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Winbond Electronics Corporation W25Q64CVZEAG
- Part No.:
- W25Q64CVZEAG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q64CVZEAG.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:3,653
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Product details
Overview
W25Q64CVZEAG from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting standard, dual, and quad SPI interfaces with up to 80MHz clock frequency, 4KB uniform sector architecture, and 1µA power-down current. It enables execute-in-place (XIP) code execution, firmware storage, and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25Q64CVZEAG datasheet, W25Q64CVZEAG pinout, W25Q64CVZEAG application, or W25Q64CVZEAG equivalent, key selection considerations include quad I/O support (QE bit required), hardware write protection via /WP and /HOLD pins, 4KB sector erase granularity, JEDEC ID and SFDP register compliance, and TFBGA-24 (8x6mm) package compatibility.
Technical Context
The W25Q64CVZEAG implements a SPI command set compliant with JEDEC JESD216 for SFDP, supports Mode 0/3 clock polarity, and uses bidirectional IO0–IO3 pins in Quad SPI mode when the non-volatile Quad Enable (QE) bit in Status Register-2 is set. Its block diagram integrates a 256-byte page buffer, status register logic, and high-voltage generators for erase/program operations.
It features three independent 256-byte security registers with OTP locks, programmable top/bottom 4KB sector protection via BP2–BP0 and TB bits, and suspend/resume capability for erase/program cycles - enabling concurrent background operations without host intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 M-bit (8 MB); supports firmware images up to 8 megabytes in size |
| Interface | Standard/Dual/Quad SPI; requires QE=1 for quad I/O mode (IO0–IO3 active) |
| Max Clock Frequency | 80 MHz; enables 320 MHz equivalent data rate in Quad I/O mode |
| Erase Granularity | 4 KB sectors (2,048 total), 32 KB blocks (1,024), 64 KB blocks (128), or full chip |
| Program/Erase Endurance | 100,000 cycles (industrial temp range); ensures long-term field reliability |
| Data Retention | 20 years at +85°C; validated for industrial lifecycle requirements |
| Supply Voltage | 2.7 V to 3.6 V; compatible with 3.3 V logic domains without level shifting |
| Power Consumption | 4 mA active (typ.), <1 µA power-down (typ.); reduces system standby power budget |
Pinout & Package
W25Q64CVZEAG is packaged in a 24-ball TFBGA (8×6 mm, package code TC), with ball pitch of 0.8 mm and RoHS-compliant matte tin finish. Pin functions are defined per JEDEC MO-249 standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B2 | CLK | Input: Serial clock timing reference; must meet tCH/tCL min/max specs for 80 MHz operation |
| B3 | GND | Ground reference for all I/O and core logic; requires low-inductance PCB connection |
| B4 | VCC | Primary power supply (2.7–3.6 V); decoupling capacitor (100 nF) required within 5 mm |
| C2 | /CS | Active-low chip select; must transition high→low before instruction acceptance post-power-up |
| C4 | /WP (IO2) | In Standard/Dual SPI: hardware write protect; in Quad SPI: bidirectional data I/O2 (QE=1) |
| D2 | DO (IO1) | In Standard SPI: unidirectional output; in Dual/Quad SPI: bidirectional I/O1 |
| D3 | DI (IO0) | In Standard SPI: unidirectional input; in Dual/Quad SPI: bidirectional I/O0 |
| D4 | /HOLD (IO3) | In Standard/Dual SPI: active-low pause control; in Quad SPI: bidirectional I/O3 (QE=1) |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode | Enables true XIP with ≤8-clock instruction overhead; eliminates address latching latency |
| Quad SPI Support | Requires QE bit set; unlocks 320 MHz equivalent bandwidth using IO0–IO3 simultaneously |
| Security Registers | Three 256-byte OTP-lockable registers for secure key or calibration data storage |
| Flexible Protection | Hardware /WP + software BP/TB/CMP bits allow mixed sector-level and full-array lock-down |
| SFDP Compliance | JESD216-compliant Serial Flash Discoverable Parameters register enables auto-configuration |
| Unique ID | 64-bit factory-programmed serial number for device authentication and traceability |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Code |
|---|---|
|
Use Scenario: Storing firmware images and configuration parameters in programmable logic controllers operating in harsh temperature environments (-40°C to +85°C). IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic read latency and sector-level update capability during field upgrades. Use Value: 4KB sector erase enables atomic firmware patching without disrupting operational code; 100K endurance supports >5 years of scheduled updates. |
Use Scenario: Hosting boot code and sensor calibration data for automotive camera and radar modules requiring AEC-Q100 alignment. IC Role / Device Role / Timing Role: Primary SPI flash for ASIL-B–compliant boot path, interfacing directly with MCU's QSPI controller. Use Value: Quad I/O mode delivers 320 MHz effective bandwidth for fast boot time (<100 ms); unique ID enables ECU-level firmware binding. |
| Medical IoT Sensor Node | Consumer Wi-Fi Router Firmware |
|
Use Scenario: Retaining calibrated sensor offsets and patient history logs in battery-powered portable diagnostic devices. IC Role / Device Role / Timing Role: Low-power parameter store with hardware write protection to prevent accidental corruption during brown-out events. Use Value: <1 µA power-down current extends battery life; /WP pin hardwires protection independent of MCU state. |
Use Scenario: Storing Linux kernel, root filesystem, and wireless stack binaries in compact home gateway platforms. IC Role / Device Role / Timing Role: High-density SPI flash enabling dual-image OTA updates with rollback capability. Use Value: 8MB capacity accommodates full firmware + recovery image; SFDP register allows automatic driver initialization across SoC variants. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L6433FZNI-10G | 64 M-bit, 104 MHz max clock, 1.65–2.0 V core voltage; no Quad Enable bit dependency | Requires separate 1.8 V supply rail; lacks SFDP register and 64-bit UID | Select when lower voltage operation or simpler quad enable logic is prioritized over configurability |
| S25FL164K0XMFI010 | 64 M-bit, 80 MHz, 2.7–3.6 V; includes on-die ECC and configurable reset pin behavior | Supports hardware reset recovery; higher pin count (16-pin SOIC option only) | Prefer for safety-critical designs needing ECC correction and deterministic reset response |
Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, the W25Q64CVZEAG offers superior configurability via SFDP and UID, tighter integration with modern QSPI controllers, and broader package options - making it optimal for cost-sensitive, high-volume embedded designs requiring field-upgradable firmware.
