Winbond Electronics Corporation W25Q64BVSSIG

Overview

W25Q64BVSSIG from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces. It features 32,768 pages of 256 bytes each, 4KB uniform sectors, and operates on a single 2.7–3.6V supply with 4mA active current and <1µA power-down current. It enables execute-in-place (XIP) code execution in embedded microcontrollers and stores firmware, boot code, and configuration data.

For engineers reviewing the W25Q64BVSSIG datasheet, W25Q64BVSSIG pinout, W25Q64BVSSIG application, or W25Q64BVSSIG equivalent, key selection criteria include Quad SPI support up to 80MHz clock (320MHz equivalent), hardware write protection via /WP and /HOLD pins, JEDEC ID and 64-bit unique serial number, and compatibility with industrial temperature range (−40°C to +85°C).

Technical Context

The W25Q64BVSSIG implements a SPI-compatible command set with three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), where Quad mode requires the non-volatile Quad Enable (QE) bit in Status Register-2 to be set. Its internal architecture includes a 256-byte page buffer, sector/block erase logic, and dual-status registers for flexible protection control.

It supports continuous read mode with only 8-clock instruction overhead for 24-bit address access-enabling true XIP operation-and integrates hardware-level write protection via /WP pin (active-low, disabled in Quad mode) and /HOLD pin (active-low, suspended during Quad mode). Erase granularity includes 4KB sectors, 32KB blocks, 64KB blocks, and full-chip erase.

Key Specifications

Pinout & Package

W25Q64BVSSIG uses an 8-pin SOIC 208-mil package (package code SS), with gull-wing leads, 1.27 mm pitch, and body dimensions of 5.3 mm × 5.3 mm × 1.95 mm. Pin 1 is marked by a notch or dot; pin 4 is GND and pin 5 is VCC.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Compared with MX25L6406EM2I-12G and S25FL164K0XMFI011, W25Q64BVSSIG delivers balanced performance with native Quad SPI, industrial temp rating, and integrated UID-making it optimal for cost-sensitive yet secure embedded boot applications without requiring QPI or >100k cycle endurance.

Availability

W25Q64BVSSIG is available at Aetrix Electronics and suitable for boot code storage, firmware update storage, configuration parameter storage, and IoT edge device identity applications requiring stable component supply, long-lifecycle support, and consistent parametric performance.

Supply support for W25Q64BVSSIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial NOR/NAND flash, RAM, and mobile DRAM, serving industrial, communications, and consumer markets.

The W25Q series was designed specifically for embedded systems requiring high-speed, low-power, and secure code and data storage-emphasizing XIP capability, flexible protection, and industrial-grade reliability.

FAQ

What is the maximum SPI clock frequency supported by the W25Q64BVSSIG?

The W25Q64BVSSIG supports SPI clock frequencies up to 80 MHz in Standard and Dual SPI modes. In Quad SPI mode, this enables effective data transfer rates up to 320 MB/s due to four-bit-wide data transfers per clock cycle. This specification is guaranteed across the full −40°C to +85°C operating range and is validated in the AC Electrical Characteristics section of the official datasheet.

Does the W25Q64BVSSIG support execute-in-place (XIP) operation?

Yes, the W25Q64BVSSIG supports true XIP operation via its Continuous Read Mode, which requires only 8 clock cycles to initiate a read after address setup. This low instruction overhead enables deterministic instruction fetch timing directly from flash, eliminating the need to copy code to RAM before execution-a key requirement for resource-constrained MCUs in boot and real-time applications.

How is Quad SPI mode enabled on the W25Q64BVSSIG?

Quad SPI mode on the W25Q64BVSSIG is enabled by setting the Quad Enable (QE) bit in Status Register-2 using the Write Status Register (01h) instruction. Once set, the /WP and /HOLD pins become IO2 and IO3 respectively. The QE bit is non-volatile and persists across power cycles, but the device must be configured in Quad mode before issuing Quad I/O instructions like EBh or 6Bh.

What package type does the W25Q64BVSSIG use, and what are its mechanical dimensions?

The W25Q64BVSSIG uses an 8-pin SOIC 208-mil package (package code SS), with body dimensions of 5.3 mm × 5.3 mm × 1.95 mm and 1.27 mm lead pitch. Pin 1 is identified by a notch or dot; the package is RoHS-compliant and rated for reflow soldering per J-STD-020. This footprint is compatible with standard SOIC-8 PCB footprints and automated assembly processes.

Can the W25Q64BVSSIG be used in industrial temperature applications?

Yes, the W25Q64BVSSIG is fully specified for industrial temperature operation from −40°C to +85°C. Its electrical characteristics-including read/write timing, voltage thresholds, and endurance-are guaranteed across this range. This makes it suitable for deployment in industrial PLCs, motor drives, and outdoor IoT gateways where ambient temperature extremes are expected.