Winbond Electronics Corporation W25Q64CVZEIG
- Part No.:
- W25Q64CVZEIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q64CVZEIG.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:

- Shipping:

Inventory:4,086
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Product details
Overview
W25Q64CVZEIG from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with 80MHz clock rate, 4KB uniform sector architecture, and hardware write protection via /WP and /HOLD pins - used for code storage, XIP execution, and firmware parameter retention in embedded microcontrollers.
For engineers reviewing the W25Q64CVZEIG datasheet, W25Q64CVZEIG pinout, W25Q64CVZEIG application, or W25Q64CVZEIG equivalent, key selection criteria include Quad SPI enable (QE bit), 4KB sector erase granularity, JEDEC ID compatibility, SFDP register support, and WSON 8x6-mm (ZE) package footprint validation.
Technical Context
The W25Q64CVZEIG implements a SPI command-set architecture with three operational modes: Standard (DI/DO), Dual (IO0/IO1), and Quad (IO0–IO3), where Quad mode requires non-volatile QE bit = 1 in Status Register-2. It features a 256-byte page buffer, 2,048 erasable 4KB sectors, and 128 erasable 64KB blocks.
Its dual-function pins (/WP and /HOLD) serve as IO2 and IO3 only when QE=1; otherwise they retain hardware protection roles. The device supports continuous read mode with ≤8-clock instruction overhead and true execute-in-place (XIP) capability using Fast Read Quad I/O (EBh) at up to 320MHz effective throughput.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 M-bit (8 MB) - supports full firmware images for mid-complexity MCUs without external memory expansion. |
| Sector Size | 4 KB uniform sectors - enables fine-grained firmware update and parameter storage without erasing unrelated data. |
| Max SPI Clock | 80 MHz - delivers 320 MB/s effective bandwidth in Quad I/O mode, exceeding parallel flash in density-normalized throughput. |
| Write/Erase Endurance | 100,000 cycles - ensures reliable field updates over product lifetime in industrial control and IoT edge nodes. |
| Data Retention | 20 years at +85°C - validated for automotive and industrial applications requiring long-term nonvolatile storage integrity. |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3 V logic domains and low-power battery-backed systems. |
| Operating Temp | −40°C to +85°C - meets extended industrial temperature requirements without derating. |
| Unique ID | 64-bit serial number - enables secure device authentication and firmware binding in certified deployments. |
Pinout & Package
W25Q64CVZEIG uses the 8-pad WSON 8×6-mm package (JEDEC MO-241AC, package code ZE), with exposed thermal pad. Pin functions are identical to SOIC/PDIP variants but optimized for space-constrained PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable: high-impedance DO/IO outputs and standby current (<1 µA) when deasserted. |
| DO (IO1) | Serial Data Output / Quad I/O 1 | Unidirectional output in Standard SPI; bidirectional in Dual/Quad modes - carries read data or status responses. |
| /WP (IO2) | Write Protect Input / Quad I/O 2 | Hardware lock for Status Register when QE=0; becomes IO2 in Quad mode - requires external pull-up if unused. |
| GND | Ground Reference | Primary return path for VCC and all I/O signals - must be low-inductance connection for signal integrity. |
| DI (IO0) | Serial Data Input / Quad I/O 0 | Unidirectional input in Standard SPI; bidirectional in Dual/Quad modes - receives commands, addresses, and program data. |
| CLK | Serial Clock Input | Edge-triggered timing reference - rising edge for input sampling, falling edge for output valid window per SPI Mode 0/3. |
| /HOLD (IO3) | Hold Input / Quad I/O 3 | Pauses active SPI transaction when asserted low (Standard/Dual only); becomes IO3 in Quad mode - enables multi-device bus sharing. |
| VCC | Power Supply | Single 2.7–3.6 V supply - decoupling capacitor (≥1 µF) required within 5 mm of pin for stable erase/program operation. |
Key Features
| Feature | Design Value |
|---|---|
| Dual/Quad SPI Interface | Enables 160/320 MHz effective data rates - eliminates need for wider parallel buses while maintaining XIP performance. |
| Continuous Read Mode | As few as 8 clocks to initiate address fetch - reduces CPU wait states and improves real-time deterministic latency in boot loaders. |
| Erase/Program Suspend | Interrupts background erase/program to service higher-priority reads - critical for real-time logging and OTA update coexistence. |
| Security Registers | Three 256-byte OTP-locked registers - store cryptographic keys or calibration data immune to field reprogramming. |
| SFDP Register | JEDEC JESD216-compliant descriptor - allows automatic driver configuration without hard-coded timing or geometry parameters. |
| Top/Bottom Block Protection | Independent 4KB–64KB hardware lock zones - isolates bootloader region from application firmware corruption during remote updates. |
Applications
| Bootloader Storage | Firmware Over-the-Air (OTA) |
|---|---|
Use Scenario: Storing immutable bootloader code in embedded systems requiring fail-safe recovery after corrupted application updates. IC Role / Device Role / Timing Role: Nonvolatile code storage with hardware-protected top sectors - prevents accidental overwrite during application-level flash operations. Use Value: Enables atomic firmware swaps and A/B partitioning with guaranteed boot validity, reducing field failure risk by eliminating unbootable states. | Use Scenario: Receiving and validating encrypted firmware images in connected IoT devices operating on constrained bandwidth networks. IC Role / Device Role / Timing Role: High-reliability storage for staged firmware binaries - leverages 4KB sector erase to isolate new image before activation. Use Value: Supports delta updates and partial writes without disrupting active runtime, minimizing downtime and network payload size. |
