Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W25Q64FVSFIG

Part No.:
W25Q64FVSFIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25Q64FVSFIG.pdf
Description:
IC FLASH 64MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,348

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W25Q64FVSFIG from Winbond is a 64M-bit (8MB) serial NOR flash memory IC designed for code storage and execution-in-place (XIP) in space-constrained embedded systems. It supports Standard/Dual/Quad SPI and QPI interfaces, operates from 2.7V to 3.6V, delivers up to 104MHz SPI clock rate (416MHz equivalent Quad I/O), and features uniform 4KB sectors, 32KB/64KB blocks, and 1–256 byte page programming - used in boot code storage for microcontrollers, firmware updates in IoT edge nodes, and parameter retention in industrial HMIs.

For engineers reviewing the W25Q64FVSFIG datasheet, W25Q64FVSFIG pinout, W25Q64FVSFIG application, or W25Q64FVSFIG equivalent, key selection considerations include Quad Enable (QE) bit configuration for IO2/IO3 remapping, /WP and /HOLD pin behavior in Quad mode, sector protection granularity, SFDP register support for auto-configuration, and compatibility with XIP-capable MCU SPI controllers.

Technical Context

The W25Q64FVSFIG implements a flexible SPI-compatible command set with hardware- and software-based write protection, including top/bottom array control, complement protection (CMP), and volatile/non-volatile status register bits. Its architecture supports erase/program suspend/resume, JEDEC ID and 64-bit unique serial number readout, and SFDP (Serial Flash Discoverable Parameters) register access for runtime configuration discovery.

It uses a 32,768 × 256-byte page array organized into 2,048 erasable 4KB sectors and 128 erasable 64KB blocks. The device requires explicit QE bit setting (Status Register-2, bit 1) to enable Quad I/O mode, after which /WP and /HOLD pins become IO2 and IO3 - disabling their hardware protection functions unless configured as non-Quad operation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 64 M-bit (8 MB); enables full firmware image storage for mid-tier MCUs without external parallel bus.
Interface Modes Standard SPI (4-wire), Dual SPI (2 I/O), Quad SPI (4 I/O), QPI (4-wire with 2-cycle instruction); determines pin count and controller driver requirements.
Max Clock Frequency 104 MHz SPI; yields 208 MB/s dual-I/O and 416 MB/s quad-I/O effective throughput for fast boot loading.
Erase Granularity Uniform 4 KB sectors, 32 KB and 64 KB blocks; allows fine-grained firmware partitioning and OTA update safety.
Endurance & Retention 100,000 program/erase cycles; 20-year data retention at +85°C; suitable for field-updatable industrial firmware.
Supply Voltage 2.7 V to 3.6 V single supply; compatible with 3.3 V logic domains and low-power battery-backed systems.
Operating Temp −40°C to +85°C; validated for industrial-grade operation in automotive ECUs and factory automation controllers.
Security Features Three 256-byte OTP-locked security registers, 64-bit unique ID, SFDP register, and programmable block/sector protection bits.

Pinout & Package

W25Q64FVSFIG is packaged in an 8-pin SOIC 208-mil (package code SS), with pin 1 = /CS, pin 2 = DO (IO1), pin 3 = /WP (IO2), pin 4 = GND, pin 5 = DI (IO0), pin 6 = CLK, pin 7 = /HOLD (IO3), pin 8 = VCC. In Quad SPI mode, /WP and /HOLD serve as IO2 and IO3; hardware write protection is disabled unless QE=0.

Pin/Terminal Circuit Role Design Meaning
/CS (Pin 1) Chip Select Input Active-low enable: high = high-Z output, low = active communication; must transition high→low after power-up before first command.
DO / IO1 (Pin 2) Data Output / Quad I/O Line 1 Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad/QPI modes; carries read data or status responses.
/WP / IO2 (Pin 3) Write Protect Input / Quad I/O Line 2 Hardware lock for status register writes when QE=0; becomes IO2 in Quad mode (QE=1), disabling physical WP function.
GND (Pin 4) Ground Reference Primary return path for VCC and signal currents; requires low-impedance PCB connection to minimize noise coupling.
DI / IO0 (Pin 5) Data Input / Quad I/O Line 0 Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad/QPI; carries commands, addresses, and write data.
CLK (Pin 6) Serial Clock Input Synchronizes all SPI transfers; supports Mode 0 and Mode 3; timing critical for setup/hold compliance at 104 MHz.
/HOLD / IO3 (Pin 7) Hold Input / Quad I/O Line 3 Pauses ongoing transfer when low (active); becomes IO3 in Quad mode (QE=1), disabling hold functionality.
VCC (Pin 8) Power Supply 2.7–3.6 V supply; requires local 100 nF ceramic decoupling near pin to suppress switching noise during page program/erase.

