Winbond Electronics Corporation W25Q64CVTBIP

Overview

W25Q64CVTBIP from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting standard, dual, and quad SPI interfaces with up to 80MHz clock frequency, 4KB uniform sector architecture, and hardware write protection via /WP and /HOLD pins - deployed in embedded boot code storage, firmware update partitions, and XIP-capable microcontroller systems.

For engineers reviewing the W25Q64CVTBIP datasheet, W25Q64CVTBIP pinout, W25Q64CVTBIP application, or W25Q64CVTBIP equivalent, key selection criteria include quad I/O enable (QE bit), 4mA active current draw, 1µA power-down current, JEDEC ID read capability (9Fh), and TFBGA-24 (8x6mm) package compatibility with industrial temperature range (-40°C to +85°C).

Technical Context

The W25Q64CVTBIP implements a SPI-compatible command set with three operational modes: standard (4-wire), dual (5-wire), and quad (6-wire), where IO0–IO3 are dynamically reassigned from DI/DO/WP/HOLD upon setting the Quad Enable (QE) bit in Status Register-2. It supports continuous read mode with ≤8-clock instruction overhead and wrap lengths of 8/16/32/64 bytes for true execute-in-place (XIP) operation.

Internally organized into 32,768 pages of 256 bytes each, it provides hierarchical erase granularity: 4KB sectors (2,048 total), 32KB blocks (1,024), 64KB blocks (512), and full-chip erase. Erase/program suspend/resume functionality enables concurrent background operations without interrupting host control flow.

Key Specifications

Pinout & Package

W25Q64CVTBIP is packaged in a 24-ball TFBGA (8×6 mm, package code TC), with ball pitch of 0.8 mm and bottom-side solder pads. This compact, surface-mount package supports high-density PCB layouts and automated reflow assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI011, W25Q64CVTBIP offers optimal balance of industrial temperature support, TFBGA-24 compactness, Quad I/O suspend/resume, and proven ecosystem integration - making it the preferred choice for new industrial and automotive designs requiring field-updatable firmware with minimal footprint.

Availability

W25Q64CVTBIP is available at Aetrix Electronics and suitable for boot code storage, firmware update partitions, secure configuration storage, and IoT edge node data logging requiring stable component supply across industrial, automotive, and medical product lifecycles.

Supply support for W25Q64CVTBIP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including serial NOR/NAND flash and PSRAM, with over 30 years of process and reliability expertise.

The W25Q series was designed specifically for embedded systems requiring high-speed, low-power, and secure code and data storage - emphasizing XIP capability, robust write protection, and JEDEC-standard interoperability.

FAQ

What is the package type and pin count of the W25Q64CVTBIP?

The W25Q64CVTBIP uses a 24-ball TFBGA package measuring 8 mm × 6 mm with 0.8 mm ball pitch. It has no traditional pins; instead, it features 24 solder balls arranged in a 6×4 array (package code TC), optimized for high-density PCB layouts and automated assembly. This matches the official Winbond specification for the TBIP suffix variant.

Does the W25Q64CVTBIP support Quad SPI mode, and what is required to enable it?

Yes, the W25Q64CVTBIP supports Quad SPI mode using instructions such as Fast Read Quad I/O (EBh). To enable it, the non-volatile Quad Enable (QE) bit in Status Register-2 must be set to '1' via the Write Status Register (01h) instruction. Once enabled, /WP and /HOLD become IO2 and IO3, respectively - a hardware-level reconfiguration confirmed in the datasheet Section 4.2 and Figure 1e.

What is the minimum and maximum operating voltage for the W25Q64CVTBIP?

The W25Q64CVTBIP operates across a single supply range of 2.7 V to 3.6 V, as specified in Section 8.2 (Operating Ranges) of the datasheet. Operation below 2.7 V may cause unreliable status register reads or failed program/erase cycles; above 3.6 V risks permanent damage. This range aligns with standard 3.3 V logic systems and supports industrial-grade voltage tolerance.

How many erase cycles does the W25Q64CVTBIP guarantee per sector?

The W25Q64CVTBIP guarantees more than 100,000 program/erase cycles per 4KB sector under industrial temperature conditions (−40°C to +85°C), as stated in Section 2 (Features) and validated per AEC-Q100 test methodology. This endurance rating applies to individual sectors - not the full array - and supports long-term field updates in automotive and industrial firmware applications.

Can the W25Q64CVTBIP be used for Execute-in-Place (XIP) applications?

Yes, the W25Q64CVTBIP supports true XIP operation via its Continuous Read Mode, which reduces instruction overhead to as few as 8 clock cycles for address setup and enables seamless wrap lengths (8/16/32/64 bytes). When paired with a compatible microcontroller SPI memory controller (e.g., STM32 OCTOSPI or NXP FlexSPI), W25Q64CVTBIP allows direct code execution without RAM loading - verified in Application Note AN111.