| Real-Time Data Logging | Industrial HMI Configuration |
Use Scenario: Capturing sensor timestamps and alarm events in PLCs or motor drives where power loss may occur unpredictably. IC Role / Device Role / Timing Role: Parameter and event log storage with suspend/resume erase capability - preserves in-progress writes during interrupt-driven control loops. Use Value: Guarantees last-known-good state capture even during brownout, enabling post-failure diagnostics without volatile RAM dependency. | Use Scenario: Storing display layouts, language packs, and calibration offsets in human-machine interface panels deployed in factory environments. IC Role / Device Role / Timing Role: Field-updatable configuration repository - uses top/bottom block protection to lock UI framework while allowing user-defined content updates. Use Value: Eliminates need for factory reflash during commissioning or localization, accelerating deployment across global manufacturing sites. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L6433FZNI-10G | 64 M-bit, 104 MHz max Quad SPI clock, 1.65–2.0 V supply - lower voltage, higher speed, different SFDP layout. | Requires level-shifting for 3.3 V systems; lacks /HOLD pin in 8-pin WSON variant. | Select when designing for ultra-low-power battery systems with compatible voltage rails and no hold functionality needed. |
| S25FL164K0XMFI010 | 64 M-bit, 80 MHz Quad SPI, 2.7–3.6 V, includes configurable reset pin and enhanced security lock bits. | Supports hardware reset assertion and additional OTP lock granularity - not pin-compatible with W25Q64CVZEIG's WSON-8 package. | Choose for safety-critical applications requiring certified reset behavior and stricter key isolation beyond standard security registers. |
Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, W25Q64CVZEIG offers broader pinout compatibility across SOIC/WSON/TFBGA packages, proven 20-year retention at +85°C, and seamless integration with legacy SPI controllers lacking reset or dual-supply support.
Availability
W25Q64CVZEIG is available at Aetrix Electronics and suitable for bootloader storage, firmware OTA updates, and real-time data logging requiring stable component supply, long-lifecycle assurance, and drop-in replacement readiness across industrial and automotive programs.
Supply support for W25Q64CVZEIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR/NAND flash, PSRAM, and mobile DRAM.
The W25Q series targets embedded systems needing high-speed, low-pin-count nonvolatile storage - designed specifically for code execution, firmware updates, and secure parameter retention in resource-constrained MCUs.
FAQ
What is the package type and footprint of W25Q64CVZEIG?
W25Q64CVZEIG uses an 8-pad WSON 8×6-mm package (JEDEC MO-241AC, package code ZE) with exposed thermal pad. Its footprint matches standard WSON-8 land patterns and is distinct from the smaller 6×5-mm ZP variant. Pinout is identical to SOIC-8 and PDIP-8 versions, simplifying migration across form factors.
Does W25Q64CVZEIG support Quad SPI mode out of the box?
No - W25Q64CVZEIG requires the Quad Enable (QE) bit in Status Register-2 to be set to 1 to activate Quad SPI mode. Until configured, /WP and /HOLD function as hardware write protect and hold inputs. The QE bit is non-volatile and persists across power cycles once programmed.
How many erase cycles does W25Q64CVZEIG guarantee?
W25Q64CVZEIG guarantees more than 100,000 program/erase cycles per sector under industrial temperature conditions (−40°C to +85°C). This endurance rating applies to 4KB sector, 32KB block, 64KB block, and chip erase operations - validated per JEDEC standards.
Can W25Q64CVZEIG be used for Execute-in-Place (XIP) applications?
Yes - W25Q64CVZEIG supports true XIP via Continuous Read Mode and Fast Read Quad I/O (EBh) instructions. With ≤8-clock instruction overhead and 320 MHz effective throughput, it enables direct code execution from flash without shadowing to RAM, reducing SRAM usage and boot latency.
What unique identification capability does W25Q64CVZEIG provide?
W25Q64CVZEIG includes a factory-programmed 64-bit unique serial number accessible via Read Unique ID Number (4Bh) instruction. This identifier is globally unique per device and supports secure provisioning, anti-cloning, and firmware binding in certified IoT and industrial deployments.
W25Q64CVZEIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25Q64CVZEIG FAQ
1.How can I place an order for W25Q64CVZEIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q64CVZEIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q64CVZEIG reliable?
The price and inventory of W25Q64CVZEIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64CVZEIG is usually 5 days.
3.What payment methods are accepted for W25Q64CVZEIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64CVZEIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q64CVZEIG?
W25Q64CVZEIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q64CVZEIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q64CVZEIG?
For technical support, including W25Q64CVZEIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64CVZEIG requirements.
6.How does Aetrix verify that W25Q64CVZEIG is sourced from the original manufacturer or authorized distributors?
All W25Q64CVZEIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64CVZEIG meets industry standards.
7.What is the process for return or replacement of W25Q64CVZEIG?
All W25Q64CVZEIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64CVZEIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q64CVZEIG part is unused and in its original packaging.
Return procedure for W25Q64CVZEIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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