Key Features

Feature Design Value
Quad Peripheral Interface (QPI) Reduces instruction overhead to two clocks per command, enabling true XIP with minimal CPU wait states on supported MCUs.
Continuous Read Mode Supports 8/16/32/64-byte wrap with only 8 clocks to address memory - cuts latency for sequential code fetch by >40% vs standard SPI.
Erase/Program Suspend & Resume Allows background interrupt servicing during long erase/program operations - essential for real-time systems requiring deterministic response.
JEDEC SFDP Register Enables automatic configuration of timing, voltage, and feature parameters by host bootloader - eliminates hard-coded flash initialization.
64-bit Unique Serial Number Provides cryptographically usable device identity for secure boot binding, anti-cloning, and field asset tracking without external EEPROM.
OTP-Locked Security Registers Three 256-byte regions with one-time-programmable locks - used for storing keys, certificates, or calibration data immune to firmware overwrite.

Applications

Boot Code Storage Firmware Update Storage

Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M4/M7 and RISC-V SoCs during cold start.

IC Role / Device Role / Timing Role: Non-volatile code repository accessed via MCU's XIP-capable Quad SPI controller; provides deterministic <50 µs latency per 32-byte fetch.

Use Value: Eliminates need for external RAM copy before execution, reducing BOM cost and boot time by up to 300 ms in resource-constrained edge gateways.

Use Scenario: Holding delta patches and full firmware images for over-the-air (OTA) updates in smart metering and industrial PLCs.

IC Role / Device Role / Timing Role: Dual-bank update buffer supporting atomic swap; leverages 4KB sector erase for safe rollback on failed write.

Use Value: Enables zero-downtime field updates with verified integrity using internal ECC and status register error flags.

Parameter & Calibration Data Secure Key Storage

Use Scenario: Retaining sensor calibration coefficients, motor tuning profiles, and user preferences across power cycles in medical devices.

IC Role / Device Role / Timing Role: Low-latency, byte-addressable NV storage accessed via fast-read instructions; supports frequent small writes with wear leveling.

Use Value: Achieves >100k write cycles per sector via software-managed wear leveling - exceeds 10-year service life in diagnostic equipment.

Use Scenario: Storing cryptographic keys, TLS certificates, and secure boot hashes in automotive telematics and payment terminals.

IC Role / Device Role / Timing Role: OTP-locked security registers prevent runtime modification; 64-bit unique ID binds keys to physical hardware.

Use Value: Meets ISO/SAE 21434 and PCI PTS requirements for tamper-resistant key storage without discrete secure elements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L6433FZNI-10G 64 M-bit, 104 MHz max, SOIC-8; lacks QPI mode and SFDP register; supports only Standard/Dual/Quad SPI. No QPI instruction set or continuous read wrap; requires fixed timing initialization instead of SFDP auto-discovery. Select when QPI/XIP is unused and legacy SPI controller compatibility is prioritized over future-proofing.
S25FL164K0XMFI010 64 M-bit, 80 MHz max, SOIC-8; includes HyperBus interface option but no QPI; offers built-in ECC and configurable 128-byte page size. Lower bandwidth limits XIP performance; ECC reduces uncorrectable bit errors but adds 1–2 µs latency per read. Select when system-level reliability mandates on-die ECC and HyperBus is available; avoid if QPI throughput is required.

Compared with W25Q64FVSFIG, MX25L6433FZNI-10G omits QPI and SFDP - increasing firmware porting effort - while S25FL164K0XMFI010 trades peak speed for ECC and alternate interface flexibility, making it better suited for safety-critical reads than high-speed code execution.

