Winbond Electronics Corporation W25Q64CVZEJP TR

Overview

W25Q64CVZEJP TR from Winbond is a 64M-bit (8MB) serial NOR flash memory IC supporting standard, dual, and quad SPI interfaces with up to 80 MHz clock frequency, 4KB uniform sector architecture, and hardware write protection via /WP and /HOLD pins - used for code storage, XIP execution, and firmware parameter retention in embedded microcontroller systems.

For engineers reviewing the W25Q64CVZEJP TR datasheet, W25Q64CVZEJP TR pinout, W25Q64CVZEJP TR application, or W25Q64CVZEJP TR equivalent, key selection criteria include quad I/O enable (QE bit), 4mA active current, 1µA power-down current, JEDEC ID read capability (9Fh), and TFBGA-24 (ZE) package compatibility with 8x6-mm footprint.

Technical Context

The W25Q64CVZEJP TR implements a SPI-compatible command set with three operational modes: standard (DI/DO), dual (IO0/IO1), and quad (IO0–IO3), where quad mode requires non-volatile QE bit = 1 in Status Register-2. It supports erase granularity of 4KB sectors, 32KB blocks, 64KB blocks, and full chip, with program/erase suspend-resume functionality.

Its internal architecture includes a 256-byte page buffer, SFDP register for discoverable parameters, three 256-byte security registers with OTP locks, and 64-bit unique serial ID. The device operates across –40°C to +105°C with single 2.7–3.6V supply and features continuous read mode with ≤8-clock instruction overhead for true execute-in-place (XIP) operation.

Key Specifications

Pinout & Package

W25Q64CVZEJP TR is packaged in an 8x6-mm 24-ball TFBGA (package code ZE), with ball pitch of 0.8 mm and moisture sensitivity level (MSL) 3 per J-STD-020. Pin functions are defined per JEDEC-standard ball map.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, W25Q64CVZEJP TR offers native SFDP support, unified 3.3 V operation, and TFBGA-24 footprint optimized for high-density PCB layouts - making it preferred for cost-sensitive, space-constrained embedded designs requiring robust XIP and security features.

Availability

W25Q64CVZEJP TR is available at Aetrix Electronics and suitable for industrial automation, automotive telematics, and medical IoT applications requiring stable component supply, extended temperature range support, and long-term manufacturing continuity.

Supply support for W25Q64CVZEJP TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, serial flash, and mobile DRAM solutions for embedded and consumer markets.

The W25Q series targets high-performance, low-power serial NOR flash applications - designed specifically for code execution, firmware storage, and secure parameter retention in resource-constrained microcontroller systems.

FAQ

What is the package type and footprint of W25Q64CVZEJP TR?

W25Q64CVZEJP TR uses an 8x6-mm 24-ball TFBGA package (JEDEC MO-249, package code ZE) with 0.8 mm ball pitch and MSL3 rating. Its footprint matches standard 8x6-mm TFBGA land patterns and is distinct from SOIC, WSON, or PDIP variants of the W25Q64CV family.

Does W25Q64CVZEJP TR support Quad SPI mode out of the box?

No - W25Q64CVZEJP TR requires the Quad Enable (QE) bit in Status Register-2 to be set (via Write Status Register instruction 01h) before /WP and /HOLD pins function as IO2 and IO3. Default power-on state has QE = 0, limiting interface to standard or dual SPI until configured.

How is hardware write protection implemented on W25Q64CVZEJP TR?

W25Q64CVZEJP TR provides dual-layer hardware write protection: the /WP pin (active-low) prevents status register writes when asserted, and Block Protect (BP2–BP0), Top/Bottom (TB), and Security Register Lock (LB1–LB3) bits enable selective 4KB sector or full-array lockdown - configurable independently of /WP state.

What is the purpose of the SFDP register in W25Q64CVZEJP TR?

The SFDP (Serial Flash Discoverable Parameters) register in W25Q64CVZEJP TR (read via instruction 5Ah) contains JEDEC JESD216-compliant metadata describing erase block sizes, timing parameters, and feature support - enabling host drivers to auto-configure without hard-coded assumptions.

Can W25Q64CVZEJP TR be used for Execute-in-Place (XIP) operation?

Yes - W25Q64CVZEJP TR supports true XIP via Continuous Read Mode with ≤8-clock instruction overhead and Fast Read Quad I/O (EBh) achieving up to 320 MHz equivalent bandwidth, allowing direct CPU instruction fetch from flash without intermediate RAM copy.