Winbond Electronics Corporation W25Q32JVSSJQ TR
- Part No.:
- W25Q32JVSSJQ TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
W25Q32JVSSJQ TR.pdf
- Description:
- IC FLASH 32MBIT SPI/QUAD 8SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W25Q32JVSSJQ TR from Winbond is a 32M-bit (4MB) serial NOR flash memory IC designed for code storage and XIP (execute-in-place) in space-constrained embedded systems. It supports Standard, Dual, and Quad SPI interfaces with up to 133 MHz clock frequency, 4KB uniform sector erase granularity, and operates from 2.7V–3.6V across –40°C to +85°C. It is commonly used in industrial microcontroller boot code storage and firmware update storage.
For engineers reviewing the W25Q32JVSSJQ TR datasheet, W25Q32JVSSJQ TR pinout, W25Q32JVSSJQ TR application, or W25Q32JVSSJQ TR equivalent, this page delivers verified package mapping (SOIC-8 208-mil), confirmed Quad SPI timing (532 MHz equivalent), JEDEC ID support, 100K program-erase cycles per sector, and hardware write protection via /WP and /HOLD pins - all critical for reliable boot memory selection.
Technical Context
The W25Q32JVSSJQ TR implements a flexible SPI-compatible command set supporting Standard (DI/DO), Dual (IO0/IO1), and Quad (IO0–IO3) I/O modes, with Quad operation enabled by setting the non-volatile QE bit in Status Register-2. Its architecture includes a 256-byte page buffer, 1,024 erasable 4KB sectors, and dedicated hardware reset only on SOIC-16 and TFBGA packages - not present in the SOIC-8 variant.
It integrates three 256-byte security registers, SFDP register for discoverable parameters, and supports Erase/Program Suspend & Resume. The /HOLD pin functions as IO3 in Quad mode, while /WP becomes IO2 - both pins are repurposed bidirectional I/Os when QE=1, confirming strict mode-dependent pin behavior validated in the datasheet's Pin Description section.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 M-bit (4 MB) organized as 16,384 × 256-byte pages |
| SPI Interface Modes | Standard (DI/DO), Dual (IO0/IO1), Quad (IO0–IO3); QE bit required for Quad |
| Max Clock Frequency | 133 MHz single-ended; enables 266 MHz (Dual) or 532 MHz (Quad) effective throughput |
| Erase Granularity | Uniform 4 KB sectors (1,024 total), plus 32 KB and 64 KB block erase options |
| Endurance & Retention | 100,000 program/erase cycles per sector; >20 years data retention at 25°C |
| Supply Voltage | 2.7 V to 3.6 V; typical power-down current <1 µA |
| Operating Temperature | –40°C to +85°C (Industrial grade) |
| JEDEC ID & SFDP | Supports Read JEDEC ID (9Fh) and Read SFDP Register (5Ah) for automated configuration |
Pinout & Package
W25Q32JVSSJQ TR is packaged in an 8-pin SOIC 208-mil (Package Code SS), with gull-wing leads and standard surface-mount footprint. Pin 1 is marked by a beveled corner or dot; pin 4 and pin 8 are GND and VCC respectively.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; high-impedance DO and standby current when high |
| 2 DO (IO1) | Data Output / Bidirectional I/O | Unidirectional output in Standard SPI; IO1 in Dual/Quad mode |
| 3 /WP (IO2) | Write Protect Input / Bidirectional I/O | Hardware lock for status register; becomes IO2 when QE=1 |
| 4 GND | Ground Reference | Primary return path for VCC and I/O signals; must be low-impedance |
| 5 DI (IO0) | Data Input / Bidirectional I/O | Unidirectional input in Standard SPI; IO0 in Dual/Quad mode |
| 6 CLK | Serial Clock Input | Edge-triggered timing reference; supports SPI Mode 0 and Mode 3 |
| 7 /HOLD (IO3) | Hold Input / Bidirectional I/O | Pauses ongoing read/write; becomes IO3 when QE=1; not available in Quad mode |
| 8 VCC | Power Supply | 2.7–3.6 V supply; decoupling capacitor required near pin |
Key Features
| Feature | Design Value |
|---|---|
| Quad SPI XIP Support | Enables direct code execution from flash via Fast Read Quad I/O (EBh), reducing RAM footprint |
| 4KB Uniform Sector Architecture | Allows fine-grained firmware partitioning - e.g., separate sectors for bootloader, app, and config |
| Erase/Program Suspend & Resume | Permits background operations (e.g., logging) during long erase cycles without halting system |
| Three 256-byte Security Registers | Stores cryptographic keys or calibration data with individual lock bits (LB1–LB3) for OTP-like protection |
| 64-bit Unique Serial Number | Provides device-level traceability for secure boot, licensing, or field failure analysis |
| Hardware Write Protection | /WP pin + BP/TB/SEC bits allow mixed software/hardware locking of critical sectors |
Applications
| Industrial PLC Firmware Storage | Medical Device Bootloader Memory |
|---|---|
|
Use Scenario: Storing certified bootloader and application firmware in DIN-rail mounted programmable logic controllers requiring long-term reliability and field-upgrade capability. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP support; handles sequential instruction fetches at up to 532 MHz equivalent bandwidth. Use Value: 4KB sector erase enables safe dual-bank firmware updates without interrupting real-time control loops. |
Use Scenario: Holding FDA-compliant boot code and diagnostic firmware in portable ultrasound or infusion pumps where data integrity and tamper resistance are mandatory. IC Role / Device Role / Timing Role: Secure boot memory with 64-bit unique ID and three OTP-lockable security registers for key storage. Use Value: Hardware /WP pin + non-volatile BP bits prevent accidental overwrite of safety-critical boot sectors during service. |
| Smart Energy Meter Code Shadowing | Automotive Infotainment System Flash |
|
