaults to QE=0 after power-up.
Does W25Q32FVTCJQ TR support hardware reset, and how is it implemented?
W25Q32FVTCJQ TR does not provide a dedicated /RESET pin-it uses the /HOLD pin (D4) for reset functionality only when configured via the HOLD/RST bit (Status Register-3, bit 7) in 8-pin packages. However, this shared pin cannot assert reset while in Quad SPI mode (QE=1). For guaranteed hardware reset, Winbond recommends the 16-pin SOIC variant (W25Q32FVSIQ), which includes a separate /RESET pin independent of QE settings.
What security features are implemented in W25Q32FVTCJQ TR beyond basic write protection?
W25Q32FVTCJQ TR includes three 256-byte security registers with one-time-programmable (OTP) lock bits (LB1–LB3), a 64-bit unique serial number per die, JEDEC-standard SFDP register for parameter discovery, and individual sector/block lock/unlock commands (36h/39h/7Eh/98h). Unlike basic /WP pin protection, these features enable cryptographic key storage, secure boot chain validation, and field-upgradeable asset encryption-all enforced at the silicon level without host CPU intervention.
Can W25Q32FVTCJQ TR be used for Execute-in-Place (XIP) applications, and what conditions must be met?
Yes, W25Q32FVTCJQ TR supports true XIP via Continuous Read Mode, which minimizes instruction overhead to ≤8 clocks per 24-bit address fetch. To enable XIP, the host controller must issue Set Burst with Wrap (77h) or Fast Read Quad I/O (EBh) instructions, configure QE=1 for maximum bandwidth, and ensure CLK stability within ±1% jitter. W25Q32FVTCJQ TR's 104 MHz max clock and 416 MHz effective Quad I/O rate deliver deterministic latency comparable to parallel NOR flash.
W25Q32FVTCJQ TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25Q32FVTCJQ TR FAQ
1.How can I place an order for W25Q32FVTCJQ TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q32FVTCJQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q32FVTCJQ TR reliable?
The price and inventory of W25Q32FVTCJQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q32FVTCJQ TR is usually 5 days.
3.What payment methods are accepted for W25Q32FVTCJQ TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q32FVTCJQ TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q32FVTCJQ TR?
W25Q32FVTCJQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q32FVTCJQ TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q32FVTCJQ TR?
For technical support, including W25Q32FVTCJQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q32FVTCJQ TR requirements.
6.How does Aetrix verify that W25Q32FVTCJQ TR is sourced from the original manufacturer or authorized distributors?
All W25Q32FVTCJQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q32FVTCJQ TR meets industry standards.
7.What is the process for return or replacement of W25Q32FVTCJQ TR?
All W25Q32FVTCJQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q32FVTCJQ TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q32FVTCJQ TR part is unused and in its original packaging.
Return procedure for W25Q32FVTCJQ TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25Q32FVTCJQ TR Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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