My Inquiry
My Account
Winbond Electronics Corporation W25Q32FVZPJF TR
- Part No.:
- W25Q32FVZPJF TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q32FVZPJF TR.pdf
- Description:
- IC FLASH 32MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,909
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W25Q32FVZPJF TR from Winbond is a 32M-bit (4MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces, operating from 2.7V to 3.6V with 104MHz max clock rate, 4KB uniform sector architecture, and integrated hardware write protection via /WP and /HOLD pins - deployed in embedded boot code storage, firmware update partitions, and XIP-capable microcontroller systems.
For engineers reviewing the W25Q32FVZPJF TR datasheet, W25Q32FVZPJF TR pinout, W25Q32FVZPJF TR application, or W25Q32FVZPJF TR equivalent, key selection criteria include Quad Enable (QE) bit configuration for IO2/IO3 remapping, 4KB sector granularity for parameter storage, continuous read mode timing (8-clock address overhead), and TFBGA-24 vs. SOIC-8 package compatibility in space-constrained PCB layouts.
Technical Context
The W25Q32FVZPJF TR implements a multi-mode serial interface: Standard SPI uses DI/DO unidirectionally; Dual/Quad SPI repurposes all four IOx pins bidirectionally when QE=1; QPI enables 4-bit instruction/data transfers per clock cycle, reducing command overhead. Its status register includes volatile/non-volatile BP2–BP0, TB, SEC, CMP, SRP0/SRP1, and QE bits controlling memory protection and interface mode.
Internally, the device organizes 16,384 × 256-byte pages into 1,024 erasable 4KB sectors and 64 erasable 64KB blocks. Erase/program suspend/resume functionality enables concurrent background operations, while SFDP register (read via 5Ah) provides JEDEC-standardized configurable parameters for automated initialization in host controllers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 M-bit (4 MB) - supports full firmware images for mid-tier MCUs without external memory expansion. |
| Interface Modes | Standard/Dual/Quad SPI & QPI - QPI reduces instruction latency by enabling 4-bit parallel command/data transfer per clock edge. |
| Max Clock Frequency | 104 MHz (SPI), 208 MHz equiv. (Dual I/O), 416 MHz equiv. (Quad I/O) - enables 50 MB/s continuous read throughput for real-time XIP execution. |
| Erase Granularity | 4 KB sectors, 32 KB blocks, 64 KB blocks, full chip - allows fine-grained firmware patching and secure parameter partitioning. |
| Write Endurance | 100,000 program/erase cycles - ensures reliable field updates over product lifetime in industrial control applications. |
| Data Retention | 20 years at +85°C - validated retention for automotive and industrial deployments requiring long-term data integrity. |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3 V logic domains and tolerant of brown-out conditions down to 2.7 V. |
| Active/Power-down Current | 4 mA typical active, <1 µA typical power-down - minimizes quiescent power in battery-backed or energy-harvesting systems. |
Pinout & Package
W25Q32FVZPJF TR is supplied in an 8-pin WSON 6×5-mm package (JEDEC MO-252, package code ZP), with exposed pad for thermal dissipation. Pin 1 is /CS; pins 2–3 and 5–8 are bidirectional IOx pins; pin 4 is GND; pin 6 is CLK; pin 8 is VCC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable: high = high-Z outputs and standby current; low = active communication and increased power draw. |
| 2 DO (IO1) | Data Output / Bidirectional I/O | Serial data output in Standard SPI; bidirectional data lane in Dual/Quad SPI/QPI; requires QE=1 for Quad use. |
| 3 /WP (IO2) | Write Protect Input / Bidirectional I/O | Hardware lock for status register writes when active low; becomes IO2 in Quad mode (QE=1); not available in QPI. |
| 4 GND | Ground Reference | Primary return path for VCC and signal currents; must be low-impedance connection to avoid noise coupling into SPI lines. |
| 5 DI (IO0) | Data Input / Bidirectional I/O | Serial data input in Standard SPI; bidirectional data lane in Dual/Quad SPI/QPI; required for all instruction transfers. |
| 6 CLK | Serial Clock Input | Edge-triggered timing reference: rising edge for input sampling, falling edge for output valid; max 104 MHz. |
