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Winbond Electronics Corporation W25Q64BVSFIG

Part No.:
W25Q64BVSFIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25Q64BVSFIG.pdf
Description:
IC FLASH 64MBIT SPI 80MHZ 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,886

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Product details

Overview

W25Q64BVSFIG from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces. It features 256-byte programmable pages, 4KB uniform sectors, and operates from 2.7V–3.6V with 4mA active current and <1µA power-down. Used for code shadowing, XIP execution, and firmware storage in microcontroller-based embedded systems.

For engineers reviewing the W25Q64BVSFIG datasheet, W25Q64BVSFIG pinout, W25Q64BVSFIG application, or W25Q64BVSFIG equivalent, key selection criteria include Quad SPI enable (QE bit), hardware write protection via /WP and /HOLD pins, 80MHz max clock frequency, and SOIC-208mil package compatibility with legacy PCB footprints.

Technical Context

The W25Q64BVSFIG implements a SPI-compatible command set with three operational modes: Standard (DI/DO), Dual (IO0/IO1), and Quad (IO0–IO3). Its internal architecture includes a 256-byte page buffer, sector/block erase logic, and dual status registers - SR1 for BUSY/WEL/BP bits and SR2 for Quad Enable (QE) and OTP control.

Quad SPI mode requires non-volatile QE bit (SR2 bit 1) to be set; once enabled, /WP and /HOLD become IO2 and IO3, disabling hardware write protect and hold functions. The device supports JEDEC-standard manufacturer/device ID (9Fh), 64-bit unique serial number (4Bh), and continuous read mode with ≤8-clock instruction overhead for true execute-in-place operation.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Size64 M-bit (8 MB) organized as 32,768 × 256-byte pages
InterfaceStandard/Dual/Quad SPI with CLK, /CS, IO0–IO3; supports modes 0 and 3
Max Clock Frequency80 MHz (160 MHz equiv. Dual, 320 MHz equiv. Quad)
Erase Granularity4 KB sectors, 32 KB blocks, 64 KB blocks, full chip
Write Endurance100,000 program/erase cycles per sector
Data Retention20 years at +25°C
Supply Voltage2.7 V to 3.6 V; compatible with 3.3 V I/O systems
Operating Temp−40°C to +85°C industrial grade

Pinout & Package

W25Q64BVSFIG uses an 8-pin SOIC-208mil package (package code SS), with gull-wing leads, 208-mil body width, and standard 0.050″ lead pitch. Pin 1 is marked with a notch or dot; pin 4 is GND, pin 8 is VCC.

Pin/TerminalCircuit RoleDesign Meaning
1 /CSChip Select InputActive-low enable; high impedance DO when deasserted; required low-to-high transition before new instruction acceptance
2 DO (IO1)Data Output / I/O1Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI; used for status/data reads on falling CLK edge
3 /WP (IO2)Write Protect Input / I/O2Hardware write lock for status register when QE=0; becomes IO2 in Quad mode (QE=1), disabling /WP function
4 GNDGround ReferencePrimary return path for VCC and I/O signals; must be low-impedance connection for stable timing and noise immunity
5 DI (IO0)Data Input / I/O0Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI; accepts instructions/addresses/data on rising CLK edge
6 CLKSerial Clock InputMaster-generated timing signal; supports SPI modes 0 and 3; max 80 MHz frequency determines throughput ceiling
7 /HOLD (IO3)Hold Input / I/O3Pauses ongoing SPI transaction when asserted low (with /CS low); becomes IO3 in Quad mode (QE=1), disabling /HOLD function
8 VCCPower Supply2.7–3.6 V supply; internal voltage regulators support stable core operation; decoupling capacitor required near pin

Key Features

FeatureDesign Value
Quad SPI Enable (QE bit)Non-volatile SR2 bit 1 controls IO2/IO3 remapping; enables 320 MHz equivalent bandwidth but disables /WP and /HOLD hardware functions
Continuous Read Mode≤8-clock instruction overhead per 24-bit address access; enables deterministic XIP execution without prefetch stalls
Flexible Erase ArchitectureUniform 4 KB sectors allow fine-grained firmware parameter updates without disturbing adjacent code regions
Hardware Write Protection/WP pin + SR BP bits provide layered protection: top/bottom array selection, sector/block granularity, and SR lock-down
Unique Device Identification64-bit factory-programmed serial number (read via 4Bh instruction) enables secure boot binding and field traceability
JEDEC ComplianceSupports standard 9Fh JEDEC ID read and 90h manufacturer/device ID - ensures interoperability with generic flash programmers and OS drivers

Applications

Boot Code StorageFirmware Over-the-Air (OTA) Update

Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M or RISC-V microcontrollers during cold start.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable Quad SPI interface enabling direct CPU instruction fetch without RAM copy.

Use Value: Reduces BOM cost and boot latency by eliminating external RAM requirement for initial code load; supports secure hash verification of 4KB sectors pre-execution.

Use Scenario: Receiving encrypted firmware patches via Wi-Fi or cellular modem and validating/staging them before atomic update.

IC Role / Device Role / Timing Role: Dual-bank capable storage partition: one bank active, one reserved for validated update image; uses sector erase for safe swap.

Use Value: Enables fail-safe OTA with rollback capability; 4KB sector granularity allows patch-level updates without erasing full application image.

Industrial HMI ConfigurationAutomotive Telematics Log Buffer

Use Scenario: Persisting UI language packs, calibration data, and user preferences in human-machine interface panels.

IC Role / Device Role / Timing Role: Parameter storage with hardware /WP pin tied low during normal operation to prevent accidental corruption.

Use Value: Eliminates need for battery-backed SRAM; 100K-cycle endurance supports daily configuration changes over 10+ year product life.

Use Scenario: Cyclic logging of GPS position, CAN bus diagnostics, and sensor health metrics in vehicle telematics gateways.

IC Role / Device Role / Timing Role: Circular buffer implemented across 64KB blocks; uses 32KB block erase for efficient wraparound management.

Use Value: Sustains 100+ log entries/sec sustained write rate with deterministic 35 ms block erase time; −40°C to +85°C rating matches under-hood environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
W25Q64JVSIMNewer Winbond generation with enhanced security (Secure OTP, AES-256), same pinout and command set; supports 133 MHz Quad SPIRequired where cryptographic key storage or secure boot enforcement is mandatedSelect W25Q64JVSIM if long-term security roadmap alignment or higher throughput (>80 MHz) is needed; W25Q64BVSFIG remains valid for cost-sensitive, legacy-compatible designs
MX25L6433FZNI-10GMacronix part with identical 64M-bit density, SOIC-208 package, and Quad SPI support; differs in status register layout and QE activation methodSuitable for drop-in replacement only after verifying SR bit mapping and initialization sequence in firmwareChoose MX25L6433FZNI-10G when dual-sourcing is required and firmware can accommodate minor register-level differences; not pin-and-command identical

Compared with W25Q64JVSIM, the W25Q64BVSFIG offers proven industrial reliability at lower unit cost but lacks modern security extensions; versus MX25L6433FZNI-10G, it provides guaranteed Winbond firmware compatibility and simpler status register handling, though with slightly lower max clock speed.

Availability

W25Q64BVSFIG is available at Aetrix Electronics and suitable for boot code storage, firmware OTA updates, and industrial HMI configuration requiring stable component supply across multi-year production cycles.

Supply support for W25Q64BVSFIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash and PSRAM, serving automotive, industrial, and consumer markets since 1987.

The W25Q series was designed specifically for embedded systems needing high-reliability, low-power, and flexible interface options - prioritizing XIP capability, sector-level erase control, and hardware write protection for firmware integrity.

FAQ

What is the package type and lead count of the W25Q64BVSFIG?

The W25Q64BVSFIG uses an 8-pin SOIC-208mil package (package code SS) with gull-wing leads and 0.050″ pitch. It is footprint-compatible with legacy 208-mil SOIC sockets and reflow profiles. This package is distinct from the 16-pin SOIC-300mil or WSON-8x6mm variants in the W25Q64BV family, and the 'SFIG' suffix explicitly denotes the SOIC-208mil variant of the W25Q64BVSFIG.

Does the W25Q64BVSFIG support Quad SPI mode, and how is it enabled?

Yes, the W25Q64BVSFIG supports Quad SPI mode using IO0–IO3 pins. It is enabled by setting the Quad Enable (QE) bit (bit 1 of Status Register-2) via the Write Status Register instruction (01h). Once set, /WP and /HOLD pins become IO2 and IO3 respectively, and hardware write protect/hold functions are disabled. The QE bit is non-volatile and persists across power cycles.

What is the maximum clock frequency supported by the W25Q64BVSFIG in different SPI modes?

The W25Q64BVSFIG supports up to 80 MHz in Standard and Dual SPI modes. In Quad SPI mode, it achieves 320 MHz equivalent throughput using Fast Read Quad I/O (EBh) or Octal Word Read Quad I/O (E3h) instructions. These rates assume proper signal integrity, controlled impedance routing, and compliant AC timing margins per the datasheet's electrical characteristics table.

How does hardware write protection work on the W25Q64BVSFIG?

Hardware write protection on the W25Q64BVSFIG is implemented via the /WP pin (Pin 3), which - when held low - prevents writes to the status register when the Quad Enable (QE) bit is clear (QE=0). When QE=1, /WP becomes IO2 and hardware protection is disabled. Software protection via Block Protect (BP) bits and Status Register Protect (SRP) bits remains active regardless of /WP state.

What erase granularities are available on the W25Q64BVSFIG, and how many sectors/blocks does it contain?

The W25Q64BVSFIG supports four erase granularities: 4 KB sectors (2,048 total), 32 KB blocks (1,024 total), 64 KB blocks (512 total), and full-chip erase. Sector erase is ideal for parameter updates; block erase optimizes large firmware image writes. All erase operations are internally timed and verified, with typical sector erase taking 35 ms and chip erase ~30 seconds.

W25Q64BVSFIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI
Clock Frequency:
80 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25Q64BVSFIG FAQ

1.How can I place an order for W25Q64BVSFIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64BVSFIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64BVSFIG reliable?

The price and inventory of W25Q64BVSFIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64BVSFIG is usually 5 days.

3.What payment methods are accepted for W25Q64BVSFIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64BVSFIG transactions.

Note: Certain payment methods may incur a processing fee.

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W25Q64BVSFIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64BVSFIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64BVSFIG?

For technical support, including W25Q64BVSFIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64BVSFIG requirements.

6.How does Aetrix verify that W25Q64BVSFIG is sourced from the original manufacturer or authorized distributors?

All W25Q64BVSFIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64BVSFIG meets industry standards.

7.What is the process for return or replacement of W25Q64BVSFIG?

All W25Q64BVSFIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64BVSFIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64BVSFIG part is unused and in its original packaging.

Return procedure for W25Q64BVSFIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q64BVSFIG Tags

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