Winbond Electronics Corporation W25Q64CVZEJG
- Part No.:
- W25Q64CVZEJG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q64CVZEJG.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W25Q64CVZEJG from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with up to 80MHz clock frequency, 4KB uniform sector architecture, and hardware write protection via /WP and /HOLD pins - deployed in embedded boot code storage, firmware update partitions, and XIP-capable microcontroller systems.
For engineers reviewing the W25Q64CVZEJG datasheet, W25Q64CVZEJG pinout, W25Q64CVZEJG application, or W25Q64CVZEJG equivalent, key selection criteria include Quad SPI enable (QE bit), 4KB sector erase granularity, JEDEC ID and SFDP register support, continuous read mode timing, and compatibility with 2.7–3.6V supply and -40°C to +85°C industrial operation.
Technical Context
The W25Q64CVZEJG implements a SPI command-set architecture with three operational modes: Standard (4-wire: CLK, /CS, DI, DO), Dual (6-wire: CLK, /CS, IO0, IO1, /WP, /HOLD), and Quad (8-wire: CLK, /CS, IO0–IO3). Quad mode requires non-volatile QE bit (Status Register-2, bit 1) to be set, repurposing /WP and /HOLD as IO2 and IO3.
It features a 32,768 × 256-byte page array (8,388,608 bytes total), with erasable units of 4KB sectors (2,048 units), 32KB blocks (1,024 units), 64KB blocks (128 units), and full-chip erase. Erase/program suspend/resume and 64-bit unique ID are supported for secure firmware management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 M-bit (8 MB) - supports full MCU boot image or dual-application firmware partitioning |
| Interface Modes | Standard/Dual/Quad SPI - enables scalable bandwidth: 80 MHz single-line, 160 MHz dual, 320 MHz quad-equivalent |
| Erase Granularity | 4 KB uniform sectors - allows fine-grained parameter storage without disturbing adjacent firmware sections |
| Write Cycle Endurance | 100,000 program/erase cycles - validated for industrial temperature range (-40°C to +85°C) |
| Data Retention | 20 years at +85°C - ensures long-term reliability in unattended embedded deployments |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3 V logic domains and low-power system rails |
| Operating Temperature | -40°C to +85°C - qualified for industrial-grade control and networking equipment |
| Continuous Read Rate | 40 MB/s - achieved via wrap-mode with ≤8-clock instruction overhead, enabling true XIP execution |
Pinout & Package
W25Q64CVZEJG is packaged in an 8-pad WSON 8x6-mm (JEDEC MO-241AC, package code ZE), with exposed thermal pad. Pin 1 is marked by dot; pin numbering is counterclockwise from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable: high = high-Z outputs and standby current (~1 µA); must transition high→low after power-up before first command |
| 2 DO (IO1) | Bidirectional Data I/O 1 | Output in Standard SPI; bidirectional in Dual/Quad SPI; used for Fast Read Dual Output (3Bh) and Quad I/O instructions |
| 3 /WP (IO2) | Write Protect Input / IO2 | Hardware lock for Status Register when QE=0; becomes IO2 in Quad mode (QE=1) |
| 4 GND | Ground Reference | Primary return path for VCC and I/O signals; connects to thermal pad for thermal dissipation |
| 5 DI (IO0) | Bidirectional Data I/O 0 | Input in Standard SPI; bidirectional in Dual/Quad SPI; carries commands, addresses, and data on rising CLK edge |
| 6 CLK | Serial Clock Input | Master-generated timing signal; supports SPI Mode 0 and Mode 3; max 80 MHz for all interface modes |
| 7 /HOLD (IO3) | Hold Input / IO3 | Pauses active transaction when low (Standard/Dual only); becomes IO3 in Quad mode (QE=1) |
| 8 VCC | Power Supply | 2.7–3.6 V supply; decoupling capacitor required within 10 mm of pin for stable read/write timing |
Key Features
| Feature | Design Value |
|---|---|
| Quad Enable (QE) Bit | Non-volatile Status Register-2 bit controls permanent reassignment of /WP and /HOLD to IO2/IO3 - required for Quad SPI operation |
| Continuous Read Mode | Configurable 8/16/32/64-byte wrap with ≤8-clock address overhead - eliminates repeated instruction fetch, enabling deterministic XIP latency |
| Security Registers | Three 256-byte OTP-lockable security registers - support encrypted key storage and firmware signature verification |
| SFDP Register | Jedec-standard Serial Flash Discoverable Parameters (SFDP) table at 000000h - enables automatic driver configuration without hard-coded timing parameters |
| Erase/Program Suspend | 75h/7Ah instructions allow pausing background erase or program to service higher-priority interrupts - critical for real-time OS integration |
| Unique 64-bit ID | Factory-programmed per-device serial number readable via 4Bh instruction - enables secure device authentication and anti-cloning |
Applications
| Boot Code Storage | Firmware Update Partition |
|---|---|
Use Scenario: Storing primary bootloader and initial application firmware for ARM Cortex-M or RISC-V microcontrollers during cold start. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability; delivers instructions directly to CPU prefetch buffer via Quad SPI at ≤320 MHz equivalent rate. Use Value: Eliminates external RAM copy step; reduces boot time by >40% vs. standard SPI; supports secure boot via 64-bit ID and SFDP-configured read latency. |
Use Scenario: Isolating field-upgradable firmware images in dedicated memory regions while preserving factory calibration data. IC Role / Device Role / Timing Role: Dual-bank partitioned storage with independent 4KB sector erase - enables atomic swap between active/inactive firmware banks. Use Value: Enables zero-downtime updates; prevents corruption during power loss via sector-level granularity and suspend/resume during erase. |
| Industrial HMI Display | Network Edge Router |