| 7 /HOLD (IO3) | Hold Input / Bidirectional I/O | Pauses ongoing SPI transaction when low; becomes IO3 in Quad mode (QE=1); not functional in QPI mode. |
| 8 VCC | Power Supply | 2.7–3.6 V supply; decoupling capacitor (0.1 µF ceramic) required within 5 mm of pin for stable operation. |
Key Features
| Feature | Design Value |
|---|---|
| Quad Peripheral Interface (QPI) | Reduces instruction overhead to one 4-bit cycle per command, enabling deterministic latency for time-critical boot sequences. |
| Continuous Read Mode | Supports wrap lengths of 8/16/32/64 bytes with only 8 clocks to address first byte - essential for efficient XIP execution from flash. |
| Erase/Program Suspend & Resume | Allows interruption of long erase/program operations to service higher-priority reads, improving system responsiveness. |
| 64-bit Unique ID | Factory-programmed per-device serial number accessible via 4Bh instruction - enables secure device binding and firmware licensing. |
| Security Registers | Three 256-byte OTP-lockable registers for cryptographic keys or calibration data - protected against accidental overwrite or readout. |
| SFDP Register | JEDEC JESD216-compliant parameter table (read via 5Ah) - enables automatic host controller configuration without hard-coded timing values. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Image |
|---|---|
|
Use Scenario: Storing firmware images and configuration tables in programmable logic controllers with field-upgrade capability and EMI-hardened PCB layout. IC Role / Device Role / Timing Role: Non-volatile boot memory mapped via SPI bus; delivers verified code to ARM Cortex-M7 during cold start with <100 ms latency. Use Value: 4KB sector erase enables incremental firmware patches without full reflash; 20-year retention ensures reliability across 15-year product lifecycle. |
Use Scenario: Hosting boot loader and safety-critical sensor fusion firmware in automotive camera modules compliant with ISO 26262 ASIL-B requirements. IC Role / Device Role / Timing Role: Primary XIP-executable flash for Renesas R-Car H3; supports dual-bank swapping for atomic firmware updates. Use Value: QPI mode achieves 416 MHz effective bandwidth for zero-wait-state instruction fetch; SFDP auto-configuration simplifies qualification across vehicle variants. |
| Medical IoT Sensor Calibration Data | Consumer Router Configuration Partition |
|
Use Scenario: Storing factory-calibrated ADC offset/gain coefficients and patient-specific thresholds in portable ECG monitors with battery backup. IC Role / Device Role / Timing Role: Parameter storage partition accessed via SPI during device initialization; isolated from main firmware using BP bits. Use Value: Individual sector lock (36h/39h) prevents runtime corruption; 100K-cycle endurance supports recalibration every 6 months over 10 years. |
Use Scenario: Holding Wi-Fi credentials, UI language packs, and regulatory region settings in residential broadband gateways with frequent OTA updates. IC Role / Device Role / Timing Role: Dedicated configuration flash accessed concurrently with main application flash via separate /CS line. Use Value: /WP pin hardware lock prevents accidental overwrite during power glitches; 4KB sectors align with typical config blob size (2–8 KB). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L3233FZNI-10G | 32 M-bit, 104 MHz max, SOIC-8 only; no QPI mode; lacks SFDP register and 64-bit UID. | Lower-cost replacement where QPI/XIP and unique ID are unnecessary; requires software-level timing tuning. | Select when board uses SOIC-8 footprint and host controller does not require JEDEC-standardized auto-configuration. |
| S25FL132K0XMFI010 | 32 M-bit, 80 MHz max, supports HyperBus but not QPI; includes on-die ECC; different security register structure. | Better suited for high-reliability applications needing error correction; incompatible pinout and command set for drop-in replacement. | Choose only if migrating to Cypress/Infineon ecosystem and requiring ECC for extended data integrity in harsh environments. |
Compared with MX25L3233FZNI-10G and S25FL132K0XMFI010, the W25Q32FVZPJF TR uniquely combines QPI mode, SFDP support, and 64-bit UID in a WSON-8 package - making it optimal for XIP-capable designs requiring automated initialization and device identity binding.