Availability
W25Q64CVZEAG is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot code, and medical IoT sensor node applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for W25Q64CVZEAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR flash, PSRAM, and mobile DRAM for embedded and industrial markets.
The W25Q series was designed specifically for high-reliability, low-pin-count firmware and code storage in resource-constrained microcontroller-based systems - emphasizing speed, security, and seamless integration with ARM Cortex-M and RISC-V QSPI peripherals.
FAQ
What is the package type and footprint for W25Q64CVZEAG?
W25Q64CVZEAG uses a 24-ball TFBGA package measuring 8 mm × 6 mm with 0.8 mm ball pitch (JEDEC MO-249, package code TC). It is not pin-compatible with SOIC or WSON variants of the W25Q64CV family. The ball layout matches Winbond's standard TFBGA-24 footprint, and PCB land patterns must follow IPC-7351B Class B guidelines for reliable solder joint formation.
Does W25Q64CVZEAG support Quad SPI mode out of the box?
No - W25Q64CVZEAG requires the Quad Enable (QE) bit in Status Register-2 to be set to '1' before Quad SPI instructions (e.g., 0x6B, 0xEB) will function. This is a non-volatile setting; once programmed, QE remains active until explicitly cleared. Standard and Dual SPI operations work immediately after power-up without configuration.
How does hardware write protection work on W25Q64CVZEAG?
W25Q64CVZEAG provides dual-layer write protection: hardware-level via the /WP pin (active-low, disables Status Register writes when asserted), and software-level via Block Protect (BP2–BP0), Top/Bottom (TB), and Complement (CMP) bits. When /WP is held low and SRP0/SRP1 are set, even software commands cannot modify protected sectors - ensuring immunity to firmware bugs or malware.
Can W25Q64CVZEAG be used for Execute-in-Place (XIP) applications?
Yes - W25Q64CVZEAG supports true XIP via Continuous Read Mode, which minimizes instruction overhead to just 8 clocks for address setup. Combined with Fast Read Quad I/O (0xEB), it delivers sustained 320 MHz effective bandwidth, enabling direct code execution from flash by compatible MCUs (e.g., STM32H7, NXP i.MX RT) without RAM shadowing.
What is the purpose of the SFDP register in W25Q64CVZEAG?
The SFDP (Serial Flash Discoverable Parameters) register in W25Q64CVZEAG (accessed via instruction 0x5A) provides standardized, vendor-agnostic configuration data - including erase block sizes, timing parameters, and supported instruction sets. This allows host bootloaders and drivers to auto-detect and configure the flash without hardcoded assumptions, improving firmware portability across different Winbond or third-party SPI flash devices.
W25Q64CVZEAG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- 6 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25Q64CVZEAG FAQ
1.How can I place an order for W25Q64CVZEAG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q64CVZEAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q64CVZEAG reliable?
The price and inventory of W25Q64CVZEAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64CVZEAG is usually 5 days.
3.What payment methods are accepted for W25Q64CVZEAG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64CVZEAG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q64CVZEAG?
W25Q64CVZEAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q64CVZEAG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q64CVZEAG?
For technical support, including W25Q64CVZEAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64CVZEAG requirements.
6.How does Aetrix verify that W25Q64CVZEAG is sourced from the original manufacturer or authorized distributors?
All W25Q64CVZEAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64CVZEAG meets industry standards.
7.What is the process for return or replacement of W25Q64CVZEAG?
All W25Q64CVZEAG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64CVZEAG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q64CVZEAG part is unused and in its original packaging.
Return procedure for W25Q64CVZEAG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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