Use Scenario: Hosting GUI assets (fonts, icons, bitmaps) and localized language strings for touch-based human-machine interfaces. IC Role / Device Role / Timing Role: High-bandwidth asset streaming via Continuous Read Mode with 64-byte wrap - sustains >35 MB/s throughput to display controller DMA engine. Use Value: Reduces UI rendering latency; avoids frame stutter during asset loading; leverages uniform 4KB sectors to manage versioned asset sets. |
Use Scenario: Storing boot loader, Linux kernel, root filesystem, and configuration profiles in carrier-grade access gateways. IC Role / Device Role / Timing Role: Multi-image storage with hardware write protection (/WP pin + BP bits) - prevents accidental overwrite of critical boot partitions. Use Value: Ensures field reliability across 20-year product lifecycle; supports AEC-Q100-aligned endurance testing; integrates with secure boot chains using OTP security registers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L6433FZNI-10G | 64Mb, 104MHz max clock, 1.65–2.0V or 2.7–3.6V dual-voltage support, no built-in SFDP register | Lacks SFDP auto-configuration; requires manual timing setup; supports wider voltage range but lower industrial temp rating (+85°C only) | Choose when dual-voltage operation or legacy driver compatibility is required; avoid if SFDP-driven initialization is mandatory |
| S25FL164K0XMFI010 | 64Mb, 133MHz max clock, HyperBus interface option, integrated ECC, 1.7–2.0V or 2.7–3.6V | Supports HyperBus for higher bandwidth; includes on-die ECC for NAND-like reliability; lacks /HOLD pin in SOIC variant | Prefer for high-reliability telecom applications needing ECC; not drop-in due to different pinout and optional HyperBus dependency |
Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, W25Q64CVZEJG offers best-in-class balance of Quad SPI performance, SFDP configurability, and industrial temperature support - making it optimal for cost-sensitive, XIP-driven embedded designs requiring guaranteed 20-year data retention and seamless driver integration.
Availability
W25Q64CVZEJG is available at Aetrix Electronics and suitable for industrial control panels, automotive infotainment boot storage, and network edge device firmware hosting requiring stable component supply across multi-year production cycles.
Supply support for W25Q64CVZEJG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions including NOR/NAND flash, SRAM, and mobile DRAM.
The W25Q series targets embedded systems requiring high-speed, reliable, and secure serial flash - designed specifically for code execution (XIP), firmware updates, and parameter storage in resource-constrained environments.
FAQ
What is the package type and footprint for W25Q64CVZEJG?
W25Q64CVZEJG uses an 8-pad WSON 8x6-mm package (JEDEC MO-241AC, package code ZE) with exposed thermal pad. It has a 0.5 mm pitch, and pin 1 is marked by a dot in the top-left corner. This footprint differs from the 6x5-mm ZP variant and is not interchangeable without PCB redesign.
Does W25Q64CVZEJG support Quad SPI out of the box?
No - W25Q64CVZEJG requires the Quad Enable (QE) bit in Status Register-2 to be set (via Write Status Register instruction 01h) to activate Quad SPI mode. Until QE=1, /WP and /HOLD remain functional as hardware protection pins; setting QE repurposes them as IO2 and IO3.
How does the 4KB sector architecture benefit firmware design with W25Q64CVZEJG?
The uniform 4KB sector layout in W25Q64CVZEJG enables precise, non-disruptive firmware updates - allowing individual parameter banks, calibration tables, or OTA patch segments to be erased and rewritten without affecting adjacent boot code or application binaries stored in neighboring sectors.
Can W25Q64CVZEJG operate in continuous read mode without issuing repeated read commands?
Yes - W25Q64CVZEJG supports Continuous Read Mode with configurable wrap lengths (8/16/32/64 bytes) and as few as 8 clocks of instruction overhead per address. Once initiated, sequential reads proceed automatically until /CS goes high, enabling efficient XIP and DMA streaming.
Is the 64-bit unique ID in W25Q64CVZEJG factory-programmed and permanently locked?
Yes - W25Q64CVZEJG features a factory-programmed, read-only 64-bit unique serial number accessible via instruction 4Bh. It cannot be altered or erased, providing immutable device identity for secure provisioning, license binding, and anti-counterfeiting in production systems.
W25Q64CVZEJG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- 50µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25Q64CVZEJG FAQ
1.How can I place an order for W25Q64CVZEJG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q64CVZEJG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q64CVZEJG reliable?
The price and inventory of W25Q64CVZEJG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64CVZEJG is usually 5 days.
3.What payment methods are accepted for W25Q64CVZEJG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64CVZEJG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q64CVZEJG?
W25Q64CVZEJG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q64CVZEJG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q64CVZEJG?
For technical support, including W25Q64CVZEJG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64CVZEJG requirements.
6.How does Aetrix verify that W25Q64CVZEJG is sourced from the original manufacturer or authorized distributors?
All W25Q64CVZEJG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64CVZEJG meets industry standards.
7.What is the process for return or replacement of W25Q64CVZEJG?
All W25Q64CVZEJG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64CVZEJG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q64CVZEJG part is unused and in its original packaging.
Return procedure for W25Q64CVZEJG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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