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Winbond Electronics Corporation W25Q32JVZEJQ TR

Part No.:
W25Q32JVZEJQ TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q32JVZEJQ TR.pdf
Description:
IC FLASH 32MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,718

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Product details

Overview

W25Q32JVZEJQ TR from Winbond is a 32M-bit (4MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with 133 MHz clock rate, 2.7–3.6 V supply, and industrial temperature range (−40°C to +85°C). It features uniform 4KB sectors, 64KB blocks, 100K program-erase cycles, and hardware write protection via /WP and /HOLD pins - used for code storage, XIP execution, and firmware updates in embedded controllers.

For engineers reviewing the W25Q32JVZEJQ TR datasheet, W25Q32JVZEJQ TR pinout, W25Q32JVZEJQ TR application, or W25Q32JVZEJQ TR equivalent, key selection considerations include Quad SPI enable (QE bit), /RESET pin availability (TFBGA/SOIC-16 only), sector-level lock granularity, SFDP register support, and 1µA typical power-down current.

Technical Context

The W25Q32JVZEJQ TR implements a SPI-compatible command set with three instruction modes: Standard (DI/DO), Dual (IO0/IO1), and Quad (IO0–IO3), where Quad mode requires non-volatile QE bit = 1 in Status Register-2. Its architecture includes a 256-byte page buffer, 1,024 erasable 4KB sectors, and dedicated security registers (3 × 256 bytes).

It supports JEDEC-standard Manufacturer ID (EFh), Device ID (4016h), 64-bit unique serial number, and SFDP v1.6 register for discoverable timing and feature parameters. Hardware reset (/RESET) is available only on TFBGA and SOIC-16 packages - not on the WSON 8-pin ZE package used by W25Q32JVZEJQ TR.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 32 M-bit (4 MB) organized as 16,384 × 256-byte pages
Interface Support Standard/Dual/Quad SPI with up to 133 MHz CLK; 532 MHz effective Quad I/O throughput
Operating Voltage 2.7 V to 3.6 V - compatible with 3.3 V logic systems without level shifting
Temperature Range −40°C to +85°C (Industrial Grade) - validated for extended ambient operation
Erase Endurance 100,000 program-erase cycles per sector - suitable for frequent firmware update scenarios
Data Retention 20+ years at 25°C - ensures long-term reliability in unpowered storage
Power-Down Current 1 µA typical - enables ultra-low-power sleep states in battery-backed systems
Package 8-pad WSON 8x6-mm (Package Code ZE) - compact footprint, exposed pad for thermal dissipation

Pinout & Package

W25Q32JVZEJQ TR uses an 8-pad WSON 8×6-mm package (JEDEC MO-241AC, Package Code ZE) with wettable flanks and thermally enhanced exposed pad. Pin 1 is marked by a dot; pin 4 is GND; pin 8 is VCC. The package lacks dedicated /RESET - /HOLD (Pin 7) serves dual function but is repurposed as IO3 in Quad mode when QE=1.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable: high = device deselected, DO in high-Z; low = active communication window
2 DO (IO1) Data Output / Bidirectional I/O Unidirectional output in Standard SPI; bidirectional IO1 in Dual/Quad modes after QE configuration
3 /WP (IO2) Write Protect Input / Bidirectional I/O Hardware lock for status register; becomes IO2 in Quad mode when QE=1
4 GND Ground Reference Primary return path for VCC and I/O signals; connects to exposed thermal pad
5 DI (IO0) Data Input / Bidirectional I/O Unidirectional input in Standard SPI; bidirectional IO0 in Dual/Quad modes
6 CLK Serial Clock Input Synchronous timing reference for all SPI operations; supports Mode 0 and Mode 3
7 /HOLD (IO3) Hold Input / Bidirectional I/O Pauses ongoing read/write; becomes IO3 in Quad mode when QE=1 - no dedicated /RESET
8 VCC Power Supply 2.7–3.6 V core and I/O supply; decoupling capacitor required near pin

Key Features

Feature Design Value
Quad SPI Enable (QE bit) Non-volatile bit in Status Register-2 enabling 4-line I/O for 532 MHz effective throughput
Erase Flexibility Uniform 4KB sector, 32KB block, 64KB block, and chip erase - supports partial firmware updates
Security Registers Three independent 256-byte OTP-capable registers for keys, certificates, or calibration data
SFDP Register JESD216-compliant Serial Flash Discoverable Parameters v1.6 - enables auto-configuration in boot ROM
Unique ID 64-bit factory-programmed serial number - enables device authentication and traceability
Erase/Program Suspend Allows temporary halt of erase/program to service urgent reads - critical for real-time systems

Applications

Boot Code Storage Firmware Over-the-Air (OTA)

Use Scenario: Storing bootloader and initial application code executed directly from flash (XIP) on ARM Cortex-M microcontrollers.

IC Role / Device Role / Timing Role: Primary non-volatile code memory with Quad SPI interface enabling fast instruction fetch at up to 532 MHz effective bandwidth.

Use Value: Eliminates need for external RAM loading; reduces BOM count and boot latency by >40% vs. standard SPI.

Use Scenario: Secure storage of encrypted firmware images updated wirelessly in IoT edge nodes.

IC Role / Device Role / Timing Role: Trusted firmware repository with individual sector lock, SFDP-based timing auto-negotiation, and 64-bit UID for image binding.

Use Value: Enables authenticated, atomic firmware swaps with rollback protection using hardware sector locks.