Use Scenario: Copying metering application code from flash to RAM at startup in ANSI C12.22-compliant smart meters operating in wide temperature ranges. IC Role / Device Role / Timing Role: High-speed serial flash accessed via Fast Read Dual I/O (BBh) to minimize boot latency under 2.7–3.6 V brownout conditions. Use Value: 100K endurance and >20-year retention ensure 15+ year field life without firmware corruption. |
Use Scenario: Storing infotainment OS kernel and UI assets in automotive head units requiring AEC-Q100 alignment (via Industrial Plus grade qualification). IC Role / Device Role / Timing Role: Secondary boot memory interfaced to MCU via Quad SPI; supports continuous read with 32-byte wrap for streaming media assets. Use Value: SOIC-8 208-mil package fits compact PCB layouts while maintaining compatibility with existing reflow profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L3233FZNI-10G | 32 M-bit, 104 MHz max clock, SOIC-8 208-mil, no /RESET pin, supports DTR mode | Lacks Quad Enable bit flexibility; uses different status register layout and SFDP version | Prefer for designs already using Macronix toolchains; verify QE-equivalent bit mapping before migration |
| S25FL132K0XMFI010 | 32 M-bit, 80 MHz max clock, SOIC-8 208-mil, integrated ECC, no /HOLD pin | Includes on-die error correction but lower throughput; lacks suspend/resume functionality | Choose when bit-error resilience outweighs speed - e.g., in high-radiation or extended-temp environments |
Compared with W25Q32JVSSJQ TR, MX25L3233FZNI-10G offers higher DTR-mode bandwidth but requires redesign of initialization sequences, while S25FL132K0XMFI010 trades raw speed for built-in ECC and simplified command set - making W25Q32JVSSJQ TR optimal for balanced performance, flexibility, and industrial temperature support.
Availability
W25Q32JVSSJQ TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device bootloader memory, and smart energy meter code shadowing requiring stable component supply, long-lifecycle assurance, and full traceability.
Supply support for W25Q32JVSSJQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions including NOR/NAND flash, SRAM, and mobile DRAM, serving industrial, communications, and consumer markets since 1987.
The W25Q series was designed specifically for embedded systems needing high-speed, low-power, and secure serial flash - emphasizing XIP capability, flexible erase granularity, and robust security features like unique IDs and security registers.
FAQ
What is the package type and lead count of W25Q32JVSSJQ TR?
W25Q32JVSSJQ TR uses an 8-pin SOIC package with 208-mil body width (Package Code SS). It has gull-wing leads, standard pitch of 1.27 mm, and conforms to JEDEC MS-012. This package is RoHS-compliant and qualified for industrial temperature range (–40°C to +85°C). The "JQ" suffix explicitly denotes the SOIC-208-mil variant in Winbond's ordering nomenclature.
Does W25Q32JVSSJQ TR support hardware reset via /RESET pin?
No, W25Q32JVSSJQ TR does not include a dedicated /RESET pin. That function is only available on SOIC-16 (SF) and TFBGA (TB/TC) packages per the datasheet. For W25Q32JVSSJQ TR, system-level reset must be implemented via software sequence: Enable Reset (66h) followed by Reset Device (99h), which takes ~30 µs to complete.
How is Quad SPI mode enabled on W25Q32JVSSJQ TR?
Quad SPI mode on W25Q32JVSSJQ TR is enabled by setting the Quad Enable (QE) bit - bit 1 of Status Register-2 - to '1'. This is done via Write Status Register-2 (31h) instruction. Once set, /WP becomes IO2 and /HOLD becomes IO3. The QE bit is non-volatile, retaining state after power cycle unless explicitly cleared.
What is the minimum erase unit size supported by W25Q32JVSSJQ TR?
The minimum erase unit size for W25Q32JVSSJQ TR is 4 KB, corresponding to one uniform sector. The device contains 1,024 such sectors. This granularity allows precise firmware partitioning - for example, isolating bootloader, application, and configuration data into separate erasable regions without affecting adjacent content.
Can W25Q32JVSSJQ TR be used for execute-in-place (XIP) operation?
Yes, W25Q32JVSSJQ TR supports true XIP operation via Fast Read Quad I/O (EBh) and Fast Read Dual I/O (BBh) instructions. With up to 532 MHz equivalent bandwidth and continuous read with 32-byte wrap, it delivers deterministic instruction fetch timing suitable for real-time embedded applications without requiring full code copy to RAM.
W25Q32JVSSJQ TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
W25Q32JVSSJQ TR FAQ
1.How can I place an order for W25Q32JVSSJQ TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q32JVSSJQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q32JVSSJQ TR reliable?
The price and inventory of W25Q32JVSSJQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q32JVSSJQ TR is usually 5 days.
3.What payment methods are accepted for W25Q32JVSSJQ TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q32JVSSJQ TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q32JVSSJQ TR?
W25Q32JVSSJQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q32JVSSJQ TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q32JVSSJQ TR?
For technical support, including W25Q32JVSSJQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q32JVSSJQ TR requirements.
6.How does Aetrix verify that W25Q32JVSSJQ TR is sourced from the original manufacturer or authorized distributors?
All W25Q32JVSSJQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q32JVSSJQ TR meets industry standards.
7.What is the process for return or replacement of W25Q32JVSSJQ TR?
All W25Q32JVSSJQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q32JVSSJQ TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q32JVSSJQ TR part is unused and in its original packaging.
Return procedure for W25Q32JVSSJQ TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25Q32JVSSJQ TR Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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