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Winbond Electronics Corporation W25Q64CVZPJP

Name: W25Q64CVZPJP
Brand: Winbond Electronics Corporation
SKU: W25Q64CVZPJP
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W25Q64CVZPJP

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 8-WDFN Exposed Pad

Datasheet:: W25Q64CVZPJP.pdf

Description:: IC FLASH 64MBIT SPI/QUAD 8WSON

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Product details

Overview

W25Q64CVZPJP from Winbond is a 64M-bit (8MB) serial NOR flash memory with Dual/Quad SPI interface, organized as 32,768 pages of 256 bytes each, supporting 4KB sector, 32KB/64KB block and full-chip erase, and operating from 2.7V to 3.6V with 4mA active and <1µA power-down current. It enables XIP (execute-in-place) code execution in embedded microcontrollers and stores firmware, configuration data, and boot images.

For engineers reviewing the W25Q64CVZPJP datasheet, W25Q64CVZPJP pinout, W25Q64CVZPJP application, or W25Q64CVZPJP equivalent, key selection criteria include Quad SPI timing compliance (up to 80MHz CLK, 320MHz equivalent), hardware write protection via /WP and /HOLD pins, JEDEC ID and SFDP register support, and WSON-8 6×5-mm package compatibility with space-constrained PCB layouts.

Technical Context

The W25Q64CVZPJP implements a standard SPI Mode 0/3 interface with bidirectional IO0–IO3 pins enabled under Quad SPI operation when the non-volatile Quad Enable (QE) bit in Status Register-2 is set. Its command set includes Fast Read Quad I/O (EBh), Word Read Quad I/O (E7h), and Octal Word Read Quad I/O (E3h), enabling true continuous read with ≤8-clock instruction overhead.

It integrates 3×256-byte security registers with OTP locks, 64-bit unique serial ID, and SFDP (Serial Flash Discoverable Parameters) register for runtime configuration discovery. Erase/program suspend/resume functionality allows interruption of background operations without data loss, critical for real-time systems requiring deterministic latency.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	64 M-bit (8 MB), organized as 32,768 × 256-byte pages - enables compact firmware storage with fine-grained update granularity.
Interface Support	Standard SPI, Dual SPI (3Bh/BBh), Quad SPI (6Bh/EBh/E7h/E3h) - delivers up to 320 MHz equivalent bandwidth for high-speed code shadowing or XIP.
Erase Granularity	Uniform 4 KB sectors (2,048 total), 32 KB blocks (1,024), 64 KB blocks (128), and chip erase - supports mixed code/data partitioning and OTA update resilience.
Timing Performance	80 MHz max SPI clock; Fast Read Quad I/O achieves ~40 MB/s sustained throughput - exceeds X16 parallel flash in density-adjusted bandwidth per pin.
Power Profile	2.7–3.6 V supply; 4 mA typical active current; <1 µA power-down current - suitable for battery-backed or low-power IoT host systems.
Data Retention & Endurance	20+ years data retention; >100,000 program/erase cycles per sector - meets industrial lifecycle requirements without wear-leveling controller.
Operating Temperature	–40°C to +85°C - qualified for extended industrial ambient conditions without derating.

Pinout & Package

W25Q64CVZPJP uses an 8-pad WSON (6×5 mm) package (package code ZP), with wettable flank leads for automated optical inspection and solder joint reliability. Pin 1 is marked by a dot or beveled corner; pin numbering follows counter-clockwise order from top-left when viewed from top side.

Pin/Terminal	Circuit Role	Design Meaning
1 /CS	Chip Select Input	Active-low enable: drives DO/IOx to high-Z when high; required low-to-high transition before first instruction after power-up.
2 DO (IO1)	Data Output / Bidirectional I/O	Unidirectional output in Standard SPI; becomes IO1 in Dual/Quad SPI - supports read data streaming and bidirectional command/address transfer.
3 /WP (IO2)	Write Protect Input / Bidirectional I/O	Hardware lock for status register writes when QE=0; repurposed as IO2 in Quad SPI mode (QE=1) - requires external pull-up if unused in Quad mode.
4 GND	Ground Reference	Primary return path for VCC and all I/O signals; must be low-inductance connection to minimize noise coupling into SPI timing paths.
5 DI (IO0)	Data Input / Bidirectional I/O	Unidirectional input in Standard SPI; becomes IO0 in Dual/Quad SPI - carries instructions, addresses, and program data on rising CLK edge.
6 CLK	Serial Clock Input	Master-generated edge-triggered timing source; supports Mode 0 (CLK idle low) and Mode 3 (CLK idle high) - must meet tCH/tCL min/max per AC specs.
7 /HOLD (IO3)	Hold Input / Bidirectional I/O	Pauses ongoing SPI transaction when low (active); repurposed as IO3 in Quad SPI mode (QE=1) - enables multi-device bus sharing without arbitration logic.
8 VCC	Power Supply	2.7–3.6 V single supply; requires local 100 nF ceramic decoupling within 5 mm of pin to suppress switching noise during page program/erase.

Key Features

Feature	Design Value
Quad SPI with QE bit control	Non-volatile Quad Enable (QE) in Status Register-2 enables IO2/IO3 routing only when set - prevents accidental Quad mode entry and ensures backward compatibility with legacy SPI controllers.
Continuous Read Mode	As few as 8 clocks to initiate address access with wrap lengths of 8/16/32/64 bytes - eliminates per-byte instruction overhead, enabling true XIP with sub-100 ns effective latency per word.
Hardware + software write protection	/WP pin + BP0–BP2, TB, SEC, CMP, SRP0/SRP1 bits allow hierarchical locking of 4KB sectors or entire array - supports secure boot partitioning and field firmware integrity enforcement.
SFDP register support	JEDEC JESD216-compliant Serial Flash Discoverable Parameters table at 000000h - allows host bootloader to auto-detect timing parameters, erase sizes, and feature flags without hard-coded assumptions.
Security registers with OTP locks	Three 256-byte security registers, each protected by one-time-programmable (OTP) lock bits (LB1–LB3) - enables secure key storage, device-specific calibration data, or encrypted firmware headers.

Applications

Industrial PLC Firmware Storage	Automotive ADAS Boot Memory
Use Scenario: Storing firmware images and configuration tables for programmable logic controllers deployed in factory automation environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Primary non-volatile code storage accessed via SPI during cold boot and firmware updates; supports dual-bank OTA with sector-level erase isolation. Use Value: 4KB sector granularity enables atomic firmware patching without erasing operational control logic; 20-year data retention ensures unattended operation over equipment lifetime.	Use Scenario: Holding boot code and safety-critical sensor calibration data for automotive camera/radar ECUs requiring AEC-Q100-aligned reliability and fast startup. IC Role / Device Role / Timing Role: Boot memory mapped via XIP-capable MCU; Quad SPI interface reduces boot time by >3× vs. standard SPI, meeting ASAM boot timing constraints. Use Value: 64KB block erase aligns with ADAS firmware image boundaries; 64-bit unique ID enables per-unit traceability and cryptographic binding to vehicle VIN.
IoT Edge Gateway Configuration	Medical Device Parameter Storage
Use Scenario: Persisting network credentials, TLS certificates, and device-specific settings in battery-powered cellular gateways where write endurance and low leakage are critical. IC Role / Device Role / Timing Role: Non-volatile parameter store accessed infrequently but requiring guaranteed write completion; leverages Erase/Program Suspend to avoid interrupt latency penalties. Use Value: <1 µA power-down current extends battery life beyond 10 years; hardware /WP pin provides tamper-resistant lock against unauthorized reconfiguration.	Use Scenario: Storing FDA-mandated calibration coefficients, usage logs, and regulatory compliance metadata in portable diagnostic instruments with strict data integrity requirements. IC Role / Device Role / Timing Role: Secure parameter vault using OTP-locked security registers; SFDP register validates timing margins across production batches and temperature ranges. Use Value: Three independent 256-byte security registers with individual LB bits allow segregated storage of calibration, audit trail, and encryption keys - satisfying IEC 62304 traceability clauses.

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing firmware images and configuration tables for programmable logic controllers deployed in factory automation environments with wide temperature swings and EMI exposure.

IC Role / Device Role / Timing Role: Primary non-volatile code storage accessed via SPI during cold boot and firmware updates; supports dual-bank OTA with sector-level erase isolation.

Use Value: 4KB sector granularity enables atomic firmware patching without erasing operational control logic; 20-year data retention ensures unattended operation over equipment lifetime.

Use Scenario: Holding boot code and safety-critical sensor calibration data for automotive camera/radar ECUs requiring AEC-Q100-aligned reliability and fast startup.

IC Role / Device Role / Timing Role: Boot memory mapped via XIP-capable MCU; Quad SPI interface reduces boot time by >3× vs. standard SPI, meeting ASAM boot timing constraints.

Use Value: 64KB block erase aligns with ADAS firmware image boundaries; 64-bit unique ID enables per-unit traceability and cryptographic binding to vehicle VIN.

IoT Edge Gateway Configuration

Medical Device Parameter Storage

Use Scenario: Persisting network credentials, TLS certificates, and device-specific settings in battery-powered cellular gateways where write endurance and low leakage are critical.

IC Role / Device Role / Timing Role: Non-volatile parameter store accessed infrequently but requiring guaranteed write completion; leverages Erase/Program Suspend to avoid interrupt latency penalties.

Use Value: <1 µA power-down current extends battery life beyond 10 years; hardware /WP pin provides tamper-resistant lock against unauthorized reconfiguration.

Use Scenario: Storing FDA-mandated calibration coefficients, usage logs, and regulatory compliance metadata in portable diagnostic instruments with strict data integrity requirements.

IC Role / Device Role / Timing Role: Secure parameter vault using OTP-locked security registers; SFDP register validates timing margins across production batches and temperature ranges.

Use Value: Three independent 256-byte security registers with individual LB bits allow segregated storage of calibration, audit trail, and encryption keys - satisfying IEC 62304 traceability clauses.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MX25L6433FZNI-10G	64 M-bit, 104 MHz max CLK, SOIC-8 and WSON-8 packages; lacks SFDP register and security registers; supports only Standard/Dual SPI (no Quad I/O).	Lower-cost option where Quad SPI bandwidth and secure storage are not required; suitable for legacy SPI-only MCUs.	Select when system does not require XIP performance >20 MB/s or cryptographic key storage; verify /HOLD and /WP pin behavior matches W25Q64CVZPJP timing.
S25FL164K0XMFI010	64 M-bit, 80 MHz max CLK, WSON-8 package; includes SFDP and 256-byte secure OTP area; supports Quad SPI but requires different QE bit location (Status Register-1 bit 6).	Drop-in replacement for SFDP-aware designs; secure OTP area smaller than W25Q64CVZPJP's three 256-byte registers.	Prefer when migrating from Cypress/Spansion platforms; confirm host driver handles Status Register-1 QE bit instead of Status Register-2.

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, W25Q64CVZPJP offers superior flexibility through its triple security registers, dedicated SFDP implementation, and robust Quad SPI command set - making it optimal for new designs requiring secure, high-bandwidth, and self-describing flash memory.

Availability

W25Q64CVZPJP is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and IoT edge gateway configuration requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant WSON packaging.

Supply support for W25Q64CVZPJP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for industrial, communications, and consumer markets.

The W25Q series targets high-performance embedded systems needing reliable, pin-efficient code and data storage with advanced security and XIP capability - designed specifically for MCU-based applications where board space and power are constrained.

FAQ

What is the package type and lead finish of W25Q64CVZPJP?

W25Q64CVZPJP uses an 8-pad WSON package measuring 6 mm × 5 mm with wettable flank leads and matte tin (Sn) surface finish. The "ZP" in the part number explicitly denotes this WSON-8 6×5-mm variant, which supports automated optical inspection and meets IPC/JEDEC J-STD-020 moisture sensitivity level 3 requirements.

Does W25Q64CVZPJP support Quad SPI by default, or does it require configuration?

W25Q64CVZPJP requires explicit configuration to enable Quad SPI: the non-volatile Quad Enable (QE) bit in Status Register-2 must be set to '1' via Write Status Register (01h) instruction. Until then, /WP and /HOLD remain functional as hardware protect pins; setting QE repurposes them as IO2 and IO3, disabling hardware write protection in Quad mode.

How does W25Q64CVZPJP handle power-loss during programming or erasing?

W25Q64CVZPJP incorporates internal write/erase cycle monitoring and automatic abort-on-failure logic. If VCC drops below the write-inhibit threshold during a page program or sector erase, the operation halts and the status register reflects BUSY=0 and WEL=0. No partial writes occur - the affected sector/page remains unmodified and electrically intact.

Can W25Q64CVZPJP be used in place of older W25Q64BV parts?

Yes, W25Q64CVZPJP is a direct functional and pin-compatible upgrade to W25Q64BVZPJP, offering identical pinout, timing, and command set. Key improvements include enhanced data retention (>20 years vs. 10 years), higher endurance (>100K cycles), and added SFDP register support - all while maintaining full backward compatibility in existing PCB layouts.

What is the purpose of the 64-bit Unique ID in W25Q64CVZPJP, and how is it accessed?

The 64-bit Unique ID in W25Q64CVZPJP provides per-device serialization for traceability and cryptographic binding. It is read using the Read Unique ID Number (4Bh) instruction with a 4-byte dummy address, returning 8 bytes of factory-programmed, unalterable data - accessible regardless of status register protection or write lock states.

W25Q64CVZPJP Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: SpiFlash®

Package/Case:: 8-WDFN Exposed Pad

Packaging:: Tube

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 64Mbit

Memory Organization:: 8M x 8

Memory Interface:: SPI - Quad I/O

Clock Frequency:: 80 MHz

Write Cycle Time - Word, Page:: 50µs, 3ms

Access Time:: -

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-WSON (6x5)

W25Q64CVZPJP FAQ

1.How can I place an order for W25Q64CVZPJP through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64CVZPJP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64CVZPJP reliable?

The price and inventory of W25Q64CVZPJP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64CVZPJP is usually 5 days.

3.What payment methods are accepted for W25Q64CVZPJP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64CVZPJP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64CVZPJP?

W25Q64CVZPJP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64CVZPJP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64CVZPJP?

For technical support, including W25Q64CVZPJP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64CVZPJP requirements.

6.How does Aetrix verify that W25Q64CVZPJP is sourced from the original manufacturer or authorized distributors?

All W25Q64CVZPJP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64CVZPJP meets industry standards.

7.What is the process for return or replacement of W25Q64CVZPJP?

All W25Q64CVZPJP units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64CVZPJP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64CVZPJP part is unused and in its original packaging.

Return procedure for W25Q64CVZPJP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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