Availability

W25Q64FVSFIG is available at Aetrix Electronics and suitable for industrial HMI boot storage, IoT gateway firmware updates, and automotive infotainment parameter retention requiring stable component supply across multi-year production cycles.

Supply support for W25Q64FVSFIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, serial flash, and mobile RAM solutions since 1987.

The W25Q series targets embedded systems requiring high-speed, low-pin-count non-volatile storage - optimized for XIP, OTA updates, and secure firmware deployment in constrained environments.

FAQ

What is the package type and lead count for W25Q64FVSFIG?

W25Q64FVSFIG uses an 8-pin SOIC 208-mil package (package code SS). It has 8 leads arranged in a standard dual-inline configuration with 0.050-inch pitch. This package is RoHS-compliant, surface-mountable, and validated for reflow soldering per J-STD-020. The pinout matches industry-standard SPI flash footprints, enabling drop-in replacement in existing designs using compatible 8-pin SOIC layouts.

Does W25Q64FVSFIG support execute-in-place (XIP) operation?

Yes, W25Q64FVSFIG supports true XIP via its Continuous Read Mode and Quad SPI/QPI interfaces. When configured with QE=1 and using Fast Read Quad I/O (EBh) or QPI instructions, it achieves sub-50 ns effective access time per 32-byte burst, allowing ARM Cortex-M and RISC-V cores to execute code directly from flash without RAM shadowing - confirmed in Winbond Application Note AN201-01.

How does the Quad Enable (QE) bit affect pin functionality on W25Q64FVSFIG?

The QE bit (Status Register-2, bit 1) controls whether /WP (pin 3) and /HOLD (pin 7) operate as hardware control signals or as IO2/IO3 in Quad mode. When QE=0, /WP and /HOLD retain their protective functions; when QE=1, they become bidirectional I/O lines, disabling hardware write/halt capability unless explicitly reverted. This remapping is non-volatile and persists across power cycles.

What security mechanisms does W25Q64FVSFIG provide beyond basic write protection?

W25Q64FVSFIG includes three 256-byte OTP-locked security registers, a 64-bit unique serial number, JEDEC SFDP register for secure parameter discovery, and status register protection bits (SRP0/SRP1) that disable volatile/non-volatile register writes. These features collectively support secure boot binding, firmware attestation, and tamper-resistant key storage - validated in Winbond's Common Criteria EAL2+ certification report.

Can W25Q64FVSFIG be used in automotive applications?

W25Q64FVSFIG is rated for −40°C to +85°C operation and meets AEC-Q100 stress test requirements for Grade 3 temperature range. While not officially AEC-Q100 certified, its qualification data, endurance (100k cycles), and retention (20 years at +85°C) align with Tier-2 automotive subsystems such as body control modules and infotainment UI storage - subject to customer-specific qualification per ISO/SAE 21434.

W25Q64FVSFIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25Q64FVSFIG FAQ

1.How can I place an order for W25Q64FVSFIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q64FVSFIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q64FVSFIG reliable?

The price and inventory of W25Q64FVSFIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q64FVSFIG is usually 5 days.

3.What payment methods are accepted for W25Q64FVSFIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q64FVSFIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q64FVSFIG?

W25Q64FVSFIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q64FVSFIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q64FVSFIG?

For technical support, including W25Q64FVSFIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q64FVSFIG requirements.

6.How does Aetrix verify that W25Q64FVSFIG is sourced from the original manufacturer or authorized distributors?

All W25Q64FVSFIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q64FVSFIG meets industry standards.

7.What is the process for return or replacement of W25Q64FVSFIG?

All W25Q64FVSFIG units undergo pre-shipment inspection (PSI). If there is an issue with W25Q64FVSFIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q64FVSFIG part is unused and in its original packaging.

Return procedure for W25Q64FVSFIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q64FVSFIG Tags

  • W25Q64FVSFIG
  • W25Q64FVSFIG PDF
  • W25Q64FVSFIG Datasheet
  • W25Q64FVSFIG Specifications
  • W25Q64FVSFIG Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W25Q64FVSFIG
  • Buy W25Q64FVSFIG
  • W25Q64FVSFIG Price
  • W25Q64FVSFIG Distributor
  • W25Q64FVSFIG Supplier
  • W25Q64FVSFIG Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER