Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W25Q32JVZEJM TR

Part No.:
W25Q32JVZEJM TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q32JVZEJM TR.pdf
Description:
IC FLASH 32MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,198

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W25Q32JVZEJM TR from Winbond is a 32M-bit (4MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with 133 MHz clock rate, 2.7–3.6 V supply, -40°C to +105°C industrial-plus temperature grade, and 4KB uniform sector architecture for code storage and data logging in space-constrained embedded systems.

For engineers reviewing the W25Q32JVZEJM TR datasheet, W25Q32JVZEJM TR pinout, W25Q32JVZEJM TR application, or W25Q32JVZEJM TR equivalent, key selection factors include Quad SPI XIP capability, hardware /WP and /HOLD pins, JEDEC ID/SFDP register support, 100K program-erase cycles per sector, and TFBGA 8x6-mm (24-ball, 6x4 array) package compatibility with high-density PCB layouts.

Technical Context

The W25Q32JVZEJM TR implements a unified SPI command set with Standard (DI/DO), Dual (IO0/IO1), and Quad (IO0–IO3) I/O modes, where Quad operation requires non-volatile QE bit (Status Register-2) configuration. It features a 16,384-page (256-byte/page) array organized into 1,024 × 4KB sectors and 64 × 64KB blocks, enabling flexible erase granularity.

Its internal architecture includes three 256-byte security registers, 64-bit unique ID, SFDP register for discoverable parameters, and dual write-protection layers: volatile/non-volatile status register bits (BP2–BP0, TB, SEC, CMP, SRP) plus hardware /WP pin control. The /RESET pin is dedicated and functional only in SOIC-16 and TFBGA packages - confirmed for this ZEJM variant.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 32 M-bit (4 MB) - supports full firmware images and parameter tables in compact footprint
SPI Interface Modes Standard / Dual / Quad SPI - enables scalable bandwidth: up to 532 MHz effective rate with Fast Read Quad I/O (EBh)
Max Clock Frequency 133 MHz - delivers 66 MB/s continuous read throughput, exceeding legacy parallel flash performance
Erase Granularity 4 KB sectors, 32 KB & 64 KB blocks - allows fine-grained updates without disturbing adjacent firmware or calibration data
Endurance & Retention 100,000 program-erase cycles per sector; >20 years data retention - suitable for field-upgradable industrial firmware
Operating Voltage 2.7 V to 3.6 V - compatible with 3.3 V logic rails and low-power microcontroller domains
Temperature Range -40°C to +105°C - qualified for industrial-plus environments including automotive under-hood and motor control modules
Power-Down Current 1 µA (typ.) - minimizes standby power in battery-backed or energy-harvesting edge nodes

Pinout & Package

W25Q32JVZEJM TR uses the 24-ball TFBGA 8x6-mm package (Package Code TC, 6x4 ball array), optimized for high-density routing and thermal performance in compact PCBs. Pin functions are defined per JEDEC-standard ball map with dedicated /RESET functionality.

Pin/Terminal Circuit Role Design Meaning
A4 /RESET Dedicated hardware reset input - forces immediate return to power-on state; active-low, 1 µs minimum pulse width
B2 CLK Serial clock input - synchronizes all SPI transfers; supports Mode 0 and Mode 3
B3 GND Ground reference - shared return path for all I/O and core logic
B4 VCC Power supply - 2.7–3.6 V nominal; decoupling required within 5 mm of ball
C2 /CS Chip select input - enables device communication; must transition high→low before instruction acceptance
C4 /WP (IO2) Write protect input / Quad I/O2 - hardware lock for status register; becomes IO2 when QE=1
D2 DO (IO1) Data output / Quad I/O1 - bidirectional in Dual/Quad mode; used for status reads and fast output
D3 DI (IO0) Data input / Quad I/O0 - bidirectional in Dual/Quad mode; carries instructions, addresses, and data
D4 /HOLD (IO3) Hold input / Quad I/O3 - pauses ongoing transfers; becomes IO3 when QE=1; not available in Quad mode

Key Features

Feature Design Value
Quad Enable (QE) bit Non-volatile Status Register-2 bit enabling IO2/IO3 for 4-line data transfer - eliminates need for external multiplexing
Erase/Program Suspend & Resume Allows background operations (e.g., reading while erasing) - critical for real-time firmware update without system stall
64-bit Unique Serial Number Factory-programmed per-device ID - enables secure device authentication and traceability in production and field
SFDP Register Support JEDEC JESD216-compliant serial flash discoverable parameters - enables automatic driver configuration in Linux/Bare Metal
Three 256-byte Security Registers OTP-capable zones for keys, certificates, or calibration data - isolated from main array with independent lock bits
Continuous Read with Wrap 8/16/32/64-byte wrap modes reduce address overhead - enables true execute-in-place (XIP) with minimal latency

Applications

Firmware Storage in Industrial PLCs Secure Boot in Edge AI Modules

Use Scenario: Storing boot loader, RTOS kernel, and application firmware in programmable logic controllers operating continuously in factory automation environments.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP-capable Quad SPI interface for deterministic boot timing and runtime code execution.

Use Value: 4KB sector erase enables incremental firmware patching without full reflash; 100K endurance ensures >10-year field life with weekly updates.

Use Scenario: Hosting signed bootloader and root-of-trust keys in AI inference accelerators deployed at network edge with zero-touch provisioning.

IC Role / Device Role / Timing Role: Secure code and credential storage with hardware-enforced write protection and unique ID binding to cryptographic identity.

Use Value: Three OTP-capable security registers store immutable keys; /WP pin + status register locks prevent runtime tampering during OTA updates.

Parameter Logging in Motor Drives Configuration Storage in 5G Small Cells

Use Scenario: Recording thermal, current, and fault history in servo drives requiring long-term reliability under vibration and wide temperature swings.

IC Role / Device Role / Timing Role: High-reliability data logger using uniform 4KB sectors for timestamped event buffers and calibration offsets.

Use Value: -40°C to +105°C rating matches drive enclosure thermal profile; 20-year data retention guarantees log integrity across product lifecycle.

Use Scenario: Holding RF calibration tables, beamforming coefficients, and regulatory compliance settings in compact 5G base station radios.

IC Role / Device Role / Timing Role: Low-latency configuration store accessed via Quad SPI during radio initialization and channel switching.

Use Value: 133 MHz clock + Fast Read Quad I/O achieves <50 µs access to 256-byte calibration blocks - meets sub-millisecond setup time requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L3233FZBI-10G 32 M-bit, 104 MHz max clock, SOIC-8 package only; no /RESET pin; lacks SFDP and security registers Lower-cost replacement where Quad SPI XIP and secure storage are not required Select when board layout uses SOIC-8 and firmware size fits within 104 MHz bandwidth margin
S25FL132K0XMFI010 32 M-bit, 80 MHz max clock, supports HyperBus but no native Quad I/O; includes ECC and configurable sector protection Better suited for safety-critical applications needing error correction and deterministic erase behavior Prefer when ASIL-B compliance or ECC-enabled data integrity is mandatory over raw speed

Compared with W25Q32JVZEJM TR, MX25L3233FZBI-10G offers lower cost but sacrifices Quad SPI performance, /RESET, and security features; S25FL132K0XMFI010 provides ECC and safety features at reduced speed and without SFDP flexibility - making W25Q32JVZEJM TR optimal for high-bandwidth, secure, and auto-configurable embedded designs.

Availability

W25Q32JVZEJM TR is available at Aetrix Electronics and suitable for industrial automation, edge AI inference, and 5G infrastructure requiring stable component supply, extended temperature operation, and long-term obsolescence management.

Supply support for W25Q32JVZEJM TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial flash, RAM, and mobile DRAM, serving industrial, communications, and consumer markets since 1987.

The W25Q series targets high-performance embedded systems needing reliable, feature-rich serial NOR flash - designed specifically for code execution, secure storage, and robust operation in harsh thermal and electrical environments.

FAQ

What is the package type and ball count of W25Q32JVZEJM TR?

W25Q32JVZEJM TR uses a 24-ball TFBGA package measuring 8 mm × 6 mm with a 6×4 ball array (Package Code TC). This compact, thermally efficient package supports fine-pitch routing and is qualified for industrial-plus temperature operation (-40°C to +105°C). The /RESET pin is fully functional in this configuration, unlike SOIC-8 variants.

Does W25Q32JVZEJM TR support Quad SPI operation out of the box?

No - W25Q32JVZEJM TR requires the Quad Enable (QE) bit in Status Register-2 to be set (QE = 1) to activate IO2 and IO3 pins for Quad SPI. By default, QE is cleared; users must issue Write Status Register-2 (31h) with appropriate value. Once set, QE is non-volatile unless explicitly cleared, enabling persistent Quad I/O mode across power cycles.

How does the /WP pin function on W25Q32JVZEJM TR?

On W25Q32JVZEJM TR, the /WP pin (Ball C4) serves dual roles: as a hardware write-protect input for the status register when QE = 0, and as IO2 (Quad I/O line 2) when QE = 1. When active-low, /WP prevents modification of block protection bits (BP2–BP0), TB, SEC, and SRP - providing physical layer security against accidental writes during system noise events.

Can W25Q32JVZEJM TR be used for execute-in-place (XIP) applications?

Yes - W25Q32JVZEJM TR supports true XIP via Fast Read Quad I/O (EBh) and Continuous Read with Wrap modes. With 133 MHz clock and 4-line data transfer, it delivers up to 532 MHz effective bandwidth, enabling low-latency instruction fetch directly from flash without RAM shadowing - validated for use in Cortex-M7 and RISC-V SoCs requiring deterministic boot and runtime code execution.

What security features are implemented in W25Q32JVZEJM TR?

W25Q32JVZEJM TR integrates multiple hardware-enforced security layers: three 256-byte one-time-programmable (OTP) security registers, 64-bit unique serial number, JEDEC-standard SFDP register for authenticated parameter discovery, and granular protection via status register bits (BP2–BP0, TB, SEC, CMP, SRP) combined with /WP pin control - collectively enabling secure boot, firmware attestation, and tamper-resistant calibration storage.

W25Q32JVZEJM TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
32Mbit
Memory Organization:
4M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25Q32JVZEJM TR FAQ

1.How can I place an order for W25Q32JVZEJM TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q32JVZEJM TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q32JVZEJM TR reliable?

The price and inventory of W25Q32JVZEJM TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q32JVZEJM TR is usually 5 days.

3.What payment methods are accepted for W25Q32JVZEJM TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q32JVZEJM TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q32JVZEJM TR?

W25Q32JVZEJM TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q32JVZEJM TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q32JVZEJM TR?

For technical support, including W25Q32JVZEJM TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q32JVZEJM TR requirements.

6.How does Aetrix verify that W25Q32JVZEJM TR is sourced from the original manufacturer or authorized distributors?

All W25Q32JVZEJM TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q32JVZEJM TR meets industry standards.

7.What is the process for return or replacement of W25Q32JVZEJM TR?

All W25Q32JVZEJM TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q32JVZEJM TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q32JVZEJM TR part is unused and in its original packaging.

Return procedure for W25Q32JVZEJM TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q32JVZEJM TR Tags

  • W25Q32JVZEJM TR
  • W25Q32JVZEJM TR PDF
  • W25Q32JVZEJM TR Datasheet
  • W25Q32JVZEJM TR Specifications
  • W25Q32JVZEJM TR Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W25Q32JVZEJM TR
  • Buy W25Q32JVZEJM TR
  • W25Q32JVZEJM TR Price
  • W25Q32JVZEJM TR Distributor
  • W25Q32JVZEJM TR Supplier
  • W25Q32JVZEJM TR Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER