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Winbond Electronics Corporation W25Q64DWZEIG

Part No.:
W25Q64DWZEIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q64DWZEIG.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,818

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Product details

Overview

W25Q64DWZEIG from Winbond is a 1.8V, 64M-bit (8MB) serial NOR flash memory IC supporting Standard/Dual/Quad SPI and QPI interfaces. It features 32,768 pages of 256 bytes each, 4KB uniform sector erase, and operates across -40°C to +85°C. Used for code shadowing, XIP execution, and firmware storage in space-constrained embedded systems.

For engineers reviewing the W25Q64DWZEIG datasheet, W25Q64DWZEIG pinout, W25Q64DWZEIG application, or W25Q64DWZEIG equivalent, key selection criteria include 104MHz SPI clock support, Quad Enable (QE) bit configuration, 1.7–1.95V supply range, and WSON 8x6mm (ZE) package compatibility with JEDEC-standard identification and 64-bit unique ID.

Technical Context

The W25Q64DWZEIG implements a flexible SPI command architecture with mode-exclusive operation: Standard/Dual/Quad SPI and QPI are mutually exclusive, requiring explicit enable/disable instructions (38h/FFh). Its status register includes non-volatile Quad Enable (QE) bit that reassigns /WP and /HOLD to IO2/IO3 only when set.

It supports hardware write protection via active-low /WP and /HOLD pins - functional only in Standard/Dual SPI modes - and integrates four 256-byte security registers with OTP locks. Erase granularity spans 4KB sectors, 32KB blocks, 64KB blocks, and full chip, enabling fine-grained firmware partitioning.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 M-bit (8 MB), organized as 32,768 × 256-byte pages
Supply Voltage1.7 V to 1.95 V - enables low-power operation in battery-backed or energy-sensitive designs
Max SPI Clock104 MHz - delivers up to 416 MB/s effective throughput in Quad I/O mode
Erase Granularity4 KB sectors (2,048 total), 32 KB/64 KB blocks - supports modular firmware updates without full chip erase
Data Retention20 years - ensures long-term reliability for industrial and automotive firmware storage
Endurance100,000 program/erase cycles - suitable for frequent field-upgrade applications
Operating Temp-40°C to +85°C - qualified for extended industrial temperature environments
Unique ID64-bit factory-programmed serial number - enables device authentication and secure boot binding

Pinout & Package

W25Q64DWZEIG uses an 8-contact, 8×6 mm WSON package (JEDEC MO-241AC, package code ZE), with exposed pad for thermal dissipation and no internal heatsink requirement.

Pin/TerminalCircuit RoleDesign Meaning
/CSChip Select InputActive-low enable; places DO/IO pins in high-impedance state when deasserted
DO (IO1)Data Output / Bidirectional I/O1Unidirectional output in Standard SPI; bidirectional in Dual/Quad/QPI modes
/WP (IO2)Write Protect Input / Bidirectional I/O2Hardware lock for status register; repurposed as IO2 when QE=1
GNDGround ReferencePrimary return path for all I/O and core logic; requires low-impedance PCB connection
DI (IO0)Data Input / Bidirectional I/O0Unidirectional input in Standard SPI; bidirectional in Dual/Quad/QPI modes
CLKSerial Clock InputEdge-triggered timing reference for all SPI/QPI transfers; supports Mode 0 and Mode 3
/HOLD (IO3)Hold Input / Bidirectional I/O3Pauses ongoing read/write when asserted low; repurposed as IO3 when QE=1
VCCPower Supply1.7–1.95 V core supply; decoupling capacitor required per datasheet layout guidelines

Key Features

FeatureDesign Value
Quad Peripheral Interface (QPI)Reduces instruction overhead to 2 clocks per command vs. 8 in SPI, accelerating XIP startup latency
Erase/Program Suspend & ResumeEnables interruption of long erase/program operations to service time-critical interrupts without data loss
Four 256-byte Security RegistersSupports encrypted key storage and secure boot parameters with OTP locking capability
Continuous Read with WrapAllows burst reads of 8/16/32/64 bytes with automatic address wrap, optimizing sequential code fetch efficiency
Top/Bottom Sector ProtectionEnables independent hardware write-protection of boot code (top) or configuration data (bottom) regions

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing firmware images and runtime configuration data in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Non-volatile code and parameter storage with fast random access for real-time control loop initialization.

Use Value: 4KB sector erase enables incremental firmware patching without disrupting operational logic; 20-year retention ensures multi-decade deployment viability.

Use Scenario: Hosting boot code and safety-critical calibration data for radar and camera processing units in advanced driver-assistance systems.

IC Role / Device Role / Timing Role: Primary boot memory accessed during cold start, supporting XIP execution to minimize boot time.

Use Value: 104MHz Quad I/O interface achieves >300 MB/s effective read bandwidth, meeting ASIL-B timing constraints for safe boot verification.

Medical Imaging Device ConfigurationIoT Edge Gateway Firmware

Use Scenario: Storing DICOM protocol stacks, calibration profiles, and regulatory compliance logs in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for FDA-mandated audit trails and device-specific calibration parameters.

Use Value: 64-bit unique ID and OTP-locked security registers provide cryptographic binding for HIPAA-compliant data integrity validation.

Use Scenario: Holding OTA update payloads, TLS certificates, and sensor fusion algorithms in cellular-connected smart metering and environmental monitoring gateways.

IC Role / Device Role / Timing Role: Field-upgradable firmware repository with atomic sector-level write protection to prevent partial update corruption.

Use Value: Hardware /WP pin + status register BP bits allow dual-region protection: one for active firmware, one for pending update image.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX25L6433FZNI-10G3V supply (2.7–3.6V), same 64M-bit density, supports DTR mode but lacks QPIRequires level-shifting in 1.8V systems; no QPI acceleration for XIPSelect only if system uses 3V I/O and prioritizes DTR over QPI instruction efficiency
S25FL164K0XMFI0101.8V supply, 64M-bit, supports HyperBus interface (not SPI/QPI), different command setNot software-compatible; requires HyperFlash controller and PCB redesignChoose only for new designs targeting Cypress HyperBus ecosystem and higher sustained bandwidth

Compared with MX25L6433FZNI-10G and S25FL164K0XMFI010, the W25Q64DWZEIG uniquely combines 1.8V operation, QPI mode, and JEDEC-standard SPI compatibility - enabling drop-in replacement in existing Winbond-based designs while delivering best-in-class instruction efficiency for XIP-critical applications.

Availability

W25Q64DWZEIG is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging device configuration requiring stable component supply and long-term lifecycle support.

Supply support for W25Q64DWZEIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded and industrial markets.

The W25Q series was designed specifically for high-reliability, low-voltage embedded applications requiring fast XIP execution, robust security, and flexible erase architecture - targeting automotive, medical, and industrial control systems.

FAQ

What is the package type and footprint of the W25Q64DWZEIG?

The W25Q64DWZEIG uses an 8-contact, 8×6 mm WSON package (JEDEC MO-241AC, package code ZE) with exposed thermal pad. It is pin-compatible with other ZE-coded Winbond W25Q devices and requires standard reflow profile per J-STD-020. The footprint matches IPC-7351B SOON8_8X6MM_P0.80_EP4X4MM.

Does the W25Q64DWZEIG support execute-in-place (XIP) operation?

Yes, the W25Q64DWZEIG supports true XIP via Continuous Read Mode and Quad I/O instructions, achieving as few as 8 clocks to address memory and enabling efficient sequential code fetch. When configured with QE=1 and using Fast Read Quad I/O (EBh), it delivers up to 416 MB/s effective throughput - sufficient for direct execution of real-time firmware without RAM shadowing.

How is hardware write protection implemented on the W25Q64DWZEIG?

The W25Q64DWZEIG implements hardware write protection through the active-low /WP pin, which locks status register writes when asserted. This function is only available in Standard and Dual SPI modes; /WP becomes IO2 in Quad/QPI modes after QE bit is set. Combined with status register BP bits and TB/SEC flags, it enables hierarchical protection of boot sectors or configuration regions.

What is the role of the /HOLD pin on the W25Q64DWZEIG?

The /HOLD pin on the W25Q64DWZEIG pauses ongoing SPI transactions (read/write/erase) while /CS remains low, placing DO in high-impedance and ignoring DI/CLK edges. It is active-low and only functional in Standard and Dual SPI modes - disabled when QE=1 since /HOLD becomes IO3. This allows bus sharing with other SPI peripherals without interrupting internal operations.

Can the W25Q64DWZEIG be used in automotive applications?

Yes, the W25Q64DWZEIG is rated for -40°C to +85°C operation and meets AEC-Q100 stress test requirements for Grade 3 temperature range. Its 20-year data retention, 100,000 endurance cycles, and hardware security features (64-bit UID, OTP-locked security registers) make it suitable for automotive infotainment boot memory and ADAS calibration storage where functional safety and long-term reliability are critical.

W25Q64DWZEIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
3ms
Access Time:
-
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25Q64DWZEIG FAQ

1.How can I place an order for W25Q64DWZEIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64DWZEIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64DWZEIG reliable?

The price and inventory of W25Q64DWZEIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64DWZEIG is usually 5 days.

3.What payment methods are accepted for W25Q64DWZEIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64DWZEIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64DWZEIG?

W25Q64DWZEIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64DWZEIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64DWZEIG?

For technical support, including W25Q64DWZEIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64DWZEIG requirements.

6.How does Aetrix verify that W25Q64DWZEIG is sourced from the original manufacturer or authorized distributors?

All W25Q64DWZEIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64DWZEIG meets industry standards.

7.What is the process for return or replacement of W25Q64DWZEIG?

All W25Q64DWZEIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64DWZEIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64DWZEIG part is unused and in its original packaging.

Return procedure for W25Q64DWZEIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q64DWZEIG Tags

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