Availability
W25Q32FVZPJF TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot image hosting, and medical IoT sensor calibration data retention requiring stable component supply across multi-year production programs.
Supply support for W25Q32FVZPJF TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer markets.
The W25Q32FV series belongs to Winbond's SpiFlash family, designed specifically for high-speed, low-power, and secure code and data storage in resource-constrained microcontroller-based systems.
FAQ
What is the package type and footprint compatibility of the W25Q32FVZPJF TR?
The W25Q32FVZPJF TR uses an 8-pin WSON 6×5-mm package (JEDEC MO-252, code ZP) with exposed thermal pad. It shares pinout compatibility with other W25Q32FV variants in SOIC-8, VSOP-8, and PDIP-8 packages but differs from TFBGA-24 and SOIC-16 versions. PCB layout must accommodate the 0.5 mm pitch and thermal pad solder stencil design per Winbond's AN-1017 guidelines.
How does the Quad Enable (QE) bit affect pin functionality on the W25Q32FVZPJF TR?
The QE bit (bit 1 of Status Register-2) controls whether pins 3 (/WP) and 7 (/HOLD) operate as hardware protection inputs or as IO2/IO3 for Quad SPI. When QE=0, /WP and /HOLD retain their standard functions; when QE=1, they become bidirectional data lanes and are unavailable for write protection or hold control. This setting is non-volatile and persists across power cycles unless explicitly cleared.
Does the W25Q32FVZPJF TR support execute-in-place (XIP) operation, and what conditions are required?
Yes, the W25Q32FVZPJF TR supports true XIP via Continuous Read Mode with wrap lengths of 8/16/32/64 bytes and only 8 clocks needed to address the first byte. To achieve deterministic XIP performance, the host MCU must support QPI or Quad SPI mode, configure the QE bit, and ensure stable 104 MHz clock timing with proper signal integrity on CLK, /CS, and IOx lines.
What security features are implemented in the W25Q32FVZPJF TR beyond basic write protection?
Beyond /WP pin and status register BP bits, the W25Q32FVZPJF TR includes three 256-byte Security Registers with OTP locks, a 64-bit factory-unique ID (read via 4Bh), SFDP register for standardized parameter discovery, and individual sector/block lock/unlock commands (36h/39h/7Eh/98h). These enable layered protection for keys, calibration data, and firmware metadata.
Can the W25Q32FVZPJF TR be used in automotive applications, and what qualifications does it meet?
The W25Q32FVZPJF TR operates across –40°C to +85°C and is qualified to AEC-Q100 Grade 3. While not automotive-grade by default, its temperature range, 20-year data retention, and robust erase/write endurance make it suitable for cabin-located ADAS components, infotainment subsystems, and telematics modules where full AEC-Q100 Grade 2 certification is not mandated.
W25Q32FVZPJF TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (6x5)
W25Q32FVZPJF TR FAQ
1.How can I place an order for W25Q32FVZPJF TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q32FVZPJF TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q32FVZPJF TR reliable?
The price and inventory of W25Q32FVZPJF TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q32FVZPJF TR is usually 5 days.
3.What payment methods are accepted for W25Q32FVZPJF TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q32FVZPJF TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q32FVZPJF TR?
W25Q32FVZPJF TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q32FVZPJF TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q32FVZPJF TR?
For technical support, including W25Q32FVZPJF TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q32FVZPJF TR requirements.
6.How does Aetrix verify that W25Q32FVZPJF TR is sourced from the original manufacturer or authorized distributors?
All W25Q32FVZPJF TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q32FVZPJF TR meets industry standards.
7.What is the process for return or replacement of W25Q32FVZPJF TR?
All W25Q32FVZPJF TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q32FVZPJF TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q32FVZPJF TR part is unused and in its original packaging.
Return procedure for W25Q32FVZPJF TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25Q32FVZPJF TR Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