Industrial HMI Configuration Medical Device Parameter Storage

Use Scenario: Persistent storage of UI themes, language packs, and calibration profiles in panel-mounted HMIs.

IC Role / Device Role / Timing Role: Parameter and asset storage with 4KB sector granularity allowing independent update of UI assets without disturbing system firmware.

Use Value: Supports field-upgradable UIs while maintaining functional safety integrity via isolated sector protection.

Use Scenario: Storing FDA-mandated device configuration logs, sensor calibration constants, and audit trails in portable diagnostics equipment.

IC Role / Device Role / Timing Role: Tamper-resistant parameter memory with 20-year data retention and hardware write-protection via /WP pin and BP bits.

Use Value: Meets IEC 62304 data persistence requirements and simplifies regulatory documentation via deterministic erase endurance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L3233FZNI-10G 32 M-bit, 104 MHz max CLK, no /HOLD pin, SOIC-8 only - lacks Quad I/O and SFDP Lower throughput; no XIP optimization or auto-configuration - suited for cost-sensitive legacy designs Select if Quad SPI and SFDP are unnecessary and SOIC-8 footprint is mandatory
S25FL132K0XMFI010 32 M-bit, 80 MHz max CLK, 1.8 V/3.0 V dual supply, TFBGA24 - includes dedicated /RESET Requires voltage translation; larger footprint; supports hardware reset unavailable on W25Q32JVZEJQ TR Choose when hardware reset signaling is required and board space allows TFBGA

Compared with MX25L3233FZNI-10G and S25FL132K0XMFI010, W25Q32JVZEJQ TR delivers highest throughput (133 MHz Quad SPI), smallest footprint (WSON 8x6-mm), and richest feature set (SFDP, UID, suspend/resume) - ideal for space-constrained, performance-driven industrial designs.

Availability

W25Q32JVZEJQ TR is available at Aetrix Electronics and suitable for industrial control panels, medical diagnostics equipment, and automotive infotainment head units requiring stable component supply across multi-year production cycles.

Supply support for W25Q32JVZEJQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and mobile DRAM - serving industrial, automotive, and communications markets since 1987.

The W25Q series targets high-reliability embedded systems needing fast, secure, and flexible code and data storage - designed specifically for XIP, OTA updates, and parameter retention in harsh environments.

FAQ

Does W25Q32JVZEJQ TR support hardware reset (/RESET pin)?

No, W25Q32JVZEJQ TR does not support hardware reset. It uses an 8-pad WSON 8x6-mm (ZE) package, which omits the dedicated /RESET pin. Hardware reset is only available on SOIC-16 and TFBGA packages. W25Q32JVZEJQ TR relies on software reset (66h + 99h instructions) or power-cycle recovery.

What is the maximum clock frequency supported by W25Q32JVZEJQ TR in Quad SPI mode?

W25Q32JVZEJQ TR supports up to 133 MHz on the CLK pin in Quad SPI mode. With four I/O lines active, this yields an effective data transfer rate of 532 MHz (133 MHz × 4), enabling continuous read speeds up to 66 MB/s using Fast Read Quad I/O (EBh) instruction.

How is Quad SPI enabled on W25Q32JVZEJQ TR?

Quad SPI is enabled by setting the Quad Enable (QE) bit in Status Register-2 (SR2). This bit is non-volatile and must be written using Write Status Register-2 (31h) instruction. Once QE = 1, /WP (Pin 3) and /HOLD (Pin 7) become IO2 and IO3, completing the 4-line I/O interface.

Can W25Q32JVZEJQ TR be used for execute-in-place (XIP) applications?

Yes, W25Q32JVZEJQ TR supports true XIP operation via Fast Read Quad I/O (EBh) and continuous read with wrap. Its 133 MHz Quad SPI interface and low-latency page access enable direct code execution from flash on compatible microcontrollers - eliminating RAM copy overhead.

What package type does W25Q32JVZEJQ TR use, and does it include thermal pad exposure?

W25Q32JVZEJQ TR uses the 8-pad WSON 8×6-mm package (JEDEC MO-241AC, Code ZE) with an exposed thermal pad on the bottom surface. This pad must be soldered to a PCB copper pour for optimal thermal dissipation and mechanical reliability - confirmed in Winbond's Package Specification document (Rev. G, Section 10.5).

W25Q32JVZEJQ TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
32Mbit
Memory Organization:
4M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25Q32JVZEJQ TR FAQ

1.How can I place an order for W25Q32JVZEJQ TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q32JVZEJQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q32JVZEJQ TR reliable?

The price and inventory of W25Q32JVZEJQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q32JVZEJQ TR is usually 5 days.

3.What payment methods are accepted for W25Q32JVZEJQ TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q32JVZEJQ TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q32JVZEJQ TR?

W25Q32JVZEJQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q32JVZEJQ TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q32JVZEJQ TR?

For technical support, including W25Q32JVZEJQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q32JVZEJQ TR requirements.

6.How does Aetrix verify that W25Q32JVZEJQ TR is sourced from the original manufacturer or authorized distributors?

All W25Q32JVZEJQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q32JVZEJQ TR meets industry standards.

7.What is the process for return or replacement of W25Q32JVZEJQ TR?

All W25Q32JVZEJQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q32JVZEJQ TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q32JVZEJQ TR part is unused and in its original packaging.

Return procedure for W25Q32JVZEJQ TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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