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Winbond Electronics Corporation W25Q32JVTBJQ

Part No.:
W25Q32JVTBJQ
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25Q32JVTBJQ.pdf
Description:
IC FLASH 32MBIT SPI/QUAD 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,234

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Product details

Overview

W25Q32JVTBJQ from Winbond is a 32M-bit (4MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with 133MHz clock capability, 66MB/s continuous read throughput, and hardware write protection via /WP and /HOLD pins - deployed in industrial-grade embedded systems for code storage, XIP execution, and firmware parameter retention.

For engineers reviewing the W25Q32JVTBJQ datasheet, W25Q32JVTBJQ pinout, W25Q32JVTBJQ application, or W25Q32JVTBJQ equivalent, key selection considerations include its TFBGA-24 (8×6 mm, 6×4 ball array) package, Quad Enable (QE) bit configuration, sector/block erase granularity (4KB/32KB/64KB), JEDEC ID compatibility, and hardware reset support specific to SOIC-16 and TFBGA packages.

Technical Context

The W25Q32JVTBJQ implements a flexible SPI command architecture supporting three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), where Quad mode requires non-volatile setting of the QE bit in Status Register-2. Its internal block diagram integrates a 16,384-page (256-byte/page) array, 4KB uniform sectors (1,024 total), 64KB blocks (64 total), and three 256-byte security registers.

It features dual power-down states (<1µA typical), volatile/non-volatile status register bits (BP0–BP2, TB, SEC, CMP, SRP, QE, WPS), and hardware-level protections including dedicated /WP and /HOLD pins - with /RESET available only on TFBGA and SOIC-16 packages, not on 8-pin variants like SOIC-208 or WSON.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 32 M-bit (4 MB) organized as 16,384 × 256-byte pages
SPI Interface Modes Standard (DI/DO), Dual (IO0/IO1), Quad (IO0–IO3); QE bit required for Quad I/O
Max Clock Frequency 133 MHz single-ended; enables 266 MHz (Dual) or 532 MHz (Quad) effective throughput
Erase Granularity 4 KB sector, 32 KB block, 64 KB block, or full chip - enabling fine-grained firmware updates
Endurance & Retention 100,000 program/erase cycles per sector; >20 years data retention at +85°C
Operating Voltage 2.7 V to 3.6 V single supply; compatible with 3.3 V logic systems
Temperature Range −40°C to +105°C (Industrial Plus grade)
Power-Down Current <1 µA typical - critical for battery-backed or low-power IoT node designs

Pinout & Package

W25Q32JVTBJQ uses the TFBGA-24 (8×6 mm, 6×4 ball array) package (Package Code TC), with 24 solder balls arranged in a 6-row × 4-column grid. Pin functions are defined per ball position; no leads or pads - requires controlled-depth reflow and microvia PCB design.

Pin/Terminal Circuit Role Design Meaning
A4 /RESET Dedicated hardware reset input; active-low, ≥1 µs pulse resets device to power-on state - available only on TFBGA/SOIC-16
B2 CLK Serial clock input; timing reference for all SPI operations (Mode 0/3 supported)
B3 GND Ground reference; must be low-impedance connection to minimize noise coupling into SPI signals
B4 VCC Primary power supply (2.7–3.6 V); decoupling capacitor (0.1 µF) required within 5 mm
C2 /CS Chip select input; falling edge initiates instruction latch; high = high-impedance DO/IOs
C4 /WP (IO2) Hardware write protect input (active-low); disables Status Register writes when asserted
D2 DO (IO1) Data output / bidirectional IO1; used in Standard/Dual/Quad SPI reads and bidirectional transfers
D3 DI (IO0) Data input / bidirectional IO0; carries instructions, addresses, and data in all SPI modes
D4 /HOLD (IO3) Hold or Quad I/O3 input; pauses ongoing SPI transfer when low; repurposed as IO3 in Quad mode

Key Features

Feature Design Value
Quad SPI XIP Support Enables execute-in-place from flash using Fast Read Quad I/O (EBh), reducing RAM footprint in MCU boot loaders
Uniform 4KB Sector Architecture Allows independent firmware partitioning - e.g., bootloader (sector 0), app image (sectors 1–127), config (sector 128)
Erase/Program Suspend & Resume Permits background interrupt handling during long erase cycles - essential for real-time RTOS environments
64-bit Unique Serial Number Provides hardware-rooted device identity for secure provisioning, anti-cloning, and field firmware authentication
JEDEC SFDP Register Self-describing parameter table accessible via 5Ah command - enables automatic driver initialization without hard-coded timing
Three 256-byte Security Registers OTP-capable storage for keys, certificates, or calibration data - protected by LB1–LB3 lock bits and individual sector locking

Applications

Industrial PLC Firmware Storage Automotive ADAS Boot Image

Use Scenario: Storing firmware images and configuration tables in programmable logic controllers operating continuously in factory-floor environments.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and hardware write protection to prevent accidental corruption during brown-out events.

Use Value: 4KB sector erase enables atomic firmware patching; 105°C rating ensures reliability near motor drives and power electronics.

Use Scenario: Hosting boot code and sensor calibration data for radar/EoL modules requiring AEC-Q100-compliant components.

IC Role / Device Role / Timing Role: Primary boot memory accessed via Quad SPI during cold start; supports fast read (EBh) for sub-100ms boot latency.

Use Value: 66MB/s throughput meets ADAS boot timing budgets; unique ID enables secure key binding per ECU unit.

Medical Infusion Pump UI Smart Grid Communication Module

Use Scenario: Storing GUI assets, safety-critical alarm logic, and usage logs in Class II medical devices with strict data integrity requirements.

IC Role / Device Role / Timing Role: Parameter and asset storage with sector-lock protection to prevent unauthorized UI modification or log tampering.

Use Value: Individual sector lock (36h/39h) isolates clinical vs. service partitions; 20-year retention validates long-term device lifecycle compliance.

Use Scenario: Holding protocol stacks (DLMS/COSEM), encryption keys, and firmware for cellular/NB-IoT gateways deployed in outdoor substations.

IC Role / Device Role / Timing Role: Secure firmware repository with SFDP-driven driver auto-configuration and security register-based key storage.

Use Value: Three 256-byte security registers store AES-128 keys; JEDEC ID (9Fh) enables field inventory verification without custom tooling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L3233FZBI-10G 32 M-bit, 104 MHz max clock, SOIC-8 only; no TFBGA option; lacks /RESET pin and security registers Lower-cost replacement where Quad SPI and hardware reset are not required; unsuitable for XIP or secure key storage Select if board uses SOIC-8 footprint and does not require security features or industrial-plus temperature range
S25FL132K0XMFI010 32 M-bit, 80 MHz max clock, supports HyperBus interface; includes ECC and configurable latency; TFBGA-24 available Higher reliability for mission-critical firmware; ECC corrects bit flips but adds latency overhead; HyperBus not SPI-compatible Choose when system demands error correction and future HyperFlash migration path - requires controller firmware update

Compared with MX25L3233FZBI-10G, W25Q32JVTBJQ delivers higher throughput (133 vs. 104 MHz), hardware reset, and security registers; versus S25FL132K0XMFI010, it offers faster Quad SPI performance but lacks built-in ECC and HyperBus support - making it optimal for cost-sensitive, high-speed SPI-based industrial firmware storage.

Availability

W25Q32JVTBJQ is available at Aetrix Electronics and suitable for industrial control, automotive telematics, and medical device applications requiring stable component supply, extended temperature operation, and secure firmware storage.

Supply support for W25Q32JVTBJQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR flash, PSRAM, and TrustME secure memory products.

The W25Q series targets high-performance, space-constrained embedded systems requiring reliable code storage, XIP execution, and robust data integrity - with emphasis on industrial, automotive, and networking applications.

FAQ

Does W25Q32JVTBJQ support hardware reset, and which packages include the /RESET pin?

Yes, W25Q32JVTBJQ supports hardware reset via the dedicated /RESET pin, but only on TFBGA-24 (Package Code TC) and SOIC-16 packages. The W25Q32JVTBJQ variant uses TFBGA-24, so it includes the /RESET pin at Ball A4. A low pulse ≥1 µs forces immediate return to power-on state, overriding all ongoing SPI operations - critical for fail-safe recovery in industrial systems.

What is the function of the /HOLD pin on W25Q32JVTBJQ, and how does it behave in Quad SPI mode?

On W25Q32JVTBJQ, the /HOLD pin (Ball D4) suspends ongoing SPI transfers when pulled low while /CS is active, placing DO/IOs in high-impedance state. In Quad SPI mode - enabled by setting the QE bit - this pin is repurposed as IO3 and loses /HOLD functionality. Designers must configure QE before switching to Quad mode and avoid external pull-downs on D4 in that configuration.

How is Quad SPI mode enabled on W25Q32JVTBJQ, and what register controls it?

Quad SPI mode on W25Q32JVTBJQ is enabled by setting the Quad Enable (QE) bit in Status Register-2 (SR2). This bit is non-volatile and writable via Write Status Register-2 (31h) command. Once QE=1, the /WP (C4) and /HOLD (D4) pins become IO2 and IO3 respectively. The change persists across power cycles unless explicitly cleared.

What erase options are available on W25Q32JVTBJQ, and how many 4KB sectors does it contain?

W25Q32JVTBJQ supports four erase types: 4KB sector (20h), 32KB block (52h), 64KB block (D8h), and full chip (C7h/60h). Its 4MB array contains exactly 1,024 uniform 4KB sectors - enabling precise firmware partitioning, such as isolating bootloader, application, and configuration regions without over-erasing.

Is W25Q32JVTBJQ compatible with JEDEC-standard commands and identification protocols?

Yes, W25Q32JVTBJQ fully complies with JEDEC standards: it responds to Read JEDEC ID (9Fh), returns manufacturer ID 0xEF and device ID 0x4016, and implements the SFDP (Serial Flash Discoverable Parameters) register (5Ah) - allowing host drivers to auto-detect timing parameters, erase sizes, and feature flags without hardcoded assumptions.

W25Q32JVTBJQ Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
32Mbit
Memory Organization:
4M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (8x6)

W25Q32JVTBJQ FAQ

1.How can I place an order for W25Q32JVTBJQ through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q32JVTBJQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q32JVTBJQ reliable?

The price and inventory of W25Q32JVTBJQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q32JVTBJQ is usually 5 days.

3.What payment methods are accepted for W25Q32JVTBJQ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q32JVTBJQ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q32JVTBJQ?

W25Q32JVTBJQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q32JVTBJQ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q32JVTBJQ?

For technical support, including W25Q32JVTBJQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q32JVTBJQ requirements.

6.How does Aetrix verify that W25Q32JVTBJQ is sourced from the original manufacturer or authorized distributors?

All W25Q32JVTBJQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q32JVTBJQ meets industry standards.

7.What is the process for return or replacement of W25Q32JVTBJQ?

All W25Q32JVTBJQ units undergo pre-shipment inspection (PSI). If there is an issue with W25Q32JVTBJQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q32JVTBJQ part is unused and in its original packaging.

Return procedure for W25Q32JVTBJQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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